mrf6s20010n Freescale Semiconductor, Inc, mrf6s20010n Datasheet

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mrf6s20010n

Manufacturer Part Number
mrf6s20010n
Description
Rf Power Field Effect Transistors
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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© Freescale Semiconductor, Inc., 2006. All rights reserved.
RF Device Data
Freescale Semiconductor
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
N - Channel Enhancement - Mode Lateral MOSFETs
frequencies from 1600 to 2200 MHz. Suitable for analog and digital modulation
and multipurpose amplifier applications.
• Typical Two - Tone Performance @ 2170 MHz: V
• Typical 2 - Carrier W - CDMA Performance: V
• Typical Single - Carrier N - CDMA Performance: V
• Typical GSM EDGE Performance: V
• Capable of Handling 5:1 VSWR, @ 28 Vdc, 2000 MHz, 10 Watts CW
Features
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Internally Matched for Ease of Use
• Qualified Up to a Maximum of 32 V
• Integrated ESD Protection
• 200°C Capable Plastic Package
• RoHS Compliant
• In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel.
Table 1. Maximum Ratings
Drain- Source Voltage
Gate - Source Voltage
Storage Temperature Range
Operating Junction Temperature
Designed for Class A or Class AB general purpose applications with
130 mA, P
P
Bandwidth = 3.84 MHz. PAR = 8.5 dB @ 0.01% Probability
130 mA, P
IS - 95 (Pilot, Sync, Paging, Traffic Codes 8 through 13), Channel Band-
width = 1.2288 MHz. PAR = 9.8 dB @ 0.01% Probability on CCDF.
4 Watts Avg., Full Frequency Band (1805 - 1880 MHz)
Output Power
out
Power Gain — 15.5 dB
Drain Efficiency — 36%
IMD — - 34 dBc
Power Gain — 15.5 dB
Drain Efficiency — 15%
IM3 @ 10 MHz Offset — - 47 dBc in 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset — - 49 dBc in 3.84 MHz Channel Bandwidth
Power Gain — 15.5 dB
Drain Efficiency— 16%
ACPR @ 885 kHz Offset = - 60 dBc in 30 kHz Bandwidth
Power Gain — 16 dB
Drain Efficiency — 33%
EVM — 1.3% rms
= 1 Watt Avg., Full Frequency Band (2130 - 2170 MHz), Channel
out
out
= 10 Watts PEP
= 1 Watt Avg., Full Frequency Band (1930 - 1990 MHz),
Rating
DD
DD
Operation
= 28 Volts, I
DD
= 28 Volts, I
DD
DD
DQ
= 28 Volts, I
= 28 Volts, I
= 130 mA, P
DQ
= 130 mA,
DQ
DQ
=
=
out
=
Symbol
V
V
T
T
DSS
GS
stg
J
Document Number: MRF6S20010N
MRF6S20010GNR1
MRF6S20010NR1
1600 - 2200 MHz, 10 W, 28 V
CASE 1265A - 02, STYLE 1
LATERAL N - CHANNEL
CASE 1265 - 08, STYLE 1
RF POWER MOSFETs
MRF6S20010GNR1
GSM/GSM EDGE
SINGLE N - CDMA
TO - 270 - 2 GULL
MRF6S20010NR1
- 65 to +175
- 0.5, +68
- 0.5, +12
2 x W - CDMA
Value
PLASTIC
TO - 270 - 2
PLASTIC
200
Rev. 1, 5/2006
Unit
Vdc
Vdc
°C
°C
1

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mrf6s20010n Summary of contents

Page 1

... Volts Volts 130 mA out Operation DD Document Number: MRF6S20010N Rev. 1, 5/2006 MRF6S20010NR1 MRF6S20010GNR1 1600 - 2200 MHz GSM/GSM EDGE SINGLE N - CDMA CDMA LATERAL N - CHANNEL RF POWER MOSFETs CASE 1265 - 08, STYLE 270 - 2 PLASTIC MRF6S20010NR1 CASE 1265A - 02, STYLE 1 ...

