pcf8812 NXP Semiconductors, pcf8812 Datasheet

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pcf8812

Manufacturer Part Number
pcf8812
Description
65 X 102 Pixels Matrix Lcd Driver
Manufacturer
NXP Semiconductors
Datasheet

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pcf8812U/2/F1.026
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Product specification
Supersedes data of 2000 Nov 22
DATA SHEET
PCF8812
65
102 pixels matrix LCD driver
INTEGRATED CIRCUITS
2004 Feb 23

Related parts for pcf8812

pcf8812 Summary of contents

Page 1

... DATA SHEET PCF8812 65 102 pixels matrix LCD driver Product specification Supersedes data of 2000 Nov 22 INTEGRATED CIRCUITS 2004 Feb 23 ...

Page 2

... Set X address of RAM 10.7 Set HV-generator stages 10.8 Bias system 10.9 Temperature control 10.10 Set V value OP 11 LIMITING VALUES 12 HANDLING 13 DC CHARACTERISTICS 14 AC CHARACTERISTICS 15 APPLICATION INFORMATION 16 BONDING PAD INFORMATION 16.1 PCF8812U/2DA/2 16.2 PCF8812/2/F1 17 TRAY INFORMATION 17.1 Tray dimensions 18 DEVICE PROTECTION DIAGRAM 19 DATA SHEET STATUS 20 DEFINITIONS 21 DISCLAIMERS 2 Product specification PCF8812 ...

Page 3

... Feb 23 2 Telecom equipment. 3 The PCF8812 is a low power CMOS LCD controller driver, also possible) designed to drive a graphic display of 65 rows and LCD 102 columns. All necessary functions for the display are provided in a single chip, including on-chip generation of LCD supply and bias voltages, resulting in a minimum of external components and low power consumption ...

Page 4

... SDIN SCLK D/C SCE Fig.1 Block diagram. 4 Product specification ROW0 to ROW64 36, 139 to 156, 65 159 to 172 ROW DRIVERS SHIFT REGISTER RESET OSCILLATOR TIMING GENERATOR DISPLAY ADDRESS COUNTER PCF8812 16 17 157 158 173 n.c. PCF8812 1 RES 194 OSC mgt636 ...

Page 5

... An external LCD supply voltage can be supplied using the test 2 output V LCDIN serial clock input and the internal voltage generator has to be programmed negative power supply to zero. If the PCF8812 is in Power-down mode, the voltage 2 external LCD supply voltage has to be switched off. negative power supply voltage 1 7.1.6 test 1 input Positive power supply for the liquid crystal display ...

Page 6

... E and D in the command ‘display control’ (see Table 2). 8.6 LCD row and column drivers The PCF8812 contains 65 row and 102 column drivers, the SS which connect the appropriate LCD bias voltages in sequence to the display in accordance with the data to be displayed ...

Page 7

... V (t) = C1(t) R0(t). state1 (2) V (t) = C1(t) R1(t). state2 2004 Feb 23 frame n frame n ... 8... Fig.2 Typical LCD driver waveforms. 7 Product specification PCF8812 1 V state1 (t) V state2 ( LCD LCD ...

Page 8

... Philips Semiconductors 65 102 pixels matrix LCD driver 9 ADDRESSING bank 0 bank 1 bank 2 bank 3 bank 7 bank 8 2004 Feb 23 DDRAM MGS395 Fig.3 DDRAM to display mapping. 8 Product specification PCF8812 top of LCD LCD ...

Page 9

... Philips Semiconductors 65 102 pixels matrix LCD driver Data is downloaded in bytes into the RAM matrix of the PCF8812 as indicated in Figs. and 6. The display RAM has a matrix of 65 102 bits. The columns are addressed by the address pointer. The address ranges are X101 (110 0101b) and (1000b). ...

Page 10

... RAM. After every data byte the address counter is incremented automatically. The level of the D/C signal is read during the last bit period of each data byte. Each instruction can be sent to the PCF8812 in any order. The MSB of a byte is transmitted first. One possible command stream used to set-up the LCD driver is shown in Fig ...

