MC14013BCPG ON Semiconductor, MC14013BCPG Datasheet - Page 7

• Manufacturer Part Number: MC14013BCPG
• Description: IC FLIP FLOP DUAL TYPE D 14DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: D-Typer

Specifications of MC14013BCPG

• Function: Set(Preset) and Reset
• Output Type: Differential
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Frequency - Clock: 14MHz
• Delay Time - Propagation: 50ns
• Trigger Type: Positive Edge
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Number Of Circuits: 2
• Logic Family: MC140
• Logic Type: D-Type Flip-Flop
• Polarity: Inverting/Non-Inverting
• Input Type: Single-Ended
• Propagation Delay Time: 350 ns
• High Level Output Current: - 4.2 mA
• Low Level Output Current: 4.2 mA
• Supply Voltage (max): 18 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 55 C
• Supply Voltage (min): 3 V
• Circuit Type: Low-Power Schottky
• Current, Supply: 120 μA
• Function Type: D-Type
• Logic Function: Flip-Flop
• Package Type: PDIP-14
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Technology: CMOS
• Number Of Bits: 2
• Number Of Elements: 2
• Clock-edge Trigger Type: Positive-Edge
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Frequency (max): 7MHz
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC14013BCPGOS

SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
B
7X
7
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_