tda1302 NXP Semiconductors, tda1302 Datasheet - Page 18

• Manufacturer Part Number: tda1302
• Description: Tda1302t Data Amplifier And Laser Supply Circuit For Cd Player And Read Only Optical Systems
• Manufacturer: NXP Semiconductors

Philips Semiconductors
SOLDERING
Plastic small-outline packages
B
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 C within 6 s.
Typical dwell time is 4 s at 250 C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1994
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Y WAVE
Y SOLDER PASTE REFLOW
Data amplifier and laser supply circuit for
CD player and read only optical systems
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
19
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 C.
R
IRON OR PULSE
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
EPAIRING SOLDERED JOINTS
-
HEATED SOLDER TOOL
(
BY HAND
Preliminary specification
)
-
HELD SOLDERING
TDA1302T