Page 11

... Fig.7 General format of data stream. set V OP bias system function set ( display control Fig.8 Example of serial data stream. DB6 DB5 DB4 DB3 Fig.9 Serial bus protocol transmission of one byte. 11 Product specification MGT639 temperature control Y address X address MGT640 DB2 DB1 DB0 MGT641 PCF8812 ...

Page 12

... DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig.11 Serial interface reset (RES). DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig.12 Serial interface enable (SCE). 12 Product specification PCF8812 DB7 DB6 DB5 MGT642 DB7 DB6 DB5 DB4 mgt644 ...

Page 13

... X do not use set temperature coefficient 1 0 (TCx HV-gen voltage 1 0 multiplication set bias system (BSx not use (reserved for test write V to register PCF8812 ...

Page 14

... VHRL DD All LCD outputs Product specification 1 RESET STATE TC1 to TC0 = 0000000 OP OP BS2 to BS0 = 000 is equal to 0; the HV-generator is switched off and bit PRS = (display off). SS PCF8812 ...

Page 15

... The X address points to the columns. The range 101 (65H). 10.7 Set HV-generator stages The PCF8812 incorporates a software configurable voltage multiplier. After reset (RES) the voltage multiplier is set Other voltage multiplier factors are set via the command ‘Set voltage multiplier factor’ (see Tables 1 and 2). ...

Page 16

... LCD LCD LCD LCD LCD Product specification PCF8812 1 bias system. Different multiplex rates ----------------- RECOMMENDED n MUX RATE 100 ...

Page 17

... LCD controlling voltage V increased with lower temperature to maintain optimum contrast. There are 4 different temperature coefficients available in the PCF8812 (see Fig.13). The coefficients are selected by bits TC1 to TC0. Table 6 shows the typical values of the different temperature coefficients. The coefficients are proportional to the programmed V ...

Page 18

... (programmed) [00H to 7FH; programming range LOW and HIGH]. OP 2004 Feb 5FH 6FH 7FH 00H 01H 02H 03H 04H 05H 06H LOW ( PRS = 0 ) Fig.14 V programming of PCF8812 ( Product specification PCF8812 . . . 5FH 6FH 7FH HIGH ( PRS = mgs658 ) ...

Page 19

... Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take normal precautions appropriate to handling MOS devices (see “Handling MOS devices” ). 2004 Feb 23 CONDITIONS MIN. 0.5 0.5 0.5 0 note 3 note 4 19 Product specification PCF8812 MAX. UNIT +6.5 V +4 +50 mA +10 ...

Page 20

... 7.6 V; DD1 LCD SCLK no display load; notes 2, 3 and DD1 SS1 outputs tested L one at a time outputs tested L one at a time 20 Product specification PCF8812 MIN. TYP. MAX. 2.5 5.5 2.5 4.5 4.5 9.0 4.5 9.0 220 350 ...

Page 21

... MIN. TYP. 300 0.76 10 1. LCD MIN. TYP 500 0 and a DD 250 100 100 60 100 100 PCF8812 MAX. UNIT +300 MAX. UNIT 67 kHz 67 kHz 4.0 MHz ...

Page 22

... S2 SCE t S3 D/C t PWL1 SCLK t S4 SDIN 2004 Feb 23 CONDITIONS note PWH1 t H4 Fig.15 Serial interface timing. 22 Product specification PCF8812 MIN. TYP. MAX. 100 100 100 100 100 t PWH2 cyc(clk UNIT mgt645 ...

Page 23

... Product specification PCF8812 MGT646 DISPLAY OPERATION SCE is going LOW function set; bit bit select extended instruction set (bit mode) set charge pump range HIGH (bit PRS = 1) set set to 7.6 V ...

Page 24

... Feb Product specification PCF8812 DISPLAY OPERATION data write MGS406 data write MGS407 data write MGS407 data write MGS409 data write MGS410 data write MGS411 ...

Page 25

... DISPLAY 102 32 102 PCF8812 ( VLCD C VDD I DISPLAY display control; set inverse video mode (bit bit MGS412 set X-address of RAM; set address to 0000000 MGS412 data write MGS414 65 33 reset MGT647 . DD Product specification PCF8812 OPERATION ...

