max2240ebl Maxim Integrated Products, Inc., max2240ebl Datasheet

max2240ebl

Manufacturer Part Number

max2240ebl

Description

Max2240 2.5ghz, +20dbm Power Amplifier Ic In Ucsp Package

Manufacturer

Maxim Integrated Products, Inc.

Datasheet

1.MAX2240EBL.pdf (10 pages)

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Company:

Meier Automation Equipment Co., Limited

Part Number:

MAX2240EBL

Manufacturer:

MAXIM/美信

Quantity:

20 000

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The MAX2240 single-supply, low-voltage power amplifi-

er (PA) IC is designed specifically for applications in

the 2.4GHz to 2.5GHz frequency band. The PA is com-

pliant with Bluetooth, HomeRF, and 802.11 standards,

as well as other FSK modulation systems. The PA pro-

vides a nominal +20dBm (100mW) output power in the

highest power mode.

The PA includes a digital power control circuit to greatly

simplify control of the output power. Four digitally con-

trolled output power levels are provided: from +3dBm

to +20dBm. A digital input controls the active or shut-

down operating modes of the PA. In the shutdown

mode, the current reduces to 0.5µA.

The IC integrates the RF input and interstage matching

to simplify application of the IC. Temperature and sup-

ply-independent biasing are also included to provide

stable performance under all operating conditions.

The IC operates from a +2.7V to +5V single-supply volt-

age. No negative bias voltage is required. Current con-

sumption is a modest 105mA at the highest power

level.

The part is packaged in the UCSP™ package signifi-

cantly reducing the required PC board area. The chip

occupies only a 1.56mm x 1.56mm area. The 3 x 3

array of solder bumps are spaced with a 0.5mm bump

pitch.

19-1624; Rev 2; 2/03

________________________Applications

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Bluetooth

HomeRF

802.11 FHSS WLAN

2.4GHz ISM Proprietary Radios

*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE

(SEE APPLICATIONS SECTION).

________________________________________________________________ Maxim Integrated Products

General Description

SHDN

RFIN

2.5GHz, +20dBm Power Amplifier IC

220 pF

Typical Application Circuit/Functional Diagram

MATCH

BIAS

CONTROL

POWER

BIAS &

GND1

1.2nH* (BOARD TRACE)

o 2.4GHz to 2.5GHz Frequency Range

o High +20dBm Output Power

o 2-Bit Digital Power Control: Four Output Levels

o Integrated Input Match to 50Ω

o Low 105mA Operating Current

o 0.5µA Low-Power Shutdown Mode Current

o +2.7V to +5V Single-Supply Operation

o Miniature Chip-Scale Package (1.56mm x 1.56mm)

*UCSP reliability is integrally linked to the user’s assembly

methods, circuit board material, and environment. Refer to the

UCSP Reliability Notice in the UCSP Reliability section of this

data sheet for more information.

Pin Configuration appears at end of data sheet.

UCSP is a trademark of Maxim Integrated Products, Inc.

18pF

MAX2240EBL

GND2

PART

RFOUT

in UCSP Package

θ = 26°

75Ω

-40°C to +85°C

TEMP RANGE

Ordering Information

θ = 41°

65Ω

22nH

10pF

RFOUT

PIN-PACKAGE

9 UCSP*

Features

Related parts for max2240ebl

max2240ebl Summary of contents

Page 1

... Low-Power Shutdown Mode Current o +2.7V to +5V Single-Supply Operation o Miniature Chip-Scale Package (1.56mm x 1.56mm) PART MAX2240EBL *UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this data sheet for more information. ...

Page 2

Power Amplifier IC in UCSP Package ABSOLUTE MAXIMUM RATINGS BIAS RFOUT to GND ......................................-0.3V to +6V CC Input Voltages (SHDN, D0, D1, to GND).......................-0. (RFIN to GND) ....................................................-0.7V to +0.7V Input Current (SHDN, D0, ...

Page 3

Power Amplifier IC AC ELECTRICAL CHARACTERISTICS (MAX2240 EV kit +2.7V to +5V measured +3.2V +3dBm RFIN PARAMETERS Frequency Range Input Power Range ...

Page 4

Power Amplifier IC in UCSP Package (MAX2240 EV kit +3.2V +3dBm RFIN for power level settings P1, P2, P3, P4.) OUTPUT POWER vs. FREQUENCY ...

Page 5

Power Amplifier IC (MAX2240 EV kit +3.2V +3dBm RFIN for power level settings P1, P2, P3, P4.) HARMONIC OUTPUT SPECTRUM - ...

Page 6

Power Amplifier IC in UCSP Package Table 1. Control Inputs DIGITAL CONTROL INPUTS SHDN four levels (magnitudes) of precisely controlled currents ...

Page 7

Power Amplifier IC The internal input stage impedance matching network is integrated on the MAX2240 possible to directly connect a 50Ω transmission line to RFIN. No external matching is required. Output Stage (RF Output) The ...

Page 8

Power Amplifier IC in UCSP Package SHDN is located in the center of the bump layout of the MAX2240. Therefore, the SHDN line requires the use of either a via to a buried line or a trace that ...

Page 9

Power Amplifier IC Pin Configuration TOP VIEW (BUMPS AT THE BOTTOM BIAS SHDN GND1 RFOUT GND2 RFIN UCSP _______________________________________________________________________________________ ...

Page 10

Power Amplifier IC in UCSP Package (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Maxim cannot assume responsibility for use of any circuitry ...

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