c450xt420-0125-a Cree, Inc., c450xt420-0125-a Datasheet

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c450xt420-0125-a

Manufacturer Part Number
c450xt420-0125-a
Description
Xthin Leds
Manufacturer
Cree, Inc.
Datasheet
XThin
CxxxXT420-Sxx00-A
Cree’s XThin LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree’s
proprietary G•SiC
geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond
connection. These vertically structured LED chips are approximately 175 microns in height and require a low forward
voltage. Cree’s XT™ chips are tested for conformity to optical and electrical specifications and the ability to withstand
1000 V ESD. Applications for XThin LEDs include next-generation mobile appliances for use in their LCD backlights and
digital camera flash where brightness, sub-miniaturization, and low power consumption are required.
FEATURES
CxxxXT420-Sxx00-A Chip Diagram
Top View
XThin LED Performance
Low Forward Voltage
Single Wire Bond Structure
Class 2 ESD Rating
450 nm – 24 mW min.
®
®
LEDs
substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a
G•SiC LED Chip
420 x 420 μm
Gold Bond Pad
105 μm Diameter
Subject to change without notice.
www.cree.com
Bottom View
APPLICATIONS
LCD Backlighting
Digital Camera Flash for Mobile Appliance
LED Video Displays
Audio Product Display Lighting
Backside
Metalization
SiC Substrate
t = 175 µm
Cathode (-)
Anode (+)
Die Cross Section


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c450xt420-0125-a Summary of contents

Page 1

XThin LEDs ® CxxxXT420-Sxx00-A Cree’s XThin LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree’s proprietary G•SiC substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a ® geometrically enhanced ...

Page 2

... Storage Temperature Range Electrostatic Discharge Threshold (HBM) Note 2 Electrostatic Discharge Classification (MIL-STD-883E) Typical Electrical/Optical Characteristics at T Part Number Forward Voltage (V Min. C450XT420-Sxx00-A 2.6 Mechanical Specifications Description P-N Junction Area (μm) Top Area (μm) Bottom Area (µm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Au Bond Pad Thickness (μ ...

Page 3

... LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die form only one bin. Sorted die kit (CxxxXT420-Sxx00-A) orders may be filled with any or all bins (CxxxXT420-01xx-A) contained in the kit. All radiant flux and dominant wavelength values shown and specified are mA. XT-24 C450XT420-0125-A 30.0 mW C450XT420-0121-A 27.0 mW C450XT420-0117-A 24 ...

Page 4

... If (mA) Copyright © 2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC, XBright and XThin are registered trademarks, and trademark of Cree, Inc. 4 CPR3DB Rev. - 2.00 1.00 0.00 -1.00 -2.00 0.0 2 ...

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