nssm038at NICHIA CORPORATION, nssm038at Datasheet - Page 5

• Manufacturer Part Number: nssm038at
• Description: Specifications For Nichia Chip Type Full Color Led
• Manufacturer: NICHIA CORPORATION

7.CAUTIONS
(1) Moisture Proof Package
(2) Storage
(3) Heat Generation
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
· The moisture proof package is made of an aluminum moisture proof bag.
· Storage Conditions
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
· This product has silver plated metal parts that are inside and/or outside the package body.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
· Thermal design of the end product is of paramount importance.
· During operation of the LEDs the total power dissipation of the diode elements (red, green, and blue)
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
to a minimum in the package.
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
time, baking treatment should be performed using the following conditions.
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
condensation can occur.
of the LED when making the system design.
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
within the LEDs must not exceed the maximum power dissipation.
Before opening the package :
After opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
Baking treatment : more than 24 hours at 65 ± 5°C
is recommended.
The LEDs should be kept at 30°C or less and 70%RH or less.
within 168 hours (7days) after opening the package.
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
For this reason, the moisture proof package is used to keep moisture
The coefficient of temperature increase per input
-4-
If unused LEDs remain, they should be
Please consider the heat generation
The LEDs should be soldered
Nichia STSE-CM6073A-3
A package of
<Cat.No.071207>
The silver