Page 2

... Input Return Loss 1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access the MTTF calculators by product. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. 3. Part internally matched on input. MRF6S20010NR1 MRF6S20010GNR1 2 Rating 3 = 25°C unless otherwise noted) C ...

Page 3

... Avg., DQ out — 15.5 — dB — 16 — % — 0.3 — dB — — dBc = 28 Vdc 130 mA Avg out — 16 — dB — 33 — % — 0.3 — dB — 1.3 — % rms — — dBc — — dBc MRF6S20010NR1 MRF6S20010GNR1 3 ...

Page 4

... Microstrip Z8 0.0905″ x 0.330″ Microstrip Z9 0.050″ x 0.980″ Microstrip Figure 1. MRF6S20010NR1(GNR1) Test Circuit Schematic — 2110 - 2170 MHz Table 6. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values — 2110 - 2170 MHz Part C1 100 nF Chip Capacitor (1206) C2, C6 4.7 pF 600B Chip Capacitors C3, C7 ...

Page 5

... R2 C1 C11 Figure 2. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 2110 - 2170 MHz RF Device Data Freescale Semiconductor R3 MRF6S20010N, Rev. 2 MRF6S20010NR1 MRF6S20010GNR1 C10 C8 5 ...

Page 6

... Two −Tone Measurements −30 −40 −50 5th Order −60 −70 0 OUTPUT POWER (WATTS) PEP out Figure 6. Intermodulation Distortion Products versus Output Power MRF6S20010NR1 MRF6S20010GNR1 6 — 2110 - 2170 MHz η D IRL Vdc (PEP) DD out I = 130 mA, 100 kHz Tone Spacing DQ ...

Page 7

... MTTF in a particular application −30_C 25_C 85_C η OUTPUT POWER (WATTS) CW out versus CW Output Power S21 S11 1200 1600 2000 2400 2800 3200 f, FREQUENCY (MHz) 200 210 2 MRF6S20010NR1 MRF6S20010GNR1 −3 −6 −9 −12 −15 7 ...

Page 8

... MHz 2175 MHz 42 2−Carrier W−CDMA, 10 MHz Carrier Spacing, 3.84 MHz Channel 35 Bandwidth, PAR = 8 0.01% Probability (CCDF 0.1 Figure 14 Carrier W - CDMA ACPR, IM3, Power Gain MRF6S20010NR1 MRF6S20010GNR1 8 — 2110 - 2170 MHz = 28 Vdc (Avg.), I = 130 mA out DQ 2080 2100 2120 2140 2160 2180 ...

Page 9

... Freescale Semiconductor W - CDMA TEST SIGNAL +20 +30 0 −10 −20 −30 −40 −50 −60 −IM3 in 3.84 MHz BW −70 −80 −25 − 3.84 MHz Channel BW −ACPR in +ACPR in 3.84 MHz BW 3.84 MHz BW +IM3 in 3.84 MHz BW −15 −10 − FREQUENCY (MHz) Figure 16. 2-Carrier W-CDMA Spectrum MRF6S20010NR1 MRF6S20010GNR1 ...

Page 10

... Z9 1.142″ x 0.516″ Microstrip Z10 0.433″ x 0.276″ Microstrip Figure 17. MRF6S20010NR1(GNR1) Test Circuit Schematic — 1930 - 1990 MHz Table 7. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values — 1930 - 1990 MHz Part C1 100 nF Chip Capacitor (1206) C2, C6 4.7 pF 600B Chip Capacitors C3, C7 ...

Page 11

... N - CDMA TYPICAL CHARACTERISTICS C11 MRF6S20010N Rev 0 Figure 18. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 1930 - 1990 MHz RF Device Data Freescale Semiconductor — 1930 - 1990 MHz R3 MRF6S20010NR1 MRF6S20010GNR1 C10 11 ...

Page 12

... Figure 19. Single - Carrier N - CDMA Broadband Performance 1960 MHz, N−CDMA IS−95 40 (Pilot, Sync, Paging, Traffic Codes 8 Through 13 0.1 Figure 20. Single - Carrier N - CDMA ACPR and Drain MRF6S20010NR1 MRF6S20010GNR1 12 — 1930 - 1990 MHz = 28 Vdc (Avg.), I = 500 mA out DQ ACPR IRL 1920 1930 1940 ...

