pcf8831 NXP Semiconductors, pcf8831 Datasheet

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pcf8831

Manufacturer Part Number
pcf8831
Description
Stn Rgb - 160 Output Row Driver
Manufacturer
NXP Semiconductors
Datasheet
INTEGRATED CIRCUITS
DATA SHEET
PCF8831
STN RGB - 160 output row driver
Preliminary specification
2002 Aug 14

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pcf8831 Summary of contents

Page 1

... DATA SHEET PCF8831 STN RGB - 160 output row driver Preliminary specification INTEGRATED CIRCUITS 2002 Aug 14 ...

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... Row driver 7.2 80-bit shift register 7.3 Row control 7.4 Frame control 8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 11.1 Power-up and power-down sequences 12 APPLICATION INFORMATION 13 INTERNAL PROTECTION CIRCUITS 14 BONDING PAD LOCATION 15 TRAY INFORMATION 16 DATA SHEET STATUS 17 DEFINITIONS 18 DISCLAIMERS 2002 Aug 14 Preliminary specification 2 PCF8831 ...

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... Mobile phones Personal Digital Assistant (PDA) Automotive information systems Point-of-sale terminals Instrumentation. 3 GENERAL DESCRIPTION The PCF8831 is a row driver for driving colour STN displays designed to operate with the PCF8832 column driver IC. PACKAGE DESCRIPTION chip with bumps in tray 3 Preliminary specification ...

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... BLOCK DIAGRAM handbook, full pagewidth ROWRES1 RCLK 2002 Aug R159 160 ROW DRIVERS SHIFT REGISTER 1 SHIFT REGISTER 2 ROW CONTROL ROWRES2 FI SVM SW1 SW2 R1F Fig.1 Block diagram. 4 Preliminary specification PCF8831 PCF8831 MGW629 ...

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... V HIGH-level LCD driving voltage; top level of the positive selecting pulse of row outputs LOW-level LCD driving voltage; bottom level of the negative selecting pulse of row outputs 5 Preliminary specification PCF8831 depending when SS ; connect ROWREST to the ...

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... Aug 14 7.2 Two shift registers of 80 bits each are contained in the PCF8831 row driver. With ROWRES1, the complete shift register will be reset at the next rising edge of RCLK. The two shift registers can be configured for different applications by row control signals R1F, SW1 and SW2. ...

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... SELECTED SW2 R79 R79 0 R79 R79 R80 to R159 1 R159 to R80 0 R80 to R159 1 R159 to R80 7 Preliminary specification PCF8831 SECOND REGISTER SELECTED R80 to R159 R159 to R80 R80 to R159 R159 to R80 R0 to R79 R0 to R79 R79 to R0 R79 to R0 ...

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... The signal FI controls frame inversion (Fig.4) and N-line inversion (Fig.5). Software control performed via the PCF8832 column driver. handbook, full pagewidth R159 2002 Aug 14 Frame n Frame Fig.4 Frame inversion. 8 Preliminary specification PCF8831 MGW632 ...

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... Philips Semiconductors STN RGB - 160 output row driver handbook, full pagewidth 2002 Aug MGW633 Fig.5 N-line inversion Preliminary specification PCF8831 ...

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... HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However totally safe recommended to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ). 2002 Aug 14 PARAMETER 10 Preliminary specification PCF8831 MIN. MAX. UNIT V 0 7.0 V ...

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... improves dynamic behaviour. A minimum level should be maintained 2 ------------------- - RCLK . = ------------------ - 2 160 11 Preliminary specification PCF8831 MIN. TYP. MAX 15 45 ------------------- - 2 note 2.0 V 1.25 M ...

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... RP, FI, ROWRES1 Fig.6 AC waveforms showing RCLK and data input. 2002 Aug +85 C; see Fig.6. L amb PARAMETER t RCLKL t RCLKH su(D) t h(D) 12 Preliminary specification PCF8831 MIN. TYP. MAX. 19.2 700 100 100 MGW634 UNIT ...

