74lcx162244mtdx-nl Fairchild Semiconductor, 74lcx162244mtdx-nl Datasheet

74lcx162244mtdx-nl

Manufacturer Part Number

74lcx162244mtdx-nl

Description

74lcx162244 Low Voltage 16-bit Buffer/line Driver With 26w Series Resistors In Outputs

Manufacturer

Fairchild Semiconductor

Datasheet

1.74LCX162244MTDX-NL.pdf (10 pages)

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74LCX162244GX

(Note 1)

74LCX162244MEA

(Note 2)

74LCX162244MTD

(Note 2)

74LCX162244

Low Voltage 16-Bit Buffer/Line Driver

with 26: Series Resistors in Outputs

General Description

The LCX162244 contains sixteen non-inverting buffers with

3-STATE outputs designed to be employed as a memory

and address driver, clock driver, or bus oriented transmit-

ter/receiver. The device is nibble controlled. Each nibble

has separate 3-STATE control inputs which can be shorted

together for full 16-bit operation.

The LCX162244 is designed for low voltage (2.5V or 3.3V)

environment.

In addition, the outputs include equivalent 26

series resistors to reduce overshoot and undershoot and

are designed to sink/source up to 12 mA at V

The LCX162244 is fabricated with an advanced CMOS

technology to achieve high speed operation while maintain-

ing CMOS low power dissipation.

Ordering Code:

Note 1: BGA package available in Tape and Reel only.

Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Logic Symbol

Order Number

applications with capability of interfacing to a 5V signal

Package Number

(Preliminary)

BGA54A

MS48A

MTD48

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

[TAPE and REEL]

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

DS500471

(nominal)

3.0V.

Features

5V tolerant inputs and outputs

2.3V–3.6V V

Outputs include equivalent series resistance of 26

make external termination resistors unnecessary and

reduce overshoot and undershoot

5.3 ns t

Power down high impedance inputs and outputs

Implements patented noise/EMI reduction circuitry

Latch-up performance exceeds 500 mA

ESD performance:

Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA) (Preliminary)

12 mA output drive (V

Human body model

Machine model

Package Description

max (V

specifications provided

200V

3.0V), 20

2000V

3.0V)

September 2000

Revised May 2005

A I

www.fairchildsemi.com

max

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