irf7707gpbf International Rectifier Corp., irf7707gpbf Datasheet

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irf7707gpbf

Manufacturer Part Number
irf7707gpbf
Description
Power Mosfets
Manufacturer
International Rectifier Corp.
Datasheet
Thermal Resistance
l
l
l
l
l
l
l
Absolute Maximum Ratings
Description
www.irf.com
HEXFET
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
with an extremely efficient and reliable device for
battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
V
I
I
I
P
P
V
T
R
D
D
DM
J
DS
D
D
GS
θJA
@ T
@ T
, T
P-Channel MOSFET
Ultra Low On-Resistance
Very Small SOIC Package
Low Profile (< 1.2mm)
Available in Tape & Reel
Lead-Free
Halogen-Free
@T
@T
STG
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
®
Power MOSFETs from International Rectifier
Gate-to-Source Voltage
Linear Derating Factor
Drain-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Parameter
Parameter
provides thedesigner

GS
GS
ƒ
ƒ
ƒ
@ -4.5V
@ -4.5V
!
"
!Ã2ÃT
"Ã2ÃT
Ã2Ã9
Ã2ÃB
V
-20V
DSS
B
IRF7707GPbF
9
HEXFET
22mΩ@V
33mΩ@V
'Ã2Ã9
&Ã2ÃT
$Ã2Ã9
%Ã2ÃT
R
-55 to +150
'
&
%
$
Max.
DS(on)
83
Max.
-7.0
-5.7
0.01
-20
-28
1.5
1.0
±12
®
GS
GS
Power MOSFET
max
= -4.5V
= -2.5V
TSSOP-8
PD- 96260
-
-
7.0A
6.0A
Units
Units
I
07/10/09
W/°C
°C/W
D
°C
W
W
V
V
A
1

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irf7707gpbf Summary of contents

Page 1

... Maximum Power Dissipation D A Linear Derating Factor V Gate-to-Source Voltage Junction and Storage Temperature Range J STG Thermal Resistance Parameter R Maximum Junction-to-Ambient θJA www.irf.com IRF7707GPbF HEXFET V DSS -20V 9 ! " B Ã2Ã9 !Ã2ÃT "Ã2ÃT Ã2ÃB @ -4. -4.5V GS  ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient ∆V /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 ° 150 ° 20µs ...

Page 4

1MHz iss rss 2800 oss iss 2100 1400 C oss 700 C rss ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL RESPONSE) 0.1 ...

Page 6

-7.0A 0.000 2.0 3.0 4.0 5.0 -V GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs. Gate Voltage Charge Fig 14a. Basic Gate Charge ...

Page 7

DI9@Y 6SF $ r 7 "Y ppp r 'YÃ iii hhh 8 'ÃTVSA G@69Ã6TTDB BG@ ! & ...

Page 8

G@) UCDTÃDTÃ6IÃDSA''$! 7A GPUÃ8P9@ TSSOP-8 Tape and Reel Information A@@9Ã9DS@8UDPI 'À€ Note: For the most current drawing please refer to IR website at IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 8 6SUÃIVH7@S ...

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