Page 26

... Fig.19 Application diagram; external high voltage generation is used. 2004 Feb 23 DISPLAY 102 32 102 PCF8812 ( VDD2 V DD2 C VLCD I/O C VDD1 V DD1 V SS DISPLAY 102 32 102 PCF8812 ( VDD LCDIN I reset MGT648 (V DD DD1 65 33 reset MGT649 Product specification PCF8812 and V ). DD2 ...

Page 27

... VDD2 Higher capacitor values are recommended for ripple reduction. 16 BONDING PAD INFORMATION The PCF8812 is manufactured using n-well CMOS technology. The substrate The pinning of the PCF8812 is optimized for single plane wiring, such as chip-on-glass display modules; display size: 65 102 pixels. 16.1 PCF8812U/2DA/2 ...

Page 28

... PCF8812 y 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841.1 841 ...

Page 29

... DD2 4126.5 841.1 V DD2 4189.5 841.1 V DD2 4252.5 841.1 V DD2 4315.5 841.1 V DD2 4378.5 841.1 V DD2 29 Product specification PCF8812 COORDINATES PAD x y 155 4441.5 841.1 156 4504.5 841.1 157 4819.5 841.1 158 4788 841.1 159 4662 841.1 160 4599 841.1 ...

Page 30

... Alignment Mark 3 +747 841.1 Alignment Mark 4 +819 841.1 +1035 841.1 +1467 841 100 381 ( 25 Product specification PCF8812 COORDINATES PAD x 220 +1827 221 +1899 222 +1971 223 +2043 224 +2259 225 +2331 226 +2403 227 +2475 ...

Page 31

... Philips Semiconductors 65 102 pixels matrix LCD driver Table 11 Bonding pad locations for PCF8812/2/F1 All x and y coordinates represent the position of the centre of each pad (in m) with respect to the origin (x/y = 0/0) of the chip (see Fig.20). SYMBOL PAD RES 1 ROW 32 2 ROW 31 3 ROW 30 4 ROW 29 ...

Page 32

... PCF8812 x y 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934.6 934 ...

Page 33

... PCF8812 x y +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934.6 +934 ...

Page 34

... LCDOUT VLCDSENSE 237 Alignment marks Alignment Mark 1 Alignment Mark 2 Alignment Mark 3 Alignment Mark 4 2004 Feb 23 COORDINATES x y +3230 +934.6 +3310 +934.6 +3390 +934.6 +3470 +934.6 +3550 +934.6 +3630 +934.6 +5185 910.8 5185 910.8 4160 +909.7 +4160 +909.7 34 Product specification PCF8812 ...

Page 35

... Acrobat reader. white to force landscape pages to be ... PCF8812 PCF8812U/2DA/2 (1) The alignment marks are circular with a diameter (2) Maximum chip size: 1.92 9.84 mm. PCF8812U/2/F1 (1) The alignment marks are circular with a diameter of 100 m. (2) Maximum chip size: 2.1 10.9 mm. y 0,0 x Fig ...

Page 36

... Refer to Fig.20 for the orientation and position of the type name on the die surface. Fig.22 Tray alignment. 2004 Feb 1,1 2,1 3,1 1,2 2,2 1 SECTION A-A Fig.21 Tray details. MGT652 36 Product specification PCF8812 MGT651 ...

Page 37

... Product specification PCF8812 DESCRIPTION VALUE pocket pitch; x direction 13.77 mm pocket pitch; y direction 4.37 mm pocket width; x direction 11.04 mm pocket width; y direction 2.24 mm tray width; x direction 50.8 mm tray width; y direction 50.8 mm distance from cut corner 11. pocket (1 and 1) centre distance from cut corner 5 ...

Page 38

... Feb 23 V DD1 V DD3 V LCDIN V LCDOUT V LCDSENSE V SS1 V DD2 V SS1 V SS2 V SS2 V SS1 V LCDIN 1 per block V SS1 V SS1 Fig.23 Device protection diagram. 38 Product specification PCF8812 V DD1 T3 SS1 V SS1 V SS2 V DD1 SDIN SCLK SCE D/C OSC RES T1, T4 SS1 MGT650 ...

Page 39

... Product specification PCF8812 DEFINITION These products are not Philips Semiconductors ...

Page 40

... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 2004 Feb 23 40 Product specification PCF8812 ...

Page 41

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited ...

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