cbt3306d NXP Semiconductors, cbt3306d Datasheet

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cbt3306d

Manufacturer Part Number
cbt3306d
Description
Cbt3306 Dual Bus Switch
Manufacturer
NXP Semiconductors
Datasheet
1.CBT3306D.pdf (13 pages)

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Part Number
Manufacturer
Quantity
Price
Company:
Allchip Electronic(HK) Limited Allchip Electronic(HK) Limited
Part Number:
CBT3306D
Manufacturer:
NXP
Quantity:
19 346
Company:
H&T Electronics H&T Electronics
Part Number:
CBT3306D
Quantity:
10 000
1. General description
2. Features
3. Quick reference data
4. Ordering information
The CBT3306 dual FET bus switch features independent line switches. Each switch is
disabled when the associated output enable (OE) input is HIGH.
The CBT3306 is characterized for operation from 40 C to +85 C.
Table 1:
T
Table 2:
Symbol
t
C
I
Type number
CBT3306D
CBT3306PW
PD
CC
amb
io(off)
CBT3306
Dual bus switch
Rev. 02 — 17 November 2005
5
TTL-compatible input levels
Package options include plastic small outline (SO) and thin shrink small outline
(TSSOP)
Latch-up protection exceeds 100 mA per JESD78
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
= 25 C; GND = 0 V
switch connection between two ports
Parameter
propagation delay
off-state input/output
capacitance
quiescent supply
current
Quick reference data
Ordering information
Package
Name
SO8
TSSOP8
Description
plastic small outline package; 8 leads;
body width 3.9 mm
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
Conditions
from input (nA or nB) to
output (nB or nA);
C
V
V
V
V
CC
I
CC
I
L
= 3 V or 0 V; OE = V
= V
= 50 pF;
= 5.0 V
= 5.5 V; I
CC
or GND
O
0.5 V
= 0 mA;
CC
Product data sheet
Min
-
-
-
Typ
-
6.45
-
Max
0.25
-
3
Version
SOT96-1
SOT530-1
Unit
ns
pF
A

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cbt3306d Summary of contents

Page 1

... Quick reference data Table GND = 0 V amb Symbol io(off Ordering information Table 2: Type number CBT3306D CBT3306PW switch connection between two ports Quick reference data Parameter Conditions propagation delay from input (nA or nB) to output ( ...

Page 2

... V CC CBT3306_2 Product data sheet 1OE 2OE 1 8 1OE 2OE CBT3306D GND 2A 002aab983 Pin description Pin Description 1 output enable port input port output 1 4 ground ( port input port output 2 ...

Page 3

Philips Semiconductors 7. Functional description Refer to 7.1 Function selection Table 4: Input Limiting values Table 5: In accordance with the Absolute Maximum Rating System (IEC 60134 +85 C, unless otherwise ...

Page 4

Philips Semiconductors 10. Static characteristics Table 7: Static characteristics +85 C, unless otherwise specified. amb Symbol Parameter V input clamping voltage IK I input leakage current LI I quiescent supply current CC V pass voltage ...

Page 5

Philips Semiconductors 11.1 AC waveforms V = GND to 3 and t PLZ t and t PZL t and t PLH Fig 4. Input to output propagation delay (1) Waveform 1 is for an output with internal ...

Page 6

Philips Semiconductors 12. Test information Fig 6. Test circuit Table 9: Test PLZ PZL PHZ PZH CBT3306_2 Product data sheet from output under test Test data are given in Table 9. All ...

Page 7

Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 8

Philips Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...

Page 9

Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 10

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 11

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 12

Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 13

Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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