BU4525DW Philips Semiconductors, BU4525DW Datasheet
BU4525DW
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BU4525DW Summary of contents
Page 1
... July 1998 CONDITIONS ˚ 9 2. kHz kHz 9.0 A kHz Csat kHz PIN CONFIGURATION CONDITIONS ˚ Objective specification BU4525DW TYP. MAX. UNIT - 1500 V - 800 125 W - 3 t.b 2.2 V 0.4 0.55 s t.b.f t.b.f ...
Page 2
... 9.0 A;I = 2.25A 9.0 A;I = 2.25A 1 9 CONDITIONS MHz 9.0 A;I = 1.8 A Csat -4 t.b.f Csat 2 Objective specification BU4525DW TYP. MAX. UNIT - 1 K K/W MIN. TYP. MAX. UNIT - - 1 2.0 mA 7.5 13 800 - - - - 3.0 0.96 1.01 1.06 - t.b.f - 4.2 5.8 7 ...
Page 3
... Net Mass 3.5 21 max 4.0 max 15.5 min 2.2 max 3.2 max Notes 1. Refer to mounting instructions for SOT429 envelope. 2. Epoxy meets UL94 V0 at 1/8". July 1998 16 max 1.8 5.3 7.3 seating 15.5 max plane 2 1.1 0.4 M 5.45 5.45 Fig.1. SOT429; pin 2 connected to mounting base. 3 Objective specification BU4525DW 5.3 max o 3.5 max 0.9 max Rev 1.000 ...
Page 4
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 4 Objective specification BU4525DW Rev 1.000 ...