74lvc2g08dp NXP Semiconductors, 74lvc2g08dp Datasheet
74lvc2g08dp
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74lvc2g08dp Summary of contents
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Dual 2-input AND gate Rev. 06 — 4 September 2007 1. General description The 74LVC2G08 provides a 2-input AND gate function. Inputs can be driven from either 3 devices. This feature allows the use of ...
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... Type number Package Temperature range Name 74LVC2G08DP +125 C 74LVC2G08DC +125 C 74LVC2G08GT +125 C 74LVC2G08GM +125 C 4. Marking Table 2. Marking Type number 74LVC2G08DP 74LVC2G08DC 74LVC2G08GT 74LVC2G08GM 5. Functional diagram mna724 Fig 1. Logic symbol Fig 3. Logic diagram (one gate) ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 4. Pin configuration TSSOP8 and VSSOP8 74LVC2G08 GND 4 Transparent top view Fig 5. Pin configuration XSON8 6.2 Pin description Table 3. Pin description Symbol Pin TSSOP8, VSSOP8 GND ...
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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level don’t care 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter [ +85 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage LOW-level output voltage OL I input leakage current ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage LOW-level output voltage OL I input leakage current I I power-off leakage current V OFF I supply current CC I additional supply current CC [1] All typical values are measured ...
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... NXP Semiconductors C = output load capacitance in pF supply voltage number of inputs switching sum of outputs 12. Waveforms Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 7. Input (nA, nB) to output (nY) propagation delays Table 9 ...
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... NXP Semiconductors Test data is given in Table 10. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Test voltage for switching times EXT Fig 8. Load circuitry for switching times Table 10 ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 0.15 1.55 OUTLINE VERSION IEC SOT902 Fig 12 ...
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... Revision history Document ID Release date 74LVC2G08_6 20070904 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • In current. 74LVC2G08_5 20060515 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...