nssm038at NICHIA CORPORATION, nssm038at Datasheet - Page 6

• Manufacturer Part Number: nssm038at
• Description: Specifications For Nichia Chip Type Full Color Led
• Manufacturer: NICHIA CORPORATION

(4) Soldering Conditions
(5) Cleaning
2.5 ~ 5°C / sec.
· The LEDs can be soldered in place using the reflow soldering method.
· Recommended soldering conditions
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
· Repairing should not be done after the LEDs have been soldered.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
· Do not clean the LEDs by the ultrasonic.
guarantee on the LEDs after they have been assembled using the dip soldering method.
[Temperature-profile (Surface of circuit board) ]
[Recommended soldering pad design]
during air reflow.
a double-head soldering iron should be used.
characteristics of the LEDs will or will not be damaged by repairing.
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
Pre-heat
Pre-heat time
Peak
Soldering time
Condition
temperature
<
Although the recommended soldering conditions are specified in the above table, reflow or hand
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
soldering at the lowest possible temperature is desirable for the LEDs.
1
: Lead Solder>
2.5 ~ 5°C / sec.
120 ~ 150°C
120sec.Max.
Pre-heating
120 ~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
Temperature - profile
1.6
2.2
2.9
3.5
5.5
0.3
Lead Solder
It is recommended that the User use the nitrogen reflow method.
60sec.Max.
Above 200
Reflow Soldering
°C
240°C Max.
10sec. Max.
1
.
180 ~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
(N
Temperature - profile
2
reflow is recommended.)
Use the following conditions shown in the figure.
Lead-free Solder
When it is absolutely necessary, the influence of ultrasonic
(Unit : mm)
It should be confirmed beforehand whether the
-5-
Use the conditions shown to the under figure.
1 ~ 5°C / sec.
<
2
: Lead-free Solder>
2
.
Temperature
Soldering time
1 ~ 5°C / sec.
180 ~ 200°C
120sec.Max.
Pre-heating
When repairing is unavoidable,
Hand Soldering
Nichia cannot make a
Nichia STSE-CM6073A-1
60sec.Max.
Above 220°C
350°C Max.
3 sec. Max.
(one time only)
<Cat.No.070119>
260°C Max.
10sec. Max.
When using