Page 13

... FREQUENCY (MHz) MRF6S20010NR1 MRF6S20010GNR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . ...

Page 14

... Microstrip Z8 0.591″ x 0.334″ Microstrip Z9 0.050″ x 0.980″ Microstrip Figure 23. MRF6S20010NR1(GNR1) Test Circuit Schematic — 1805 - 1880 MHz Table 8. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values —1805 - 1880 MHz Part C1 100 nF Chip Capacitor (1206) C2, C6 4.7 pF 600B Chip Capacitors C3, C7 ...

Page 15

... GSM EDGE TYPICAL CHARACTERISTICS C11 MRF6S20010N Rev. 0 Figure 24. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 1805 - 1880 MHz RF Device Data Freescale Semiconductor — 1805 - 1880 MHz R3 MRF6S20010NR1 MRF6S20010GNR1 C10 15 ...

Page 16

... 1840 MHz − 400 kHz −65 −70 −75 −80 0 OUTPUT POWER (WATTS) out Figure 27. Spectral Regrowth at 400 kHz and 600 kHz versus Output Power MRF6S20010NR1 MRF6S20010GNR1 η D IRL Vdc 130 FREQUENCY (MHz Watts out η ...

Page 17

... Z Z source load MHz Ω Ω 1805 13.237 + j5.810 2.445 + j3.698 1840 13.953 + j6.084 2.542 + j3.942 1880 14.858 + j6.279 2.695 + j4.170 = Test circuit impedance as measured from gate to ground. = Test circuit impedance as measured from drain to ground. Output Matching Network MRF6S20010NR1 MRF6S20010GNR1 17 ...

Page 18

... MRF6S20010NR1 MRF6S20010GNR1 126 mA 255C, 50 ohm system ∠ φ 1.195 42.42 0.001 0.947 40 ...

Page 19

... S 22 ∠ φ ∠ φ 22 42.56 0.957 - 177.2 52.25 0.962 - 177.8 60.26 0.961 - 178.4 64.14 0.964 - 179.1 65.62 0.964 - 179.6 64.71 0.964 179.7 67.58 0.966 179.4 75.44 0.966 178.8 82.04 0.964 178.3 83.60 0.967 177.9 83.41 0.968 177.4 81.35 0.964 176.8 77.45 0.969 176.4 70.98 0.970 176.2 67.00 0.970 175.5 MRF6S20010NR1 MRF6S20010GNR1 19 ...

Page 20

... MRF6S20010NR1 MRF6S20010GNR1 20 PACKAGE DIMENSIONS RF Device Data Freescale Semiconductor ...

Page 21

... RF Device Data Freescale Semiconductor MRF6S20010NR1 MRF6S20010GNR1 21 ...

Page 22

... MRF6S20010NR1 MRF6S20010GNR1 22 RF Device Data Freescale Semiconductor ...

Page 23

... D2 .290 .320 7.37 8.13 D3 .016 .024 0.41 0.61 E .316 .324 8.03 8.23 E1 .238 .242 6.04 6.15 E2 .066 .074 1.68 1.88 E3 .150 .180 3.81 4.57 E4 .058 .066 1.47 1.68 E5 .231 .235 5.87 5.97 L .018 .024 4.90 5.06 L1 .01 BSC 0.25 BSC b1 .193 .199 4.90 5.06 c1 .007 .011 0.18 0.28 ° ° ° ° aaa .004 0.10 STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE MRF6S20010NR1 MRF6S20010GNR1 23 ...

Page 24

... Denver, Colorado 80217 1 - 800 - 441 - 2447 or 303 - 675 - 2140 Fax: 303 - 675 - 2150 LDCForFreescaleSemiconductor@hibbertgroup.com MRF6S20010NR1 MRF6S20010GNR1 Document Number: MRF6S20010N Rev. 1, 5/2006 24 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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