upc2766gs Renesas Electronics Corporation., upc2766gs Datasheet

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upc2766gs

Manufacturer Part Number
upc2766gs
Description
Wide Band Iq Demodulator For Digital Video/data Receiver
Manufacturer
Renesas Electronics Corporation.
Datasheet
Document No. P10193EJ4V0DS00 (4th edition)
Date Published October 1999 N CP(K)
Printed in Japan
DESCRIPTION
compressed video or spread spectrum receivers. This IC consists of a wide band RF amplifier, gain control amplifier,
dual balanced mixers (DBM), Lo buffers, and I & Q output buffer amplifiers.
for high-density surface mount.
FEATURES
• Broadband operation
• Wideband IQ phase and amplitude balance
• AGC dynamic range
• Low distortion; IM
• Supply Voltage
• Packaged in 20 pin SSOP or 20 pin SOP suitable for high-density surface mount
ORDERING INFORMATION
PC2766GR-E1
PC2766GS-E1
WIDE BAND IQ DEMODULATOR FOR DIGITAL VIDEO/DATA RECEIVER
The PC2766GR/GS is a Silicon monolithic IC designed for use as IQ demodulator in wide dynamic range
The package is 20 pin SSOP (shrink small outline package:
PART NUMBER
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
3
20 pin plastic SSOP (225 mil)
20 pin plastic SOP (300 mil)
RF & LO up to 1 000 MHz
IF (IQ) up to 200 MHz
45 dB
30 dBc
5 V
PACKAGE
BIPOLAR ANALOG INTEGRATED CIRCUIT
Caution electro-static sensitive device
The mark
DATA SHEET
shows major revised points.
Amplitude balance
Phase balance
Embossed tape 12 mm wide. 2.5 k/REEL
Pin 1 indicates pull-out direction of tape
Embossed tape 24 mm wide. 2.5 k/REEL
Pin 1 indicates pull-out direction of tape
PC2766GR) or 20 pin SOP ( PC2766GS) suitable
PC2766GR/GS
PACKAGE STYLE
0.3 dB (TYP.)
0.3 degree (TYP.)
©
1995, 1999

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upc2766gs Summary of contents

Page 1

WIDE BAND IQ DEMODULATOR FOR DIGITAL VIDEO/DATA RECEIVER DESCRIPTION The PC2766GR/ Silicon monolithic IC designed for use as IQ demodulator in wide dynamic range compressed video or spread spectrum receivers. This IC consists of a wide band RF ...

Page 2

INTERNAL BLOCK DIAGRAM I out I out GND IF I-IF Amp. I-Lo.Buff.Amp I-MIX trim Vcc Vcc IF GND Q out Q out ...

Page 3

PIN FUNCTIONS PIN VOLTAGE PIN No. PIN NAME TYP. ( Trim 4.2 Trimming pin for I-IF output 5.0 Power supply pin for I-MIXER 5.0 Power supply pin for RF and ...

Page 4

PIN VOLTAGE PIN No. PIN NAME TYP. (V) 11 Qout 3.3 Q-IF output pin. 11 pin and 12 pin are balance outputs. 12 Qout 3.3 13 GNDIF Q 0.0 Ground pin of Q-IF block 2.2 Oscillator signal ...

Page 5

ABSOLUTE MAXIMUM RATINGS (T PC2766GR PARAMETER SYMBOL Supply voltage Power dissipation Operating temperature range Storage temperature range PC2766GS PARAMETER SYMBOL Supply voltage Power dissipation Operating temperature range Storage temperature range Note 1 Mounted 1.6 mm double epoxy ...

Page 6

ELECTRICAL CHARACTERISTICS (V PC2766GR/GS PARAMETER SYMBOL Supply current RF input bandwidth output bandwidth IF BW Gain control range IQ phase balance IQ amplitude balance Output voltage Conversion gain STANDARD CHARACTERISTICS (REFERENCE VALUES) (V PC2766GR/GS PARAMETER SYMBOL Noise ...

Page 7

TYPICAL CHARACTERISTICS – on Measurement Circuit – (Note 2 Lower local) CG vs. f (Iout MHz dBm Vagc = 0 V Note ˚C T ...

Page 8

IQ PHASE BALANCE vs ˚ ˚ MHz dBm dBm P LO ...

Page 9

IM vs. Vagc (Iout 480 MHz RF1 f = 490 MHz RF2 f = 440 MHz Pin = _ 20 dBm each = _ 10 dBm ...

Page 10

MEASUREMENT CIRCUIT (@ Z = 250 ) L I out 200 Note 300 nH 250 1 000 pF 1 000 I-IF Amp. I-Lo.Buff.Amp I-MIX 000 pF 1 000 pF ...

Page 11

APPLICATION CIRCUIT EXAMPLE I out I out LPF LPF 1 000 pF 1 000 I-IF Amp. I-Lo.Buff.Amp. I-MIX 000 pF 1 000 pF 1 000 Bias Trim OSC ...

Page 12

PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm 6.7 0.3 1.8 MAX. 1.5 0.1 0.15 0.65 +0.10 0.10 M 0.22 –0.05 0.1 0.1 NOTE Each lead centerline is located within 0. its true position ...

Page 13

PIN PLASTIC SOP (300 mil) (UNIT: mm 12.7 0.3 1.55 0.1 1.27 0.4 0.1 0.12 M 0.1 0.1 1.8 MAX. NOTE Each lead centerline is located within 0. its true position (T.P.) at maximum material ...

Page 14

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used or in case soldering is done under different conditions. For details ...

Page 15

Data Sheet P10193EJ4V0DS00 PC2766GR/GS 15 ...

Page 16

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. No part of this document may be copied or reproduced in any form or by any means ...

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