mt46h32m32lfjg-6it Micron Semiconductor Products, mt46h32m32lfjg-6it Datasheet
mt46h32m32lfjg-6it
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NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP™) MT29CxGxxMAxxxxx Features ® • Micron NAND Flash and LPDRAM components • RoHS-compliant, “green” package • Separate NAND Flash and LPDRAM interfaces • Space-saving multichip package/package-on-package combination • ...
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Part Numbering Information Micron NAND Flash and LPDRAM devices are available in different configurations and densities. Figure 2: 168-Ball Part Number Chart MT 29C 2G 24M A Micron Technology Product Family 29C = NAND + LPDRAM MCP NAND Density 1G ...
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... NAND Product LPDDR Product MT29F2G16ABDHC-ET MT46H32M32LFJG-6 IT MT29F2G16ABDHC-ET MT46H32M32LFJG-6 IT MT29F2G16ABDHC-ET MT46H32M32LFJG-6 IT MT29F2G16ABDHC-ET MT46H32M32LFJG-6 IT MT29F4G16ABCWC-ET MT46H32M32LFJG-6 IT MT29F4G16ABCWC-ET MT46H32M32LFJG-6 IT MT29F4G16ABCWC-ET MT46H32M32LFJG Micron Technology, Inc. reserves the right to change products or specifications without notice. Part Numbering Information Physical Part Marking JW192 JW193 JW256 JW255 JW426 JW295 JW294 © ...
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MCP General Description Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low- power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices ...
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Ball Assignments and Descriptions Figure 3: 168-Ball VFBGA (NAND x8; LPDDR x16) Ball Assignments DNU DNU DQ14 Vddq DQ12 UDM Vddq B DNU DNU DQ15 Vssq DQ13 UDQS Vssq ...
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Figure 4: 168-Ball VFBGA (NAND x16; LPDDR x32) Ball Assignments DNU DNU DQ17 Vddq DQ19 DM2 Vddq B DNU DNU DQ16 Vssq DQ18 DQS2 Vssq C DM0 DQS0 D DQ7 DQ6 E Vddq ...
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Table 2: x8, x16 NAND Ball Descriptions Symbol CE0#, CE1# I/O[7:0] (x8) I/O[15:0] (x16) 1. Balls marked RFU may or may not be connected internally. These balls should not be Note: used. Contact factory for details. PDF: 09005aef83070ff3 168ball_nand_lpdram_j4xx_omap.pdf - ...
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Table 3: x16, x32 LPDDR Ball Descriptions Symbol A[14:0] (x16) A[14:0] (x32) BA0, BA1 CK, CK# CKE0, CKE1 CS0#, CS1# UDM, LDM (x16) DM[3:0] (x32) DQ[15:0] (x16) DQ[31:0] (x32) UDQS, LDQS (x16) DQS[3:0] (x32) 1. Balls marked RFU may or ...
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Table 4: Non-Device-Specific Descriptions Symbol Symbol Note: 1. Balls marked RFU may or may not be connected internally. These balls should not be used. Contact factory for details. PDF: 09005aef83070ff3 168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09 168-Ball NAND Flash and LPDRAM ...
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Electrical Specifications Table 5: Absolute Maximum Ratings Parameters/Conditions Vcc, Vdd, Vddq supply voltage relative to Vss Voltage on any pin relative to Vss Storage temperature range Note: 1. Supply voltage references Vcc, Vdd, or Vddq. Stresses greater than those listed ...
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Device Diagrams Figure 5: 168-Ball (Single LPDDR) Functional Block Diagram CE0# CLE ALE RE# WE# WP# LOCK CS0# CK CK# CKE0 RAS# CAS# WE# Address, BA0, BA1 PDF: 09005aef83070ff3 168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09 168-Ball NAND Flash and LPDRAM PoP ...
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Figure 6: 168-Ball (Dual LPDDR) Functional Block Diagram CS0, CS1# CKE0, CKE1 Address, BA0, BA1 PDF: 09005aef83070ff3 168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP CE0# CLE ALE NAND Flash RE# WE# WP# CK ...
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Package Dimensions Figure 7: 168-Ball VFBGA (Package Code: JG) Seating plane A 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0.27 SMD 2322 212019 18 171615 ball pads. 0.5 TYP 11 CTR ...
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Figure 8: 168-Ball VFBGA (Package Code: JI) Seating plane A 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. 1716 151413 121110 ...
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Figure 9: 168-Ball WFBGA (Package Code: KQ) Seating plane A 0.08 A 168X Ø0.34 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. ...
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Revision History Rev. I, Preliminary – 6/09 • Updated Figure 2 (page 2) for NAND Flash Configuration codes by adding "y" informa- tion: y (x8, 4Gb, Second) and z (x16, 4Gb, second). • Changed ball Y22 from NC to A14 ...
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Rev. D, Preliminary – 04/08 • Changed status to preliminary. • Figure 2: 168-Ball Part Number Chart on page 2: Added JI part number and package code. • Figure 3: Ball Assignment: 168-Ball VFBGA (x8 NAND Flash and x16 LPDRAM); ...