MC14174BCPG ON Semiconductor, MC14174BCPG Datasheet

MC14174BCPG

Manufacturer Part Number

MC14174BCPG

Description

IC FLIP FLOP D HEX CMOS 16DIP

Manufacturer

ON Semiconductor

Series

4000Br

Type

D-Type Busr

Datasheets

1.MC14174BCPG.pdf (5 pages)

2.MC14174BCPG.pdf (4 pages)

Specifications of MC14174BCPG

Function

Reset

Output Type

Inverted

Number Of Elements

Number Of Bits Per Element

Frequency - Clock

15.5MHz

Delay Time - Propagation

65ns

Trigger Type

Positive Edge

Current - Output High, Low

8mA, 8mA

Voltage - Supply

3 V ~ 18 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Through Hole

Package / Case

16-DIP (0.300", 7.62mm)

Number Of Circuits

Logic Family

MC14

Logic Type

D-Type Flip-Flop

Polarity

Non-Inverting

Input Type

Single-Ended

Propagation Delay Time

400 ns

High Level Output Current

- 4.2 mA

Low Level Output Current

4.2 mA

Supply Voltage (max)

18 V

Maximum Operating Temperature

+ 125 C

Mounting Style

Through Hole

Minimum Operating Temperature

- 55 C

Supply Voltage (min)

3 V

Circuit Type

Low-Power Schottky

Current, Supply

600 μA

Function Type

6-Channels, D-Type

Logic Function

Flip-Flop

Package Type

PDIP-16

Special Features

Buffered Output

Temperature, Operating, Range

-55 to +125 °C

Voltage, Supply

3 to 18 VDC

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

MC14174BCPGOS

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC14174BCPG

Manufacturer:

ON Semiconductor

Quantity:

1 150

Current page: 1 of 4
Download datasheet (82Kb)

MC14174B

Hex Type D Flip−Flop

P−channel and N−channel enhancement mode devices in a single

monolithic structure. Data on the D inputs which meets the setup time

requirements is transferred to the Q outputs on the positive edge of the

clock pulse. All six flip−flops share common clock and reset inputs.

The reset is active low, and independent of the clock.

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Temperature Derating: Plastic “P and D/DW”

static voltages or electric fields. However, precautions must be taken to avoid

applications of any voltage higher than maximum rated voltages to this

high−impedance circuit. For proper operation, V

to the range V

(e.g., either V

*For additional information on our Pb−Free strategy and soldering details, please

MAXIMUM RATINGS

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input or Output Current (DC or Transient)

per Pin

Power Dissipation, per Package (Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature (8−Second Soldering)

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

The MC14174B hex type D flip−flop is constructed with MOS

This device contains protection circuitry to guard against damage due to high

Unused inputs must always be tied to an appropriate logic voltage level

Schottky TTL Load Over the Rated Temperature Range

Static Operation

All Inputs and Outputs Buffered

Diode Protection on All Inputs

Supply Voltage Range = 3.0 Vdc to 18 Vdc

Capable of Driving Two Low−Power TTL Loads or One Low−Power

Functional Equivalent to TTL 74174

Pb−Free Packages are Available*

Packages: – 7.0 mW/_C From 65_C To 125_C

Parameter

or V

v (V

). Unused outputs must be left open.

or V

(Voltages Referenced to V

out

) v V

Symbol

, V

, I

and V

out

)

−0.5 to +18.0

−55 to +125

−65 to +150

−0.5 to V

should be constrained

Value

+ 0.5

± 10

500

260

Unit

°C

†For information on tape and reel specifications,

MC14174BCP

MC14174BCPG

MC14174BD

MC14174BDG

MC14174BDR2

MC14174BDR2G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Device

ORDERING INFORMATION

YY, Y = Year

CASE 751B

= Assembly Location

= Wafer Lot

= Work Week

= Pb−Free Package

CASE 648

P SUFFIX

D SUFFIX

SOIC−16

PDIP−16

(Pb−Free)

SOIC−16

Package

PDIP−16

Publication Order Number:

2500/Tape & Reel

25 Units/Rail

DIAGRAMS

MC14174BCP

48 Units/Rail

AWLYYWWG

Shipping

MARKING

AWLYWW

14174BG

MC14174B/D

†

Related parts for MC14174BCPG

MC14174BCPG Summary of contents

Page 1

... DD + 0.5 ± out P 500 mW D °C T −55 to +125 A °C −65 to +150 °C 260 MC14174BCP MC14174BCPG MC14174BD MC14174BDG and V should be constrained MC14174BDR2 in out MC14174BDR2G †For information on tape and reel specifications, 1 MARKING DIAGRAMS 16 PDIP−16 MC14174BCP P SUFFIX AWLYYWWG CASE 648 SOIC−16 ...

Page 2

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 3

SWITCHING CHARACTERISTICS Î Î Î Î Î ...

Page 4

0.25 (0.010) M −A− −B− −T− SEATING PLANE 0.25 (0.010 MC14174B PACKAGE DIMENSIONS ...

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