tea1750t-n1 NXP Semiconductors, tea1750t-n1 Datasheet

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tea1750t-n1

Manufacturer Part Number
tea1750t-n1
Description
Tea1750 Greenchip Iii Smps Control Ic
Manufacturer
NXP Semiconductors
Datasheet
1. General description
2. Features
2.1 Distinctive features
2.2 Green features
2.3 PFC green features
The GreenChip III is the third generation of green Switched Mode Power Supply (SMPS)
controller ICs. The TEA1750 combines a controller for Power Factor Correction (PFC) and
a flyback controller. Its high level of integration allows the design of a cost-effective power
supply with a very low number of external components.
The special built-in green functions provide high efficiency at all power levels. This applies
to quasi-resonant operation at high power levels, quasi-resonant operation with valley
skipping, as well as to reduced frequency operation at lower power levels. At low power
levels, the PFC switches over to burst mode control to maintain high efficiency. In burst
mode, soft-start and soft-stop functions are added to eliminate audible noise.
During low power conditions, the flyback controller switches to frequency reduction mode
and limits the peak current to 25 % of its maximum value. This will ensure high efficiency
at low power and good standby power performance while minimizing audible noise from
the transformer.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
Silicon On Insulator (SOI) IC is used for accurate, high speed protection functions and
control.
The TEA1750 enables highly efficient and reliable supplies with power requirements up to
250 W, to be designed easily and with the minimum number of external components.
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I
I
I
I
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TEA1750
GreenChip III SMPS control IC
Rev. 01 — 6 April 2007
Integrated PFC and flyback controller
Universal mains supply operation (70 V AC to 276 V AC)
High level of integration, resulting in a very low external component count and a
cost-effective design
On-chip start-up current source
Valley/zero voltage switching for minimum switching losses (patented)
Frequency limitation to reduce switching losses
Burst mode operation if a low load is detected at the flyback output (patented)
Product data sheet

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tea1750t-n1 Summary of contents

Page 1

TEA1750 GreenChip III SMPS control IC Rev. 01 — 6 April 2007 1. General description The GreenChip III is the third generation of green Switched Mode Power Supply (SMPS) controller ICs. The TEA1750 combines a controller for Power Factor Correction ...

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... W. Notebook adapters in particular can benefit from the high level of integration. 4. Ordering information Table 1. Ordering information Type number Package Name TEA1750T SO16 TEA1750_1 Product data sheet Description plastic small outline package; 16 leads; body width 3.9 mm Rev. 01 — 6 April 2007 TEA1750 ...

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... NXP Semiconductors 5. Block diagram 1.12 V 3.5 V LOW VIN 7 VINSENSE LATCH RESET 6 PFCCOMP 9 2.50 V VOSENSE 2.7 V VoOVP VoBURST HIGH VoBURST LOW VoSTART FB VoSHORT OCP BLANK 500 mV 11 PFCSENSE 60 A SOFT START SOFT STOP VALLEY DETECT 8 PFCAUX Fig 1. Block diagram TEA1750_1 Product data sheet PFCDRIVER ...

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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for TEA1750T (SOT109-1) 6.2 Pin description Table 2. Symbol V CC GND FBCTRL FBAUX LATCH PFCCOMP VINSENSE PFCAUX VOSENSE FBSENSE PFCSENSE PFCDRIVER FBDRIVER HVS HV TEA1750_1 Product data sheet 1 VCC GND 2 FBCTRL 3 4 FBAUX TEA1750T 5 LATCH ...

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... The IC supply is taken over by the auxiliary winding of the flyback converter. See TEA1750_1 Product data sheet TEA1750T 7 3 pin is charged from the high voltage mains via the HV pin below V , the charge current is low. This protects the IC in case the CC ...

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... NXP Semiconductors When the PFC is started, there is initially no supply take-over from the auxiliary winding. To make a small V as long as the flyback converter has not yet started. Regulation is done by hysteretic control with a limited (high level) charge current. The hysteresis is typically 300 mV. If during start-up the LATCH pin does not reach the V ...

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... NXP Semiconductors VINSENSE PROTECTION PFCSENSE PFCDRIVER FBSENSE FBDRIVER FBCTRL VOSENSE Fig 4. Start-up sequence, normal operation, and re-start sequence 7.1.2 Supply management All internal reference voltages are derived from a temperature compensated and trimmed on-chip band gap circuit. Internal reference currents are derived from a temperature compensated and trimmed on-chip current reference circuit ...

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... NXP Semiconductors 7.1.4 Fast latch reset In a typical application, the mains can be interrupted briefly to reset the latched protection. The PFC bus capacitor, C reset. Typically the PFC bus capacitor, C level. When the latched protection is set, the clamping circuit of the VINSENSE circuit is disabled (see also 750 mV (typ ...

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... NXP Semiconductors For applications with high transformer ringing frequencies (after the secondary stroke), the PFCAUX pin should be connected via a capacitor and a resistor to the auxiliary winding. A diode must than be placed from the ground connection to the PFCAUX pin. 7.2.3 Frequency limitation To optimize the transformer and minimize switching losses, the switching frequency is limited to f limit, the system switches over to discontinuous conduction mode ...

