nlx1g57 ON Semiconductor, nlx1g57 Datasheet

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nlx1g57

Manufacturer Part Number
nlx1g57
Description
Configurable Multifunction Gate
Manufacturer
ON Semiconductor
Datasheet

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Part Number:
nlx1g57AMX1TCG
Manufacturer:
ON Semiconductor
Quantity:
2 350
NLX1G57
Configurable Multifunction
Gate
multifunction gate. The device allows the user to choose logic
functions AND, OR, NAND, NOR, XNOR, INVERT and BUFFER.
The device has Schmitt-trigger inputs, thereby enhancing noise
immunity.
voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
The NLX1G57 MiniGatet is an advanced high-speed CMOS
The NLX1G57 input and output structures provide protection when
High Speed: t
Low Power Dissipation: I
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra-Small Packages
This is a Pb-Free Device
PD
= 3.2 ns (Typ) @ V
CC
= 1 mA (Maximum) at T
CC
= 5.0 V
A
= 25°C
1
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
1
1
1
ORDERING INFORMATION
GND
IN B
IN A
D
M
PIN ASSIGNMENTS
http://onsemi.com
= Specific Device Code
= Date Code
CASE 613AD
CASE 613AE
CASE 613AF
1
2
3
1.45 x 1.0
(Top View)
ULLGA6
ULLGA6
ULLGA6
1.0 x 1.0
1.2 x 1.0
Publication Order Number:
6
5
4
IN C
V
OUT Y
DIAGRAMS
CC
MARKING
NLX1G57/D
M
M
M

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nlx1g57 Summary of contents

Page 1

... The device allows the user to choose logic functions AND, OR, NAND, NOR, XNOR, INVERT and BUFFER. The device has Schmitt-trigger inputs, thereby enhancing noise immunity. The NLX1G57 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. Features • ...

Page 2

... PIN ASSIGNMENT NLX1G57 Figure 1. Function Diagram FUNCTION TABLE GND OUT *To select a logic function, please refer to “Logic Configurations section”. http://onsemi.com 2 OUT Y Input Output ...

Page 3

... Figure 4. 2-Input NAND with Input C Inverted (When B = “H” Figure 6. 2-Input XNOR (When Figure 8. Buffer (When A = “L” and C = “H”) NLX1G57 LOGIC CONFIGURATIONS Figure 3. 2-Input NAND with input B inverted ...

Page 4

... CC V Digital Input Voltage IN V Output Voltage OUT T Operating Free-Air Temperature A Dt/DV Input Transition Rise or Fall Rate NLX1G57 Parameter V < GND IN V < GND OUT Index Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) and Below GND at 125°C (Note 5) ...

Page 5

... OL IN T-MIN = 50 mA Low-Level I OL Output Voltage IN T-MIN 5 Input IN IN Leakage Current Quiescent CC IN Supply Current NLX1G57 T = 255C (V) Min Typ 1.65 0.79 2.3 1.11 3.0 1.5 4.5 2.16 5.5 2.61 1.65 0.35 2.3 0.58 3.0 0.84 4.5 1.41 5.5 1.78 1.65 0.30 2.3 0.40 3.0 0.53 4.5 0.71 5 T+MAX CC 5 ...

Page 6

... TEST CIRCUIT AND VOLTAGE WAVEFORMS From Output R Under Test includes probes and jig capacitance. L Figure 9. Load Circuit 0. 0 0 0.5 V NLX1G57 (Input 3.0 ns 255C A Min Typ (V) Test Condition CC 3.2 8.5 2 4.9 1.5 3.8 1.1 3.2 3.5 5 MHz ...

Page 7

... All parameters are waveforms are not applicable to all devices. ORDERING INFORMATION Device NLX1G57AMX1TCG NLX1G57BMX1TCG NLX1G57CMX1TCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NLX1G57 Timing Input Data Input Figure 11 ...

Page 8

... 0.10 0.05 BOTTOM VIEW NLX1G57 PACKAGE DIMENSIONS ULLGA6, 1.0x1.0, 0.35P CASE 613AD-01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL 4. A MAXIMUM OF 0.05 PULL BACK OF THE SEATING MOUNTING FOOTPRINT PLANE SOLDERMASK DEFINED* NOTE 4 ...

Page 9

... C TOP VIEW 0. SIDE VIEW BOTTOM VIEW NLX1G57 PACKAGE DIMENSIONS ULLGA6, 1.2x1.0, 0.4P CASE 613AE-01 ISSUE A NOTES: SEATING MOUNTING FOOTPRINT PLANE SOLDERMASK DEFINED NOTE 4 0.53 0. *For additional information on our Pb-Free strategy and soldering 0.05 ...

Page 10

... PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. MILLIMETERS DIM MIN MAX A --- 0.40 A1 0.00 0.05 b 0.15 0.25 D 1.45 BSC E 1.00 BSC e 0.50 BSC L 0.25 0.35 L1 0.30 0.40 MOUNTING FOOTPRINT SOLDERMASK DEFINED 0.49 0.30 1.24 1 0.53 0.50 PKG OUTLINE PITCH DIMENSIONS: MILLIMETERS ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLX1G57/D ...

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