IC FLIP FLOP D HEX CMOS 16DIP

MC14174BCPG

Manufacturer Part NumberMC14174BCPG
DescriptionIC FLIP FLOP D HEX CMOS 16DIP
ManufacturerON Semiconductor
Series4000B
TypeD-Type Bus
MC14174BCPG datasheets
 


Specifications of MC14174BCPG

FunctionResetOutput TypeInverted
Number Of Elements1Number Of Bits Per Element6
Frequency - Clock15.5MHzDelay Time - Propagation65ns
Trigger TypePositive EdgeCurrent - Output High, Low8mA, 8mA
Voltage - Supply3 V ~ 18 VOperating Temperature-55°C ~ 125°C
Mounting TypeThrough HolePackage / Case16-DIP (0.300", 7.62mm)
Number Of Circuits7Logic FamilyMC14
Logic TypeD-Type Flip-FlopPolarityNon-Inverting
Input TypeSingle-EndedPropagation Delay Time400 ns
High Level Output Current- 4.2 mALow Level Output Current4.2 mA
Supply Voltage (max)18 VMaximum Operating Temperature+ 125 C
Mounting StyleThrough HoleMinimum Operating Temperature- 55 C
Supply Voltage (min)3 VCircuit TypeLow-Power Schottky
Current, Supply600 μAFunction Type6-Channels, D-Type
Logic FunctionFlip-FlopPackage TypePDIP-16
Special FeaturesBuffered OutputTemperature, Operating, Range-55 to +125 °C
Voltage, Supply3 to 18 VDCLead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesMC14174BCPGOS  
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
Page 1/5

Download datasheet (109Kb)Embed
Next
MC14174B
Hex Type D Flip−Flop
The MC14174B hex type D flip−flop is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. Data on the D inputs which meets the setup time
requirements is transferred to the Q outputs on the positive edge of the
clock pulse. All six flip−flops share common clock and reset inputs.
The reset is active low, and independent of the clock.
Features
Static Operation
All Inputs and Outputs Buffered
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
Functional Equivalent to TTL 74174
Pb−Free Packages are Available*
MAXIMUM RATINGS
(Voltages Referenced to V
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Input or Output Current (DC or Transient)
per Pin
Power Dissipation, per Package (Note 1)
Ambient Temperature Range
Storage Temperature Range
Lead Temperature (8−Second Soldering)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V
v (V
) v V
to the range V
or V
.
SS
in
out
DD
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V
or V
). Unused outputs must be left open.
SS
DD
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
)
SS
Symbol
Value
Unit
V
−0.5 to +18.0
V
DD
V
, V
−0.5 to V
V
in
out
DD
+ 0.5
± 10
I
, I
mA
in
out
P
500
mW
D
°C
T
−55 to +125
A
°C
−65 to +150
°C
260
MC14174BCP
MC14174BCPG
MC14174BD
MC14174BDG
and V
should be constrained
MC14174BDR2
in
out
MC14174BDR2G
†For information on tape and reel specifications,
1
http://onsemi.com
MARKING
DIAGRAMS
16
PDIP−16
MC14174BCP
P SUFFIX
AWLYYWWG
CASE 648
1
1
16
SOIC−16
14174BG
D SUFFIX
AWLYWW
CASE 751B
1
1
A
= Assembly Location
WL
= Wafer Lot
YY, Y = Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
PDIP−16
25 Units/Rail
PDIP−16
25 Units/Rail
(Pb−Free)
SOIC−16
48 Units/Rail
SOIC−16
48 Units/Rail
(Pb−Free)
SOIC−16
2500/Tape & Reel
SOIC−16
2500/Tape & Reel
(Pb−Free)
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MC14174B/D

MC14174BCPG Summary of contents

  • Page 1

    ... DD + 0.5 ± out P 500 mW D °C T −55 to +125 A °C −65 to +150 °C 260 MC14174BCP MC14174BCPG MC14174BD MC14174BDG and V should be constrained MC14174BDR2 in out MC14174BDR2G †For information on tape and reel specifications, 1 http://onsemi.com MARKING DIAGRAMS 16 PDIP−16 MC14174BCP P SUFFIX AWLYYWWG CASE 648 SOIC− ...

  • Page 2

    TRUTH TABLE (Positive Logic) Inputs Output Clock Data Reset Don’t Care MC14174B ...

  • Page 3

    ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

  • Page 4

    SWITCHING CHARACTERISTICS Î Î Î Î Î ...

  • Page 5

    ... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...