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... NXP Semiconductors Fig 5. Soft start-up and soft stop of PFC 7.2.6 Burst mode control When the output power of the flyback converter (see converter switches over to frequency reduction mode. When frequency reduction mode is entered by the flyback controller, the power factor correction circuit switches to burst mode control ...

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... NXP Semiconductors Fig 6. Burst mode control 7.2.7 Overcurrent protection (PFCSENSE pin) The maximum peak current is limited cycle-by-cycle by sensing the voltage across an external sense resistor (R measured via the PFCSENSE pin. 7.2.8 Mains undervoltage lock-out / brown-out protection (VINSENSE pin) To prevent the PFC from operating at very low mains input voltages, the voltage on the VINSENSE pin is sensed continuously ...

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... NXP Semiconductors 7.2.11 Driver (pin PFCDRIVER) The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 500 mA and a current sink capability of typically 1.2 A. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. 7.3 Flyback controller The TEA1750 includes a controller for a flyback converter. The flyback converter operates in quasi-resonant or discontinuous conduction mode with valley switching. The auxiliary winding of the fl ...

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... NXP Semiconductors In frequency reduction mode the PFC controller is switched to burst mode operation and the flyback maximum frequency changes linearly with the control voltage on the FBCTRL pin (see has (typ.) hysteresis load operation the switching frequency of the flyback can be reduced to (almost) zero. ...

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... NXP Semiconductors (1) Start of new cycle at lowest drain voltage. (2) Start of new cycle in a classical Pulse Width Modulation (PWM) system without valley Fig 9. Signals for valley switching 7.3.3 Current mode control (FBSENSE pin) Current mode control is used for the flyback converter for its good line regulation. ...

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... NXP Semiconductors Fig 10. Frequency control of flyback part The driver output is latched in the logic, preventing multiple switch-on. 7.3.4 Demagnetization (FBAUX pin) The system is always in quasi-resonant or discontinuous conduction mode. The internal oscillator does not start a new primary stroke until the previous secondary stroke has ended ...

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... NXP Semiconductors a. Circuit diagram b. Timing diagram Fig 11. Time-out protection 7.3.6 Soft start-up (pin FBSENSE) To prevent audible transformer noise during start-up, the transformer peak current, I slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin FBSENSE and the current sense resistor. ...

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... NXP Semiconductors Fig 12. Soft start-up of flyback 7.3.7 Maximum on-time The flyback controller limits the ‘on-time’ of the external MOSFET (typ.). When the ‘on-time’ is longer than 25 s, the IC stops switching and enters the safe restart mode. 7.3.8 Overvoltage protection (FBAUX pin) An output overvoltage protection is implemented in the GreenChip III series. This works for the TEA1750 by sensing the auxiliary voltage via the current fl ...

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... NXP Semiconductors 7.3.9 Overcurrent protection (FBSENSE pin) The primary peak-current in the transformer is measured accurately cycle-by-cycle using the external sense resistor internal level (see also leading edge blanking period, t Fig 13. OCP leading edge blanking 7.3.10 Driver (pin FBDRIVER) The driver circuit to the gate of the external power MOSFET has a current sourcing capability of typically 500 mA and a current sink capability of typically 1.2 A. This permits fast turn-on and turn-off of the power MOSFET for effi ...

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... NXP Semiconductors Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol General P tot T stg T j ESD V ESD [1] Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 H coil and Thermal characteristics Table 4. Thermal characteristics ...

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... NXP Semiconductors Table 5. Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter I low charging current ch(low) I high charging current ch(high) I operating supply current ...

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... NXP Semiconductors Table 5. Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Output voltage sensing PFC (pin VOSENSE) V open-loop threshold voltage on th(ol)(VOSENSE) pin VOSENSE V fl ...

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... NXP Semiconductors Table 5. Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Demagnetization management PFC (pin PFCAUX) V comparator threshold voltage on th(comp)PFCAUX pin PFCAUX ...

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... NXP Semiconductors Table 5. Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Peak current control flyback (pin FBCTRL) V voltage on pin FBCTRL FBCTRL V time-out voltage on pin FBCTRL enable voltage ...

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... NXP Semiconductors Table 5. Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Temperature protection T IC protection level temperature pl(IC) T hysteresis of IC protection level pl(IC)hys ...

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... The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TEA1750_1 Product data sheet SS1 R SS1 R SENSE1 R AUX1 TEA1750T LOOP C TIMEOUT Rev. 01 — 6 April 2007 TEA1750 GreenChip III SMPS control IC C bus OUT ...

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... NXP Semiconductors 13. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

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... NXP Semiconductors 14. Revision history Table 6. Revision history Document ID Release date TEA1750_1 20070406 TEA1750_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 6 April 2007 TEA1750 GreenChip III SMPS control IC Supersedes - © NXP B.V. 2007. All rights reserved ...

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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.3 PFC green features . . . . . . . . . . . . . . . . . . . . . 1 2.4 Flyback green features . . . . . . . . . . . . . . . . . . . 2 2.5 Protection features . . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 General control . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 Start-up and undervoltage lock-out . . . . . . . . . 5 7 ...

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