vnd830p-e STMicroelectronics, vnd830p-e Datasheet
vnd830p-e
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vnd830p-e Summary of contents
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... September 2010 Double channel high-side driver Description The VND830P monolithic device made by using STMicroelectronics™ VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground. Active V against low energy spikes (see ISO7637 transient compatibility table). ...
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... VND830P-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 3.1.1 3.1.2 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.5 Maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4 ...
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... VND830P-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 CC Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 9. Switching ( Table 10 ...
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... VND830P-E List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 6. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 8. Input clamp voltage Figure 9. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 10. ...
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... VND830P-E 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE CLAMP UNDERVOLTAGE CLAMP 1 DRIVER 1 CURRENT LIMITER 1 ...
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... VND830P-E 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...
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... VND830P-E 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead (max) thj-lead R Thermal resistance junction-ambient (max) thj-amb 1. When mounted on a standard single-sided FR-4 board with 0.5 cm Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 6 cm Horizontal mounting and no artificial air flow. ...
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... VND830P-E Table 5. Power output (continued) Symbol (1) I Supply current S I Off-state output current L(off1) I Off-state output current L(off2) I Off-state output current L(off3) I Off-state output current L(off4) 1. Per device. Table 6. Protections Symbol Parameter T Shutdown temperature TSD T Reset temperature R T Thermal hysteresis hyst ...
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... VND830P-E Table 8. Status pin (continued) Symbol V Status clamp voltage SCL Table 9. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV/dt Turn-on voltage slope (on) dV/dt Turn-off voltage slope (off) Table 10. Open-load detection Symbol Open-load on-state detection I OL threshold Open-load on-state detection t DOL(on) delay ...
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... VND830P-E Figure 4. Switching time waveforms Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Input Doc ID 17546 Rev 2 Electrical specifications Output Sense < ...
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... VND830P-E Table 13. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 14. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 15. Electrical transient requirements on V Class III -25 V -50 V -75 V +25 V +50 V +75 V -25 V -50 V ...
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... VND830P-E Figure 5. Waveforms INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS V CC INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT CURRENT STATUS n NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN-LOAD with external pull-up ...
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... VND830P-E 2.4 Electrical characteristics curves Figure 6. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - 100 Tc (°C) Figure 8. Input clamp voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C) Figure 10. Status low output voltage Vstat (V) 0.8 0.7 Istat=1.6mA 0.6 0.5 0.4 0.3 0.2 0.1 0 -50 - ...
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... VND830P-E Figure 12. Overvoltage shutdown Vov ( -50 - 100 Tc (°C) Figure 14. Turn-on voltage slope dVout/dt(on) (V/ms) 800 700 Vcc=13V Rl=6.5Ohm 600 500 400 300 200 100 0 -50 - (ºC) Figure 16. On-state resistance vs T Ron (mOhm) ...
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... VND830P-E Figure 18. Input high level Vih (V) 3.6 3.4 3.2 3 2.8 2.6 2.4 2.2 -50 - (°C) Figure 20. Open-load on-state detection threshold Iol (mA) 150 140 Vcc=13V 130 Vin=5V 120 110 100 -50 - (°C) Figure 22. Input hysteresis voltage Vhyst (V) 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - (°C) Figure 19. Input low level Vil (V) 2 ...
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... VND830P-E 3 Application information Figure 23. Application schematic +5V R prot μC R prot R prot R prot 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: a resistor in the ground line (R This can be used with any type of load. ...
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... VND830P-E Please note that, if the microprocessor ground is not common with the device ground, then the R produces a shift (I GND values. This shift varies depending on how many devices are ON in the case of several high- side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using 3 ...
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... VND830P-E 3.4 Open-load detection in off-state Off-state open-load detection requires an external pull-up resistor (R OUTPUT pin and a positive supply voltage (V microprocessor. The external resistor has to be selected according to the following requirements false open-load indication when load is connected: in this case it needs to avoid OUT PU 2 ...
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... VND830P-E 3.5 Maximum demagnetization energy Figure 25. SO-16L maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse at T Conditions 13 Note: Values are generated with Ω. In case of repetitive pulses, T specified above for curves B and C. ...
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... VND830P-E 4 Package and PCB thermal data 4.1 SO-16L thermal data Figure 26. SO-16L PC board Note: Layout condition µm, Copper areas: 0.5 cm Figure 27. R thj-amb RTH j-amb (°C/ (1) and Z measurements (PCB FR4 area = mm, PCB thickness = 2 mm, Cu thickness = ...
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... VND830P-E Figure 28. SO-16 L thermal impedance junction ambient single pulse Equation 1 pulse calculation formula : ⋅ δ THδ TH δ T ⁄ where p Figure 29. Thermal fitting model of a quad channel HSD in SO-16L Tj_1 Pd1 Tj_2 ( 1 δ – THtp Pd2 ...
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... VND830P-E Table 16. Thermal parameters Area/ island ( (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 17546 Rev 2 Package and PCB thermal data Footprint 6 0.05 0.3 2 0.001 5.00E-03 0.02 0 22/27 ...
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... VND830P-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 SO-16L package information Figure 30 ...
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... VND830P-E Table 17. SO-16L mechanical data DIM Package and packing information mm. Min. Typ. 0.1 0.35 0.23 0.5 45° (typ.) 10.1 10.0 1.27 8.89 7.4 0.5 8° (max.) Doc ID 17546 Rev 2 Max. 2.65 0.2 2.45 0.49 0.32 10.5 10.65 7.6 1.27 0.75 24/27 ...
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... VND830P-E 5.3 SO-16L packing information Figure 31. SO-16L tube shipment (no suffix) C Figure 32. Tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position ...
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... VND830P-E 6 Revision history Table 18. Document revision history Date 25-May-2010 22-Sep-2010 Revision 1 Initial release. 2 Changed document status from preliminary data to datasheet. Doc ID 17546 Rev 2 Revision history Changes 26/27 ...
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... VND830P-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...