FDH333-T50R Fairchild Semiconductor, FDH333-T50R Datasheet

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FDH333-T50R

Manufacturer Part Number
FDH333-T50R
Description
Fdh/fdll 300/a / 333 High Conductance Low Leakage Diode
Manufacturer
Fairchild Semiconductor
Datasheet
ã 1997 Fairchild Semiconductor Corporation
P
R
W
I
I
i
i
T
T
Symbol
Symbol
f
f(surge)
O
F
D
stg
J
Absolute Maximum Ratings*
High Conductance Low Leakage Diode
Sourced from Process 1M. See MMBD1501/A-1505/A for characteristics.
*
NOTES:
1) These ratings are based on a maximum junction temperature of 200 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics
JA
IV
These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Total Device Dissipation
Thermal Resistance, Junction to Ambient
Working Inverse Voltage
Average Rectified Current
DC Forward Current
Recurrent Peak Forward Current
Peak Forward Surge Current
Storage Temperature Range
Operating Junction Temperature
Derate above 25 C
DO-35
Pulse width = 1.0 second
Pulse width = 1.0 microsecond
Characteristic
FDH/FDLL 300/A / 333
Parameter
THE PLACEMENT OF THE EXPANSION GAP
HAS NO RELATIONSHIP TO THE LOCATION
OF THE CATHODE TERMINAL
TA = 25°C unless otherwise noted
LL-34
TA = 25°C unless otherwise noted
FDH/FDLL 300/A / 333
FDLL300
FDLL300A
FDLL333
DEVICE
Max
3.33
500
300
-65 to +200
COLOR BAND MARKING
Value
600
125
200
500
175
1.0
4.0
1ST BAND 2ND BAND
BROWN
BROWN
BROWN
GREEN
YELLOW
BLUE
Units
Units
mW/ C
mA
mA
mA
mW
C/W
V
A
A
C
C

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FDH333-T50R Summary of contents

Page 1

... Characteristic P Total Device Dissipation D Derate above Thermal Resistance, Junction to Ambient JA ã 1997 Fairchild Semiconductor Corporation LL-34 THE PLACEMENT OF THE EXPANSION GAP HAS NO RELATIONSHIP TO THE LOCATION OF THE CATHODE TERMINAL TA = 25°C unless otherwise noted Parameter TA = 25°C unless otherwise noted FDH/FDLL 300/A / 333 ...

Page 2

Electrical Characteristics Symbol Parameter B Breakdown Voltage V I Reverse Current FDH/FDLL 300/A R FDH/FDLL 333 V Forward Voltage FDH/FDLL 300/A F FDH/FDLL 300 FDH/FDLL 300A FDH/FDLL 300/A FDH/FDLL 300 FDH/FDLL 300A FDH/FDLL 300/A FDH/FDLL 300/A FDH/FDLL 333 C Diode ...

Page 3

... Weight per unit (gm) 0.137 0.137 Weight per Reel/Ammo (kg) 2.23 0.800 Note/Comments DO-35 Reel Dimensions: Figure 3.0 Soabar Label W1 D3 ©2000 Fairchild Semiconductor International Corrugated Outer Liner T50R Kraft Paper Wound TNR Options Soabar Label sample Standard (no flow code) Bag 500 - TYPE - REV ...

Page 4

DO-35 Tape and Ammo Data, continued DO-35 A mmo Packing Configuration: Figure 4.0 254mm x 79mm x 79mm Intermediate Container (5,000 cap) T50A Option DO-35 Taping Dimension: Figure 5 DO-35 Bulk Packing Configuration: ...

Page 5

... DO-35 Package Dimensions DO-35 (FS PKG Code D2) ©2000 Fairchild Semiconductor International 1:1 Scale 1:1 on letter size paper Dimensions shown below are in millimeters Part Weight per unit (gram): 0.137 March 2000, Rev. A ...

Page 6

... Carrier Tape Cover Tape Trailer Tape 300mm minimum or 75 empty pockets ©2000 Fairchild Semiconductor International Packaging Description: LL-34 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent ...

Page 7

LL-34 Tape and Reel Data,continued LL-34 Embossed Carrier Tape Configuration: Figure 3 Pkg type LL-34 1.7 3.7 8.0 1.5 +/-0.10 +/-0.10 +/-0.3 +/-0.10 (8mm) Notes: A0, B0, and K0 dimensions are ...

Page 8

... LL-34 Package Dimensions LL-34 (FS PKG Code D3) ©2000 Fairchild Semiconductor International 1:1 Scale 1:1 on letter size paper Dimensions shown below are in millimeters Part Weight per unit (gram): 0.030 March 2000, Rev. A ...

Page 9

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ FASTr™ Bottomless™ GlobalOptoisolator™ CoolFET™ GTO™ CROSSVOLT™ HiSeC™ DOME™ ...

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