ipd079n06l3g Infineon Technologies Corporation, ipd079n06l3g Datasheet

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ipd079n06l3g

Manufacturer Part Number
ipd079n06l3g
Description
Optimos Tm 3 Power Transistor Power Mosfet
Manufacturer
Infineon Technologies Corporation
Datasheet

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Part Number:
IPD079N06L3G
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
IPD079N06L3G
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Company:
Part Number:
IPD079N06L3G
Quantity:
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Rev. 2.0
1)
2)
3)
4)
Type
Features
• Ideal for high frequency switching and sync. rec.
• Optimized technology for DC/DC converters
• Excellent gate charge x R
• N-channel, logic level
• 100% avalanche tested
• Pb-free plating; RoHS compliant
• Qualified according to JEDEC
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
J-STD20 and JESD22
Current is limited by bondwire; with an R
See figure 3 for more detailed information
See figure 13 for more detailed information
(TM)
3 Power-Transistor
IPD079N06L3 G
PG-TO-252-3
079N06L
3)
j
=25 °C, unless otherwise specified
DS(on)
1)
4)
product (FOM)
for target applications
thJC
Symbol Conditions
I
I
E
V
P
T
D
D,pulse
j
AS
GS
tot
=1.9 K/W the chip is able to carry 74 A.
, T
stg
T
T
T
I
T
D
page 1
C
C
C
C
=50 A, R
=25 °C
=100 °C
=25 °C
=25 °C
2)
GS
=25 Ω
Product Summary
V
R
I
D
DS
DS(on),max
-55 ... 175
55/175/56
Value
200
±20
50
50
43
79
IPD079N06L3 G
7.9
60
50
Unit
A
mJ
V
W
°C
V
mΩ
A
2008-12-09

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ipd079n06l3g Summary of contents

Page 1

Type (TM) OptiMOS 3 Power-Transistor Features • Ideal for high frequency switching and sync. rec. • Optimized technology for DC/DC converters • Excellent gate charge x R DS(on) • N-channel, logic level • 100% avalanche tested • Pb-free plating; RoHS ...

Page 2

Parameter Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Gate resistance Transconductance 5) ...

Page 3

Parameter Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Switching charge Gate charge total Gate plateau voltage Output ...

Page 4

Power dissipation P =f(T ) tot C 100 Safe operating area I =f =25 ° parameter limited by on-state ...

Page 5

Typ. output characteristics I =f =25 ° parameter 200 160 120 Typ. transfer characteristics I =f |>2|I |R ...

Page 6

Drain-source on-state resistance =10 V DS(on max -60 - Typ. capacitances C =f MHz ...

Page 7

Avalanche characteristics =25 Ω parameter: T j(start) 100 150 ° Drain-source breakdown voltage V =f BR(DSS ...

Page 8

PG-TO-252-3 Rev. 2.0 Packaging: page 8 IPD079N06L3 G 2008-12-09 ...

Page 9

Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to ...

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