lm4863mtx National Semiconductor Corporation, lm4863mtx Datasheet

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lm4863mtx

Manufacturer Part Number
lm4863mtx
Description
Dual 2.2w Audio Amplifier Plus Stereo Headphone Function
Manufacturer
National Semiconductor Corporation
Datasheet

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© 2006 National Semiconductor Corporation
LM4863
Dual 2.2W Audio Amplifier Plus Stereo Headphone
Function
General Description
The LM4863 is a dual bridge-connected audio power ampli-
fier which, when connected to a 5V supply, will deliver 2.2W
to a 4Ω load (Note 1) or 2.5W to a 3Ω load (Note 2) with less
than 1.0% THD+N. In addition, the headphone input pin
allows the amplifiers to operate in single-ended mode when
driving stereo headphones.
Boomer audio power amplifiers were designed specifically to
provide high quality output power from a surface mount
package while requiring few external components. To sim-
plify audio system design, the LM4863 combines dual bridge
speaker amplifiers and stereo headphone amplifiers on one
chip.
The LM4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier
mode, and thermal shutdown protection. It also utilizes cir-
cuitry to reduce “clicks and pops” during device turn-on.
Note 1: An LM4863MTE or LM4863LQ that has been properly mounted to
a circuit board will deliver 2.2W into 4Ω. The other package options for the
LM4863 will deliver 1.1W into 8Ω. See the Application Information sections
for further information concerning the LM4863MTE and LM4863LQ.
Note 2: An LM4863MTE or LM4863LQ that has been properly mounted to a
circuit board and forced-air cooled will deliver 2.5W into 3Ω.
Typical Application
Note: Pin out shown for SO package. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP LLP
packages.
Boomer
®
is a registered trademark of National Semiconductor Corporation.
DS012881
Key Specifications
n P
n
n
n
n
n Single-ended mode THD+N at 75mW into
n Shutdown current
n Supply voltage range
Features
n Stereo headphone amplifier mode
n “Click and pop” suppression circuitry
n Unity-gain stable
n Thermal shutdown protection circuitry
n SOIC, TSSOP, exposed-DAP TSSOP, and LLP
* Not recommended for new designs. Contact NSC Audio
Marketing.
Applications
n Multimedia monitors
n Portable and desktop computers
n Portable televisions
32Ω
packages
O
LM4863LQ, 3Ω, 4Ω loads
LM4863MTE, 3Ω, 4Ω loads
LM4863MTE, 8Ω load
LM4863, 8Ω
at 1% THD+N
01288101
2.5W(typ), 2.2W(typ)
2.5W(typ), 2.2W(typ)
October 2006
www.national.com
2.0V to 5.5V
0.5%(max)
0.7µA(typ)
1.1W(typ)
1.1W(typ)

Related parts for lm4863mtx

lm4863mtx Summary of contents

Page 1

... Typical Application Note: Pin out shown for SO package. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP LLP packages. Boomer ® registered trademark of National Semiconductor Corporation. © 2006 National Semiconductor Corporation Key Specifications THD+N O LM4863LQ, 3Ω ...

Page 2

Connection Diagrams Top View Order Number LM4863M See NS Package Number M16B for SO Top View Order Number LM4863MTE See NS Package Number MXA20A for Exposed-DAP TSSOP * Not recommended for new designs. Contact NSC Audio Marketing. www.national.com 01288128 See ...

Page 3

Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 4) ESD Susceptibility(Note 5) ESD Susceptibility (Note 6) Junction Temperature ...

Page 4

Electrical Characteristics for Bridged-Mode Operation The following specifications apply for V Symbol Parameter THD+N Total Harmonic Distortion+Noise PSRR Power Supply Rejection Ratio X Channel Separation TALK SNR Signal To Noise Ratio Electrical Characteristics for Single-Ended Operation The following specifications apply ...

Page 5

Typical Performance Characteristics MTE Specific Characteristics LM4863MTE THD+N vs Output Power LM4863MTE THD+N vs Output Power LM4863MTE Power Dissipation vs Power Output 01288197 01288196 01288190 5 LM4863MTE THD+N vs Frequency 01288199 LM4863MTE THD+N vs Frequency 01288198 LM4863MTE Power Derating Curve ...

Page 6

Typical Performance Characteristics MTE Specific Characteristics LM4863MTE (Note 17) Power Derating Curve Note 17: This curve shows the LM4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: The part is soldered to a 1S2P ...

Page 7

Non-MTE Specific Characteristics THD+N vs Output Power THD+N vs Output Power THD+N vs Output Power (Continued) 01288107 01288187 01288186 7 THD+N vs Output Power 01288108 THD+N vs Frequency 01288189 THD+N vs Frequency 01288188 www.national.com ...

Page 8

Non-MTE Specific Characteristics Output Power vs Load Resistance Output Power vs Supply Voltage Output Power vs Supply Voltage www.national.com (Continued) 01288184 01288109 01288111 8 Power Dissipation vs Supply Voltage 01288185 Output Power vs Supply Voltage 01288110 Output Power vs Load ...

Page 9

Non-MTE Specific Characteristics Output Power vs Load Resistance Dropout Voltage vs Supply Voltage Power Dissipation vs Output Power (Continued) 01288113 01288115 01288117 9 Power Dissipation vs Output Power 01288114 Power Derating Curve 01288116 Noise Floor 01288118 www.national.com ...

Page 10

Non-MTE Specific Characteristics Channel Separation Power Supply Rejection Ratio Supply Current vs Supply Voltage www.national.com (Continued) 01288119 Frequency Response 01288121 01288123 10 Channel Separation 01288120 Open Loop 01288122 ...

Page 11

External Components Description (Refer to Figure 1.) Components 1. R The Inverting input resistance, along with R i filter with f = 1/(2π The input coupling capacitor blocks DC voltage at the amplifier’s input terminals ...

Page 12

Application Information * Refer to the section Proper Selection of External Components, for a detailed discussion of C FIGURE 1. Typical Audio Amplifier Application Circuit Pin out shown for the SO package. Refer to the Connection Diagrams for the pinout ...

Page 13

Application Information mode or bridge mode, respectively. Twice the maximum power dissipation point given by Equation (3) must not ex- ceed the power dissipation given by Equation (4 θ P ’ − T DMAX JMAX A ...

Page 14

Application Information phone jack contact pin from -OUTA and allows R1 to pull the HP Sense pin This enables the headphone func- DD tion, turns off Amp2A and Amp2B, and mutes the bridged speaker. The amplifier ...

Page 15

Application Information sents a tradeoff: as the size of C increases, the turn-on time B increases. There is a linear relationship between the size of C and the turn-on time. Here are some typical turn-on times B for various values ...

Page 16

Application Information FIGURE 3. MTE PC board layout: all layers superimposed FIGURE 4. MTE PC board layout: Component-side Silkscreen FIGURE 5. Recommended MTE PC board layout: Component-side layout www.national.com (Continued) 01288194 FIGURE 6. Recommended MTE PC board layout: 01288193 FIGURE ...

Page 17

Application Information FIGURE 8. Recommended LQ PC board layout: Component-side layout FIGURE 9. Recommended LQ PC board layout: upper inner-layer layout (Continued) 01288132 FIGURE 10. Recommended LQ PC board layout: 01288133 FIGURE 11. Recommended LQ PC board layout: 17 01288134 ...

Page 18

Revision History Rev 1.1 10/30/06 www.national.com Date Removed all references to the 16–lead plastic-DIP package. 18 Description ...

Page 19

Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead (0.300" Wide) Molded Small Outline Package, JEDEC 20-Lead Molded PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH Order Number LM4863M NS Package Number M16B Order Number LM4863MT NS Package Number MTC20 19 www.national.com ...

Page 20

Physical Dimensions 20-Lead Molded TSSOP, Exposed Pad, 6.5x4.4x0.9mm www.national.com inches (millimeters) unless otherwise noted (Continued) Order Number LM4863MTE NS Package Number MXA20A 24-Lead Molded pkg, Leadframe Package LLP Order Number LM4863LQ NS Package Number LQA24A 20 ...

Page 21

... THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (″NATIONAL″) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT ...

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