lm4835lq National Semiconductor Corporation, lm4835lq Datasheet - Page 24

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lm4835lq

Manufacturer Part Number
lm4835lq
Description
Stereo 2w Audio Power Amplifiers With Dc Volume Control And Selectable Gain
Manufacturer
National Semiconductor Corporation
Datasheet
www.national.com
LM4835 MDC MWC
Stereo 2W Audio Power Amplifier with DC Volume Control and Selectable
Gain
DIE/WAFER CHARACTERISTICS
SIGNAL NAME
Right Out +
GND
SHUT DOWN
Gain Select
Mode
Mute
VDD
DC Vol
GND
Right Dock
Right In
Beep In
Left In
Left Dock
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
10
11
12
13
14
1
2
3
4
5
6
7
8
9
Die Bond Pad Coordinate Locations (A - Step)
-1162
-1162
-1162
-1162
-1162
-1162
-1162
-1162
-245
-505
-791
-936
-936
-791
LM4835A
A
150mm
2578µm x 2438µm
101.5mils x
96.0mils
254µm Nominal
145µm Nominal
X/Y COORDINATES
X
Die Layout (A - Step)
24
-1093
-1093
1093
1093
1093
1093
-186
-385
-618
-850
835
690
340
101
Y
Bond Pad Opening Size
(min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
10013983
212
212
104
104
104
104
104
104
104
104
104
104
104
104
General Die Information
X
PAD SIZE
104µm x 104µm
ALUMINUM
NITRIDE OVER
PASSIVATION OXIDE
BARE BACK
Floating
x
x
x
x
x
x
x
x
x
x
x
x
x
x
104
104
104
104
104
104
104
104
212
104
104
104
104
104
Y

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