tlp185 TOSHIBA Semiconductor CORPORATION, tlp185 Datasheet - Page 9

• Manufacturer Part Number: tlp185
• Description: Toshiba Photocoupler Gaas Ired & Photo−transistor
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Soldering and Storage
1. Soldering
1) Using solder reflow
1.1 Soldering
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
3) Using a soldering iron
·Temperature profile example of lead (Pb) solder
·Temperature profile example of using lead (Pb)-free solder
(°C)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
much as possible by observing the following conditions.
(°C)
240
210
160
140
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
260
230
190
180
60 to 120s
60 to 120s
Time
Time
less than 30s
30 to 50s
9
(s)
(s)
This profile is based on the device’s
value.
Set the preheat temperature/heating
type used by the customer within the
described profile.
maximum heat resistance guaranteed
temperature to the optimum temperature
corresponding to the solder paste
This profile is based on the device’s
value.
Set the preheat temperature/heating
type used by the customer within the
described profile.
maximum heat resistance guaranteed
temperature to the optimum temperature
corresponding to the solder paste
2011-09-22
TLP185