mc68hc708mp16 Freescale Semiconductor, Inc, mc68hc708mp16 Datasheet - Page 272

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mc68hc708mp16

Manufacturer Part Number
mc68hc708mp16
Description
M68hc08 Microcontrollers
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Serial Peripheral Interface Module (SPI)
13.11 Low-Power Mode
13.12 SPI During Break Interrupts
Technical Data
272
The WAIT instruction puts the MCU in a low-power-consumption stand-
by mode.
The SPI module remains active after the execution of a WAIT instruction.
In wait mode the SPI module registers are not accessible by the CPU.
Any enabled CPU interrupt request from the SPI module can bring the
MCU out of wait mode.
If SPI module functions are not required during wait mode, reduce power
consumption by disabling the SPI module before executing the WAIT
instruction.
The system integration module (SIM) controls whether status bits in
other modules can be cleared during the break state. The BCFE bit in
the SIM break flag control register (SBFCR) enables software to clear
status bits during the break state. (See
Module
To allow software to clear status bits during a break interrupt, write a
logic 1 to the BCFE bit. If a status bit is cleared during the break state, it
remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a logic 0 to the BCFE
bit. With BCFE at logic 0 (its default state), software can read and write
I/O registers during the break state without affecting status bits. Some
status bits have a two-step read/write clearing procedure. If software
does the first step on such a bit before the break, the bit cannot change
during the break state as long as BCFE is at logic 0. After the break,
doing the second step clears the status bit.
Since the SPTE bit cannot be cleared during a break with the BCFE bit
cleared, a write to the transmit data register in break mode does not
initiate a transmission, nor is this data transferred into the shift register.
Therefore, a write to the SPDR in break mode with the BCFE bit cleared
has no effect.
Serial Peripheral Interface Module (SPI)
(SIM).)
Section 7. System Integration
MC68HC708MP16
Freescale Semiconductor
Rev. 3.1

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