74HC574D,652 NXP Semiconductors, 74HC574D,652 Datasheet
74HC574D,652
Specifications of 74HC574D,652
74HC574D
74HC574D
933715520652
Related parts for 74HC574D,652
74HC574D,652 Summary of contents
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Octal D-type flip-flop; positive edge-trigger; 3-state Rev. 3 — 15 December 2010 1. General description The 74HC574; 74HCT574 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL specified in compliance with ...
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... NXP Semiconductors Table 1. Ordering information Type number Package Temperature range 40 C to +125 C 74HC574DB 74HCT574DB 40 C to +125 C 74HC574PW 74HCT574PW 4. Functional diagram Fig 1. Functional diagram FF1 Fig 2. Logic diagram 74HC_HCT574 Product data sheet Octal D-type flip-flop; positive edge-trigger; 3-state … ...
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... NXP Semiconductors Fig 3. Logic symbol 5. Pinning information 5.1 Pinning 74HC574 74HCT574 GND 10 001aan290 Fig 5. Pin configuration DIP20 and SO20 74HC_HCT574 Product data sheet Octal D-type flip-flop; positive edge-trigger; 3-state mna798 Fig Fig 6. All information provided in this document is subject to legal disclaimers. Rev. 3 — 15 December 2010 74HC574 ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin OE 1 D[0: GND Q[0:7] 19, 18, 17, 16, 15, 14, 13, 12 3-state flip-flop output Functional description [1] Table 3. Function table Operating mode Load and read register Load register and disable output [ HIGH voltage level HIGH voltage level one setup time prior to the HIGH-to-LOW CP transition; ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I supply current 6 input I capacitance 74HCT574 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage = 20 LOW-level output voltage = 20 6.0 mA ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions For type 74HC574 t propagation CP to Qn; see pd delay enable time OE to Qn; see disable time OE to Qn; see dis transition Qn; see t time V = 2.0 V ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions C power pF MHz dissipation V = GND capacitance For type 74HCT574 t propagation CP to Qn; see pd delay enable time OE to Qn; see 4 disable time OE to Qn; see dis transition Qn; see t time V = 4.5 V ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. Propagation delay input (CP) to output (Qn), output transition time, clock input (CP) pulse width and the maximum frequency (CP) CP input Dn input Qn output ...
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... NXP Semiconductors OE input Qn output LOW-to-OFF OFF-to-LOW Qn output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 9. Enable and disable times Table 8. Measurement points Type 74HC574 74HCT574 74HC_HCT574 Product data sheet Octal D-type flip-flop ...
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... NXP Semiconductors negative Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 10. Test circuit for measuring switching times Table 9. Test data Type Input V I 74HC574 ...
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... NXP Semiconductors 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 13. Package outline SOT339-1 (SSOP20) ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product specification All information provided in this document is subject to legal disclaimers. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74HC_HCT574 Product data sheet Octal D-type flip-flop ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Abbreviations ...