IC FLIP FLOP DUAL DTYPE 14SOIC

HEF4013BT,653

Manufacturer Part NumberHEF4013BT,653
DescriptionIC FLIP FLOP DUAL DTYPE 14SOIC
ManufacturerNXP Semiconductors
Series4000B
TypeD-Type
HEF4013BT,653 datasheets
 

Specifications of HEF4013BT,653

Package / Case14-SOIC (3.9mm Width), 14-SOLFunctionSet(Preset) and Reset
Output TypeDifferentialNumber Of Elements2
Number Of Bits Per Element1Frequency - Clock40MHz
Trigger TypePositive EdgeCurrent - Output High, Low3.4mA, 3.4mA
Voltage - Supply3 V ~ 15 VOperating Temperature-40°C ~ 125°C
Mounting TypeSurface MountNumber Of Circuits2
Logic FamilyHEF4000Logic TypeD-Type Edge Triggered Flip-Flop
PolarityInverting/Non-InvertingInput TypeSingle-Ended
Propagation Delay Time30 ns at 15 VHigh Level Output Current- 4.2 mA
Low Level Output Current4.2 mASupply Voltage (max)15.5 V
Maximum Operating Temperature+ 125 CMounting StyleSMD/SMT
Minimum Operating Temperature- 40 CSupply Voltage (min)4.5 V
Lead Free Status / RoHS StatusLead free / RoHS CompliantDelay Time - Propagation-
Other names933372660653
HEF4013BTD-T
HEF4013BTD-T
  
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HEF4013B
Dual D-type flip-flop
Rev. 06 — 27 October 2009
1. General description
The HEF4013B is a dual D-type flip-flop that features independent set-direct input (SD),
clear-direct input (CD), clock input (CP) and outputs (Q, Q). Data is accepted when CP is
LOW and is transferred to the output on the positive-going edge of the clock. The active
HIGH asynchronous CD and SD inputs are independent and override the D or CP inputs.
The outputs are buffered for best system performance. The clock input’s Schmitt-trigger
action makes the circuit highly tolerant of slower clock rise and fall times.
It operates over a recommended V
(usually ground). Unused inputs must be connected to V
device is suitable for use over both the industrial ( 40 C to +85 C) and automotive
( 40 C to +125 C) temperature ranges.
2. Features
I
Tolerant of slow clock rise and fall times
I
Fully static operation
I
5 V, 10 V, and 15 V parametric ratings
I
Standardized symmetrical output characteristics
I
Operates across the automotive temperature range from 40 C to +125 C
I
Complies with JEDEC standard JESD 13-B
3. Applications
I
Automotive and industrial
I
Counters and dividers
I
Registers
I
Toggle flip-flops
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +125 C
Type number
Package
Name
HEF4013BP
DIP14
HEF4013BT
SO14
HEF4013BTT
TSSOP14
power supply range of 3 V to 15 V referenced to V
DD
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads; body width 3.9 mm
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
Product data sheet
, V
, or another input. The
DD
SS
Version
SOT27-1
SOT108-1
SOT402-1
SS

HEF4013BT,653 Summary of contents

  • Page 1

    HEF4013B Dual D-type flip-flop Rev. 06 — 27 October 2009 1. General description The HEF4013B is a dual D-type flip-flop that features independent set-direct input (SD), clear-direct input (CD), clock input (CP) and outputs (Q, Q). Data is accepted when ...

  • Page 2

    ... NXP Semiconductors 5. Functional diagram Fig 1. Functional diagram Fig 2. Logic diagram (one flip-flop) HEF4013B_6 Product data sheet 6 1SD FF1 3 2 1CP 1CD 8 2SD FF2 11 12 2CP 2CD 001aag084 Rev. 06 — 27 October 2009 HEF4013B Dual D-type flip-fl 001aag086 © NXP B.V. 2009. All rights reserved. ...

  • Page 3

    ... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin 1Q 1Q 1CP, 2CP 3, 11 1CD, 2CD 1SD, 2SD Functional description [1] Table 3. Function table Control nSD nCD [ HIGH voltage level LOW voltage level don’t care; ...

  • Page 4

    ... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current OK I input/output current I/O I supply current ...

  • Page 5

    ... NXP Semiconductors 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions V HIGH-level I < input voltage V LOW-level I < input voltage V HIGH-level I < output voltage V LOW-level I < output voltage I HIGH-level output current LOW-level output current V = 0.5 V ...

  • Page 6

    ... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics unless otherwise specified. For test circuit see amb Symbol Parameter Conditions t HIGH to LOW nCP to nQ, nQ; PHL propagation delay see nSD to nQ nCD LOW to HIGH nCP to nQ, nQ; PLH propagation delay see nSD to nQ nCD to nQ ...

  • Page 7

    ... NXP Semiconductors Table 7. Dynamic characteristics unless otherwise specified. For test circuit see amb Symbol Parameter Conditions t recovery time nSD input; rec see nCD input; see f maximum clock see clk(max) frequency [1] Typical values of the propagation delays and output transition times can be calculated with the extrapolation formulas. C Table 8 ...

  • Page 8

    ... NXP Semiconductors V input nCP input nSD input nCD output Recovery times are shown as positive values but may be specified as negative values. Measurement points are given in Fig 5. nSD, nCD recovery time and pulse width Table 9. Measurement points Supply voltage Input 0.5V DD Test and measurement data is given in Defi ...

  • Page 9

    ... NXP Semiconductors 13. Application information clock Fig 7. N-stage shift register clock Fig 8. Binary ripple up-counter; divide-by-2 clock Fig 9. Modified ring counter; divide-by-( HEF4013B_6 Product data sheet T-type flip-flop Rev. 06 — 27 October 2009 HEF4013B Dual D-type flip-fl 001aag089 001aag090 001aag091 © NXP B.V. 2009. All rights reserved. ...

  • Page 10

    ... NXP Semiconductors 14. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...

  • Page 11

    ... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

  • Page 12

    ... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

  • Page 13

    ... NXP Semiconductors 15. Revision history Table 11. Revision history Document ID Release date HEF4013B_6 20091027 • Modifications: Table 5 “Recommended operating conditions” HEF4013B_5 20090619 HEF4013B_4 20080515 HEF4013B_CNV_3 19950101 HEF4013B_CNV_2 19950101 HEF4013B_6 Product data sheet Data sheet status Change notice Product data sheet - Product data sheet ...

  • Page 14

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 15

    ... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Application information Package outline ...