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... Philips Semiconductors STN RGB - 160 output row driver 11.1 Power-up and power-down sequences When the PCF8831 is powering-up or powering-down, the various supply voltages and some interface signals have to be applied in a certain sequence. Table 2 Power-up and power-down sequences +85 C; refer to Figs 7 and 8. ...

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... separate internal diode; see Table 2 and Fig.10. SS and V can be disconnected; see Table 2 and Fig.10 Fig.7 Power-up sequence. 14 Preliminary specification PCF8831 5 MGW635 ...

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... separate internal diode; see Table 2 and Fig.10. SS and pad V can be disconnected; see Table 2 and Fig.10 Fig.8 Power-down sequence. 15 Preliminary specification PCF8831 d(VH-VDD) (1) t d(VMH-VDD) (1) t d(VL-VDD) (2) (3) MGW636 ; see Table 2 and Fig.10. ...

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... COL LCK (1) Test inputs have to be tied to V (2) Row control signals are RCLK, RP, FI, SVM, RESROW1, RESROW2, SW1, SW2 and R1F. Fig.9 Application example using PCF8831 with PCF8832. 2002 Aug 160 PCF8831 ...

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... Protection diode maximum forward current = 5 mA. 2002 Aug pads 208 to 214 V SS pads 201 to 207 Fig.10 Protection circuit diagrams. 17 Preliminary specification PCF8831 R159 pads 161 MGW639 ...

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... R94 768.0 R93 768.0 R92 768.0 R91 768.0 R90 768.0 R89 768.0 R88 768.0 R87 768.0 R86 768.0 R85 768.0 R84 18 Preliminary specification PCF8831 PAD 3359.0 768.0 38 3284.0 768.0 39 3209.0 768.0 40 3134.0 768.0 41 3059.0 768.0 42 2984.0 768.0 43 2909.0 768 ...

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... R12 768.0 R11 768.0 R10 768.0 R9 768.0 R8 768.0 R7 768.0 R6 768.0 R5 768.0 R4 768.0 R3 768 Preliminary specification PCF8831 PAD x y 119 +2866.0 768.0 120 +2941.0 768.0 121 +3016.0 768.0 122 +3091.0 768.0 123 +3166.0 768.0 124 +3241.0 768.0 125 +3316.0 768 ...

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... H 865 865 865 865 865 865 865 Preliminary specification PCF8831 PAD x y 201 1139.0 865.7 202 1064.0 865.7 203 989.0 865.7 204 865.0 865.7 205 790.0 865.7 206 661.5 865.7 207 586.5 865.7 208 326 ...

Page 21

... Minimum pad pitch +865.7 Pad size; aluminium +865.7 Bump dimensions +865.7 Wafer thickness (excluding bumps) +865.7 handbook, halfpage pitch MGW640 21 Preliminary specification PCF8831 PAD x 263 5303.5 264 5378.5 265 5453.5 266 5528.5 267 5603.5 268 5678.5 269 5753.5 270 5978 ...

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... RCLK RP FI SVM ROWRES1 ROWRES2 R1F SW1 SW2 R79 R80 pad 243 . . . . . circle 1 R159 pad 272 pad 1 2.238 mm Fig.13 Bonding pad location. 22 Preliminary specification PCF8831 12.66 mm MGW638 ...

Page 23

... F E Fig.14 Tray details. Table 5 Tray dimensions DIMENSIONS MGW641 23 Preliminary specification PCF8831 MGS488 DESCRIPTION pocket pitch, x direction pocket pitch, y direction pocket width, x direction pocket width, y direction tray width, x direction tray width, y direction number of pockets in x direction ...

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... It is the responsibility of the customer to test and qualify their application in which the die is used. 24 Preliminary specification PCF8831 DEFINITIONS Philips Semiconductors All die are tested and are guaranteed to ...

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... Philips Semiconductors STN RGB - 160 output row driver 2002 Aug 14 NOTES 25 Preliminary specification PCF8831 ...

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... Philips Semiconductors STN RGB - 160 output row driver 2002 Aug 14 NOTES 26 Preliminary specification PCF8831 ...

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... Philips Semiconductors STN RGB - 160 output row driver 2002 Aug 14 NOTES 27 Preliminary specification PCF8831 ...

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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...

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