UPD75218 NEC, UPD75218 Datasheet - Page 57

• Manufacturer Part Number: UPD75218
• Description: 4-BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC

15. RECOMMENDED SOLDERING CONDITIONS
Manual (IEI-1207).
different conditions.
Note
Caution Do not apply more than a single process at once, except for "Partial heating method."
Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does not
PD75218GF-
PD75218CW-
The following conditions (see table below) must be met when soldering this product.
For the details of the recommended soldering conditions refer to our document SMD Surface Mount Technology
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
Wave soldering
Infrared ray reflow
VPS
Partial heating method
Soldering process
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ˚C and maximum relative humidity at 65 % or less
Other versions of the products are available. For these versions, the recommended reflow
soldering conditions have been mitigated as follows:
Higher peak temperature (235 C), two-stage, and longer exposure limit.
Contact an NEC representative for details.
contact the main body of the package.
Notice
Wave soldering (only for leads)
Partial heating method
-3BE: 64-pin plastic QFP (14
: 64-pin plastic shrink DIP (750 mil)
Soldering process
Table 15-1 Soldering Conditions for Surface-Mount Devices
Peak package’s surface temperature: 230 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or more)
Number of reflow processes: 1
Exposure limit
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or more)
Number of reflow processes: 1
Exposure limit
Terminal temperature: 300 ˚C or less
Flow time: 3 seconds or less (one side per device)
Temperature in the soldering vessel: 260 ˚C or less
Soldering time: 10 seconds or less
Number of soldering processes: 1
Pre-heating temperature: 120 ˚C max.
Exposure limit
Table 15-2 Soldering Conditions for Inserted Devices
(20 hours of pre-baking is required at 125 ˚C afterward.)
(20 hours of pre-baking is required at 125 ˚C afterward.)
(package surface temperature)
(20 hours of pre-baking is required at 125 ˚C afterward.)
Note
Note
Note
: 2 days
: 2 days
: 2 days
Soldering conditions
20 mm)
Temperature in the soldering vessel: 260 C or less
Soldering time: 10 seconds or less
Terminal temperature: 260 C or less
Flow time: 10 seconds or less
Soldering conditions
WS60-202-1
VP15-202-1
IR30-202-1
Symbol
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PD75218
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