MC14013BCPG ON Semiconductor, MC14013BCPG Datasheet

MC14013BCPG

Manufacturer Part Number

MC14013BCPG

Description

IC FLIP FLOP DUAL TYPE D 14DIP

Manufacturer

ON Semiconductor

Series

4000Br

Type

D-Typer

Datasheets

1.MC14013BCPG.pdf (9 pages)

2.MC14013BDG.pdf (6 pages)

Specifications of MC14013BCPG

Function

Set(Preset) and Reset

Output Type

Differential

Number Of Elements

Number Of Bits Per Element

Frequency - Clock

14MHz

Delay Time - Propagation

50ns

Trigger Type

Positive Edge

Voltage - Supply

3 V ~ 18 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Through Hole

Package / Case

14-DIP (0.300", 7.62mm)

Number Of Circuits

Logic Family

MC140

Logic Type

D-Type Flip-Flop

Polarity

Inverting/Non-Inverting

Input Type

Single-Ended

Propagation Delay Time

350 ns

High Level Output Current

- 4.2 mA

Low Level Output Current

4.2 mA

Supply Voltage (max)

18 V

Maximum Operating Temperature

+ 125 C

Mounting Style

Through Hole

Minimum Operating Temperature

- 55 C

Supply Voltage (min)

3 V

Circuit Type

Low-Power Schottky

Current, Supply

120 μA

Function Type

D-Type

Logic Function

Flip-Flop

Package Type

PDIP-14

Temperature, Operating, Range

-55 to +125 °C

Voltage, Supply

3 to 18 VDC

Technology

CMOS

Number Of Bits

Number Of Elements

Clock-edge Trigger Type

Positive-Edge

Operating Supply Voltage (typ)

3.3/5/9/12/15V

Frequency (max)

7MHz

Operating Supply Voltage (min)

Operating Supply Voltage (max)

18V

Operating Temp Range

-55C to 125C

Operating Temperature Classification

Military

Mounting

Through Hole

Pin Count

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current - Output High, Low

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

MC14013BCPGOS

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC14013BCPG

Manufacturer:

Quantity:

3 491

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC14013BCPG

Manufacturer:

Quantity:

517

Company:

Meier Automation Equipment Co., Limited

Part Number:

MC14013BCPG

Manufacturer:

ON/安森美

Quantity:

20 000

Current page: 1 of 6
Download datasheet (139Kb)

MC14013B

Dual Type D Flip−Flop

P−channel and N−channel enhancement mode devices in a single

monolithic structure. Each flip−flop has independent Data, (D), Direct

Set, (S), Direct Reset, (R), and Clock (C) inputs and complementary

outputs (Q and Q). These devices may be used as shift register

elements or as type T flip−flops for counter and toggle applications.

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Temperature Derating:

static voltages or electric fields. However, precautions must be taken to avoid

applications of any voltage higher than maximum rated voltages to this

high−impedance circuit. For proper operation, V

to the range V

(e.g., either V

MAXIMUM RATINGS

Symbol

The MC14013B dual type D flip−flop is constructed with MOS

This device contains protection circuitry to guard against damage due to high

Unused inputs must always be tied to an appropriate logic voltage level

low; information is transferred to the output only on the

positive−going edge of the clock pulse

Schottky TTL Load Over the Rated Temperature Range

Static Operation

Diode Protection on All Inputs

Supply Voltage Range = 3.0 Vdc to 18 Vdc

Logic Edge−Clocked Flip−Flop Design

Logic state is retained indefinitely with clock level either high or

Capable of Driving Two Low−power TTL Loads or One Low−power

Pin−for−Pin Replacement for CD4013B

Pb−Free Packages are Available

Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C

, V

, I

stg

out

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input or Output Current

(DC or Transient) per Pin

Power Dissipation, per Package

(Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature

(8−Second Soldering)

or V

v (V

). Unused outputs must be left open.

Parameter

or V

(Voltages Referenced to V

out

) v V

and V

−0.5 to V

−0.5 to +18.0

−55 to +125

−65 to +150

out

)

Value

± 10

500

260

should be constrained

+ 0.5

Unit

°C

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

(Note: Microdot may be in either location)

ORDERING INFORMATION

WL, L

YY, Y

WW, W

G or G

CASE 948G

CASE 751A

SOEIAJ−14

TSSOP−14

DT SUFFIX

CASE 646

CASE 965

P SUFFIX

D SUFFIX

F SUFFIX

PDIP−14

SOIC−14

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

Publication Order Number:

MC14013BCP

DIAGRAMS

AWLYYWWG

MARKING

MC14013B

AWLYWW

MC14013B/D

ALYWG

14013BG

ALYW G

013B

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MC14013BCPG Summary of contents

Page 1

MC14013B Dual Type D Flip−Flop The MC14013B dual type D flip−flop is constructed with MOS P−channel and N−channel enhancement mode devices in a single monolithic structure. Each flip−flop has independent Data, (D), Direct Set, (S), Direct Reset, (R), and Clock ...

Page 2

... ORDERING INFORMATION Device MC14013BCP MC14013BCPG MC14013BD MC14013BDG MC14013BDR2 MC14013BDR2G MC14013BDTR2 MC14013BDTR2G MC14013BF MC14013BFG MC14013BFEL MC14013BFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. ...

Page 3

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 4

SWITCHING CHARACTERISTICS Î Î Î Î Î ...

Page 5

−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, ...

Page 6

... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...

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