isp1760 NXP Semiconductors, isp1760 Datasheet - Page 98

no-image

isp1760

Manufacturer Part Number
isp1760
Description
Hi-speed Universal Serial Bus Host Controller For Embedded Applications
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
isp1760BE
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
isp1760BE
Quantity:
31
Part Number:
isp1760BE (LF)
Manufacturer:
PHI
Quantity:
20 000
Part Number:
isp1760BEGA
Manufacturer:
LEVELONE
Quantity:
450
Part Number:
isp1760BEGA
Manufacturer:
ST-Ericsson Inc
Quantity:
10 000
Part Number:
isp1760BEGA
Manufacturer:
ST
Quantity:
20 000
Part Number:
isp1760BEGE
Manufacturer:
ST-Ericsson Inc
Quantity:
10 000
Part Number:
isp1760BEUM
Manufacturer:
JST
Quantity:
1 200
Part Number:
isp1760BEUM
Manufacturer:
ST-Ericsson Inc
Quantity:
10 000
Part Number:
isp1760BEUM
Manufacturer:
ST-ERICSSON
Quantity:
20 000
Part Number:
isp1760ET
Manufacturer:
ST
Quantity:
8
Part Number:
isp1760ET
Manufacturer:
ST-Ericsson Inc
Quantity:
10 000
Part Number:
isp1760ET
Manufacturer:
PHI-PB
Quantity:
5
Part Number:
isp1760ETUM
Manufacturer:
CSR
Quantity:
1 712
Part Number:
isp1760ETUM
Manufacturer:
ST-ERICSSON
Quantity:
20 000
Philips Semiconductors
17. Abbreviations
9397 750 13257
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 104: Abbreviations
Acronym
ATL
DMA
DSC
EHCI
EMI
FS
HC
HS
INT
ISO
iTD
ITL
LS
OHCI
PDA
PLL
PIO
PTD
QHA
QHP
QHA-SS/SC
SiTD
TT
UHCI
USB
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Description
Acknowledged Transfer List
Direct Memory Access
Digital Still Camera
Enhanced Host Controller Interface
Electro-Magnetic Interference
full-speed
Host Controller
high-speed
INTerrupt
isochronous
isochronous Transfer Descriptor
Isochronous (ISO) Transfer List
low-speed
Open Host Controller Interface
Personal Digital Assistant
Phase-Locked Loop
Programmed Input/Output
Philips Transfer Descriptor
Queue Head Asynchronous
Queue Head Periodic
Queue Head Asynchronous-Start Split/Start Complete
Split isochronous Transfer Descriptor
Transaction Translator
Universal Host Controller Interface
Universal Serial Bus
Rev. 01 — 8 November 2004
Embedded Hi-Speed USB host controller
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
ISP1760
98 of 105

Related parts for isp1760