upc3223tb Renesas Electronics Corporation., upc3223tb Datasheet
upc3223tb
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upc3223tb Summary of contents
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MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC3223TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz f UHS0 (Ultra High Speed Process) silicon bipolar process. max FEATURES • Wideband ...
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PIN CONNECTIONS (Top View PRODUCT LINE- V-BIAS SILICON MMIC MEDIUM OUTPUT AMPLIFIER ( GHz out O(sat) Part No. ...
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PIN EXPLANATIONS PIN Applied Pin Voltage Pin Name No. Voltage (V) 1 INPUT – 4 OUTPUT Voltage as same through external inductor 6 V 4 GND Note Pin Voltage is ...
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ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V Total Circuit Current I Power Dissipation P Operating Ambient Temperature T Storage Temperature T Input Power P Note Mounted on double-sided copper-clad 50 RECOMMENDED OPERATING RANGE Parameter Symbol Supply Voltage V Operating ...
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OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY ( out S Parameter Symbol Output Intercept Point OIP = Test Conditions f = 1.0 GHz 3 ...
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TEST CIRCUIT 100 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Chip Capacitor ...
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ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN C1 COMPONENT LIST Notes Value 100 000 100 ...
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TYPICAL CHARACTERISTICS (T CIRCUIT CURRENT vs. SUPPLY VOLTAGE 30 No input signal 85˚ 25˚ Supply Voltage V (V) CC POWER ...
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POWER GAIN vs. FREQUENCY 5 40˚ 85˚ 25˚ 0.1 1.1 2.1 3.1 4.1 Frequency f (GHz) ISOLATION vs. FREQUENCY 0 V ...
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OUTPUT POWER vs. INPUT POWER 1.0 GHz T = 25˚ 5 Input Power P (dBm) in ...
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S-PARAMETERS ( FREQUENCY 11 S FREQUENCY 5.0 V) out 1.0 GHz 2.2 GHz 1.0 GHz 2.2 GHz Data Sheet PU10491EJ01V0DS PC3223TB 11 ...
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PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 12 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet PU10491EJ01V0DS PC3223TB ...
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NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with ...
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The information in this document is current as of May, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications ...
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For further information, please contact NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) 5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong ...