lmc8101tpx National Semiconductor Corporation, lmc8101tpx Datasheet - Page 17

• Manufacturer Part Number: lmc8101tpx
• Description: Rail-to-rail Input And Output, 2.7v Op Amp In Micro Smd Package With Shutdown
• Manufacturer: National Semiconductor Corporation

Physical Dimensions
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
Order Package Number LMC8101BP, LMC8101BPCONV or LMC8101BPX
NS Package Number BPA08FFB
X
= 1.412 X
= 1.412 X
= 0.850
1
2
3
17
www.national.com