IC D-TYPE FLIP-FLOP QUAD 16-SOIC

CD40175BM

Manufacturer Part NumberCD40175BM
DescriptionIC D-TYPE FLIP-FLOP QUAD 16-SOIC
ManufacturerTexas Instruments
Series4000B
TypeD-Type Bus
CD40175BM datasheet
 


Specifications of CD40175BM

FunctionMaster ResetOutput TypeDifferential
Number Of Elements1Number Of Bits Per Element4
Frequency - Clock14MHzDelay Time - Propagation70ns
Trigger TypePositive EdgeCurrent - Output High, Low6.8mA, 6.8mA
Voltage - Supply3 V ~ 18 VOperating Temperature-55°C ~ 125°C
Mounting TypeSurface MountPackage / Case16-SOIC (3.9mm Width)
Flip-flop TypeDPropagation Delay70ns
Frequency14MHzOutput Current6.8mA
Ic Output TypeComplementarySupply Voltage Range3V To 18V
Logic Case StyleSOICRohs CompliantYes
Lead Free Status / RoHS StatusLead free / RoHS Compliant  
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Data sheet acquired from Harris Semiconductor
SCHS105C − Revised October 2003
The CD40175B types are supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline packages (M, M96, MT,
and NSR suffixes), and 16-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright  2003, Texas Instruments Incorporated

CD40175BM Summary of contents

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    ... SCHS105C − Revised October 2003 The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated ...

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    ... Orderable Device Status CD40175BE ACTIVE CD40175BEE4 ACTIVE CD40175BF3A ACTIVE CD40175BM ACTIVE CD40175BM96 ACTIVE CD40175BM96E4 ACTIVE CD40175BM96G4 ACTIVE CD40175BME4 ACTIVE CD40175BMG4 ACTIVE CD40175BMT ACTIVE CD40175BMTE4 ACTIVE CD40175BMTG4 ACTIVE CD40175BNSR ACTIVE CD40175BNSRE4 ACTIVE CD40175BNSRG4 ACTIVE CD40175BPWR ACTIVE CD40175BPWRE4 ACTIVE CD40175BPWRG4 ACTIVE CD40175BW OBSOLETE ...

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    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free ...

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    ... TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Type Drawing CD40175BM96 SOIC CD40175BNSR SO NS CD40175BPWR TSSOP PW PACKAGE MATERIALS INFORMATION Pins SPQ Reel Reel Diameter Width (mm) W1 (mm 2500 330.0 16.4 16 2000 330.0 16.4 16 2000 330.0 12.4 Pack Materials-Page 1 ...

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    ... Device Package Type CD40175BM96 SOIC CD40175BNSR SO CD40175BPWR TSSOP PACKAGE MATERIALS INFORMATION Package Drawing Pins SPQ Length (mm 2500 NS 16 2000 PW 16 2000 Pack Materials-Page 2 30-Jul-2010 Width (mm) Height (mm) 333.2 345.9 28.6 346.0 346.0 33.0 346.0 346.0 29.0 ...

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    ... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’ ...