upc8220t5a Renesas Electronics Corporation., upc8220t5a Datasheet

upc8220t5a

Manufacturer Part Number

upc8220t5a

Description

Tx And Rx Mcp Ic For 1.9 Ghz Phs

Manufacturer

Renesas Electronics Corporation.

Datasheet

1.UPC8220T5A.pdf (11 pages)

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Document No. PU10532EJ01V0DS (1st edition)

Date Published November 2004 CP(K)

Printed in Japan

DESCRIPTION

LDMOS designed for use as transmitting and receiving for 1.9 GHz PHS.

(Lateral Diffusion MOS FET Process).

FEATURES

− Tx Block −

• Circuit Current (DRV + PA) : I = 160 mA TYP. @ V

• Output Power

• Power Gain

• Adjacent Channel Power : P

• Harmonics Frequency Level : 2f

• Gain 1 dB Compression Output Power : P

− Rx Block −

• Circuit Current

• Convertion Gain

• Noise Figure

• Input 3rd Order Distortion : IIP

• Image Rejection Ratio

• High-density Surface Mounting : 16-pin plastic TSON package (3.3 × 2.3 × 0.6 mm)

APPLICATION

• PHS

ORDERING INFORMATION

Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

PC8220T5A-E1

Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact

Remark To order evaluation samples, contact your nearby sales office.

Intercept Point

The

This device is packaged in surface mount 16-pin plastic TSON (Thin Small Outline Non-leaded) package.

This IC manufactured using our 50 GHz f

Part Number

The information in this document is subject to change without notice. Before using this document, please confirm that

this is the latest version.

Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices

representative for availability and additional information.

PC8220T5A is MCP (Multi Chip Packaging) IC consisted of silicon germanium (SiGe) bipolar process and

your nearby sales office.

Part number for sample order:

PC8220T5A-E1-A

Order Number

: P

: G

: P

: 3f

: I

: CG = 21.5 dB TYP. @ f

: NF = 3.1 dB TYP. @ SSB

: IMR = 40 dBc TYP. @ f

Tx AND Rx MCP IC FOR 1.9 GHz PHS

out

adj1

adj2

= 39.5 dB MIN. @ V

= −45 dBc TYP. @ V

= −60 dBc TYP. @ V

= 11.5 mA TYP. @ V

= +20.5 dBm MIN. @ V

= −14.5 dBm TYP. @ f

= −65 dBc TYP. @ V

= −70 dBc TYP. @ V

16-pin plastic TSON

(Pb-Free)

BIPOLAR ANALOG INTEGRATED CIRCUIT

PC8220T5A

O (1 dB)

max

Package

DATA SHEET

UHS2 (Ultra High Speed Process) SiGe bipolar process and LDMOS

Note

= +21 dBm TYP. @ V

RF1

= V

= 1.9 GHz, f

= V

RF1

= V

= 1.9 GHz, f

= 3.0 V

= V

= 3.0 V, f = 1.9 GHz, P

= 1.9 GHz, f

= V

= 3.0 V, f = 1.9 GHz, P

Marking

= 3.0 V, P

8220

= 3.0 V, f = 1.9 GHz, P

RF2

= 240 MHz, f

• Embossed tape 12 mm wide

• Pin 8, 9 face the perforation side of the tape

• Qty 3 kpcs/reel

RF2

out

= 1.42 GHz, P

= +20.5 dBm

= 1.9006 GHz, P

= V

= 3.0 V

PC8220T5A

= −19 dBm, P

= 1.66 GHz



Supplying Form

= −19 dBm

out

NEC Compound Semiconductor Devices, Ltd. 2004

= −35 dBm/tome

= +20.5 dBm,

= −19 dBm

= −35 dBm/tome

out

= +20.5 dBm

∆

±600 kHz

±900 kHz

Related parts for upc8220t5a

upc8220t5a Summary of contents

Page 1

Tx AND Rx MCP IC FOR 1.9 GHz PHS DESCRIPTION µ The PC8220T5A is MCP (Multi Chip Packaging) IC consisted of silicon germanium (SiGe) bipolar process and LDMOS designed for use as transmitting and receiving for 1.9 GHz PHS. This ...

Page 2

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View Block NOTE ON CORRECT USE Exposed heatsink at bottom on package that is combined with GND (ground) must be soldered to PCB RF/DC ...

Page 3

RECOMMENDED OPERATING RANGE (T Parameter Symbol LNA Output Voltage V LNAout Mixer Output Voltage Driver Output Voltage Drain-Source Voltage V PA Gate-Source Voltage V Operating Ambient Temperature T RF Input Frequency ...

Page 4

ELECTRICAL CHARACTERISTICS − Tx Block − +25° Parameter Symbol Threshold Voltage V Gate-Source Voltage V Circuit Current (DRV + PA) Input Return Loss RL Output Return Loss RL Output Power P Power ...

Page 5

EVALUATION CIRCUIT ( 0.5 pF 1.0 pF 4.7 nH 0 100 3 1.5 pF 1 OUT 1 100 ...

Page 6

TYPICAL CHARACTERISTICS (T − Tx Block − 3 1.9 GHz OUTPUT POWER, ADJACENT CHANNEL POWER vs. INPUT POWER 25 P out 20 15 –600 +600 10 –30 –25 –20 Input ...

Page 7

Rx Block − 3 1.90 GHz RF1 f = 1.66 GHz) Lo CONVERTION GAIN vs. LOCAL INPUT POWER –19 –17 –15 –13 Local Input Power P (dBm) Loin ...

Page 8

PACKAGE DIMENSIONS 16-PIN PLASTIC TSON (UNIT: mm) 3.5±0.15 3.3±0.1 0.16±0.05 Remark ( ) : Reference value 8 0.4±0.05 (Bottom View) (0.55) (2.2) Data Sheet PU10532EJ01V0DS µ PC8220T5A ...

Page 9

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...

Page 10

The information in this document is current as of November, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date ...

Page 11

For further information, please contact NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office ...

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