SBT-BGA-7000 Ironwood Electronics, SBT-BGA-7000 Datasheet

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SBT-BGA-7000

Manufacturer Part Number
SBT-BGA-7000
Description
Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Siz
Manufacturer
Ironwood Electronics
Datasheet
1.SBT-BGA-7000.pdf (4 pages)
Description: SBT-BGA-7000 Exploded View
( 12x12mm, 0.5mm pitch, 22x22 array BGA)
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
8
15
9
10
13
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: (800) 404-0204
SBT-BGA-7000 Drawing
BURN-IN AND TEST APPLICATIONS
WEIGHT:
MATERIAL:
FINISH:
12
11
3
14
5
1
2
7
6
4
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-7000 Dwg
Features
•
•
•
•
•
•
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable
production yield
Highly compliant to accommodate wide co-planarity
variations
Automated probe manufacturing enables low cost
and short lead time
ITEM
NO.
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
SBT-BGA 0.5mm pin
0-80 Shoulder screw
Compression Screw
Middle Pogo Guide
Compression Plate
Pogo Guide Screw
Socket Base Cap
BGA with 484 pin
with 0.5mm Pitch
Insulation Plate
Floating Guide
Bottom Guide
Backing Plate
Socket Base
Target PCB
Description
Socket Lid
Screw
AISI 321 Annealed Stainless Steel (SS)
SHEET 1 OF 4
SCALE: 1:1
DATE: 5/13/2009
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
PEEK Ceramic filled
PEEK Ceramic filled
PEEK Ceramic filled
18-8 stainless steel
7075-T6 Aluminuim
Alloy Steel
Material
FR4
FR4
REV. A
/QTY
View
Full
484
1
1
1
1
1
1
4
4
1
1
1
1
1
4
.

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SBT-BGA-7003
Part Number:
SBT-BGA-7003
Description:
Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Siz
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Datasheet:
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SBT-BGA-6002
Part Number:
SBT-BGA-6002
Description:
Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
Manufacturer:
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Datasheet:
SBT-BGA-6002.pdf (4 pages)
SBT-BGA-7003
Part Number:
SBT-BGA-7003
Description:
Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Siz
Manufacturer:
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Datasheet:
SBT-BGA-7003.pdf (4 pages)
SBT-BGA-6002
Part Number:
SBT-BGA-6002
Description:
Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
Manufacturer:
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Datasheet:
SBT-BGA-6002.pdf (4 pages)

SBT-BGA-7000 Summary of contents

Page 1

... Description: SBT-BGA-7000 Exploded View ( 12x12mm, 0.5mm pitch, 22x22 array BGA) Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ± ...

Page 2

... Non-Plated Hole 5.2500 14.7250 Description: SBT-BGA-7000 Recommended PCB layout Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ± ...

Page 3

... Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 0.1 Z 0.08 Z STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-7000 Dwg 22x22 Full Array DIM Minimum Maximum A 2.5 A1 0.2 0 ...

Page 4

... Materials and specifications are subject to change without notice. SBT-BGA-7000 Drawing Ironwood Electronics, Inc. WEIGHT: Tele: (800) 404-0204 MATERIAL: www.ironwoodelectronics.com FINISH 1.5900 14.7250 19.7250 Insulation Plate Specification STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-7000 Dwg SBT Pin Scale 25:1 1.7000 (x4) 1.5900 SHEET REV. A SCALE: 2:1 DATE: 5/13/2009 ...

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