74lcx16245mtdx-nl Fairchild Semiconductor, 74lcx16245mtdx-nl Datasheet

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74lcx16245mtdx-nl

Manufacturer Part Number
74lcx16245mtdx-nl
Description
74lcx16245 Low Voltage 16-bit Bidirectional Transceiver With 5v Tolerant Inputs And Outputs
Manufacturer
Fairchild Semiconductor
Datasheet
© 2005 Fairchild Semiconductor Corporation
74LCX16245G
(Note 2)(Note 3)
74LCX16245MEA
(Note 3)
74LCX16245MTD
(Note 3)
74LCX16245
Low Voltage 16-Bit Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCX16245 contains sixteen non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is designed for low voltage
(2.5V or 3.3V) V
ing to a 5V signal environment. The device is byte con-
trolled. Each byte has separate control inputs which could
be shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The LCX16245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number
CC
Package Number
applications with capability of interfac-
BGA54A
MS48A
MTD48
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
DS012001
Features
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
resistor is determined by the current-sourcing capability of the driver.
5V tolerant inputs and outputs
2.3V–3.6V V
4.5 ns t
Power down high impedance inputs and outputs
Supports live insertion/withdrawal (Note 1)
r
Uses patented noise/EMI reduction circuitry
Latch-up performance exceeds 500 mA
ESD performance:
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
24 mA output drive (V
Human body model
Machine model
Package Description
PD
max (V
CC
CC
through a pull-up resistor: the minimum value or the
specifications provided
CC
!
200V
!
3.3V), 20
CC
2000V
3.0V)
February 1994
Revised May 2005
P
A I
CC
www.fairchildsemi.com
max

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74lcx16245mtdx-nl Summary of contents

Page 1

... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 3) Note 2: Ordering code “G” indicates Trays. Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation Features 5V tolerant inputs and outputs 2.3V–3.6V V specifications provided CC 4 ...

Page 2

Connection Diagrams Pin Assignment for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) Logic Diagrams Note: Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation ...

Page 3

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Source/Sink Current Supply ...

Page 4

DC Electrical Characteristics Symbol Parameter I Quiescent Supply Current Increase in I per Input CC CC Note 7: Outputs disabled or 3-STATE only. AC Electrical Characteristics Symbol Parameter t Propagation Delay PHL ...

Page 5

AC LOADING and WAVEFORMS FIGURE 1. AC Test Circuit (C t PLH t PZL t PZH Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and t rec 3-STATE Output Low Enable and Disable Times for Logic (Input Characteristics; ...

Page 6

Schematic Diagram Generic for LCX Family www.fairchildsemi.com 6 ...

Page 7

Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A 7 www.fairchildsemi.com ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide www.fairchildsemi.com Package Number MS48A 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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