ir110bg12dcb International Rectifier Corp., ir110bg12dcb Datasheet
ir110bg12dcb
Manufacturer Part Number
ir110bg12dcb
Description
Phase Control Thyristors
Manufacturer
International Rectifier Corp.
Datasheet
1.IR110BG12DCB.pdf
(2 pages)
PHASE CONTROL THYRISTORS
(1) Nitrogen flow on die edge.
Mechanical Characteristics
www.irf.com
Major Ratings and Characteristics
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Maximum Width of Sawing Line
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Parameters
V
V
I
V
I
I
GT
H
L
Junction Size:
Wafer Size:
V
Passivation Process:
Reference IR Packaged Part:
TM
RRM
GT
RRM
Class:
Maximum On-state Voltage
Reverse Breakdown Voltage
Max. Required DC Gate Current to Trigger
Max. Required DC Gate Voltage to Trigger
Holding Current Range
Maximum Latching Current
Square 110 mils
4"
1200 V
Glassivated MESA
16TTS Series
5 to 100 mA
200 mA
Units
1200 V
60 mA
1.4 V
2 V
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
100% Al, (20µm)
110 x 110 mils (see drawing)
100 mm, with std. <110> flat
350 µm ± 10 µm
130 µm
0.25 mm diameter minimum
See drawing
Storage in original container, in dessicated
nitrogen, with no contamination
Test Conditions
T
T
T
T
Anode supply = 6 V, resistive load
Anode supply = 6 V, resistive load
J
J
J
J
= 25° C, anode supply = 6 V, resistive load
= 25° C, anode supply = 6 V, resistive load
= 25°C, I
= 25°C, I
IR110BG12DCB
T
RRM
= 10 A
= 100 µA
Bulletin I0101J 12/01
(1)
1
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ir110bg12dcb Summary of contents
Page 1
... Nominal Back Metal Composition, Thickness Nominal Front Metal Composition, Thickness Chip Dimensions Wafer Diameter Wafer Thickness Maximum Width of Sawing Line Reject Ink Dot Size Ink Dot Location Recommended Storage Environment www.irf.com IR110BG12DCB Square 110 mils 4" 1200 V Glassivated MESA 16TTS Series Units Test Conditions 1 25° ...
Page 2
... IR110BG12DCB Bulletin I0101J 12/01 Ordering Information Table Device Code Outline Table 2 IR 110 International Rectifier Device - Chip Dimension in Mils - Type of Device Wire Bondable SCR - Passivation Process Glassivated MESA - Voltage code: Code x 100 = V RRM - Metallization Silver (Anode) - Aluminium (Cathode) ...