mc100lvep210 ON Semiconductor, mc100lvep210 Datasheet - Page 8

• Manufacturer Part Number: mc100lvep210
• Description: Low-voltage 1 5 Dual Diff.lvecl/lvpecl/lvepecl/hstl Clock Driver
• Manufacturer: ON Semiconductor

SEATING
PLANE
9
B
-AB-
-AC-
B1
-T-
8
1
32
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DATUM PLANE -AB- IS LOCATED AT
4. DATUMS -T-, -U-, AND -Z- TO BE
5. DIMENSIONS S AND V TO BE
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE
8. MINIMUM SOLDER PLATE THICKNESS
9. EXACT SHAPE OF EACH CORNER MAY
PER ANSI Y14.5M, 1982.
MILLIMETER.
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -AB-.
DETERMINED AT SEATING PLANE -AC-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
SHALL BE 0.0076 (0.0003).
VARY FROM DEPICTION.
-Z-
25
4X
17
4X
0.20 (0.008)
-U-
0.20 (0.008)
V1
PACKAGE DIMENSIONS
DETAIL AD
V
MC100LVEP210
http://onsemi.com
AB
32 LEAD LQFP
CASE 873A-02
AC
T-U
ISSUE C
T-U
8
Z
C
Z
E
P
H
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.450
0.090
0.150
8X
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1
12 REF
_
M_
_
DETAIL AD
W
1.600
0.450
1.450
0.400
0.150
0.200
0.750
0.160
0.250
MAX
5
DETAIL Y
_
0.055
0.012
0.053
0.012
0.002
0.004
0.018
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
_
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.030
0.006
0.010
X
5
_
AE
AE
K
R
Q_
SECTION AE-AE
É É
É É É É
É É
F
METAL
BASE
J
N
D