is62wv2568bll-70ti Integrated Silicon Solution, Inc., is62wv2568bll-70ti Datasheet

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is62wv2568bll-70ti

Manufacturer Part Number
is62wv2568bll-70ti
Description
256k X 8 Low Voltage, Ultra Low Power Cmos Static Ram
Manufacturer
Integrated Silicon Solution, Inc.
Datasheet

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Part Number:
IS62WV2568BLL-70TI
Manufacturer:
ISSI
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2 148
IS62WV2568ALL
IS62WV2568BLL
256K x 8 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access time: 55ns, 70ns
• CMOS low power operation
• TTL compatible interface levels
• Single power supply
• Fully static operation: no clock or refresh
• Three state outputs
• Industrial temperature available
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. E
05/08/08
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
– 36 mW (typical) operating
– 9 µW (typical) CMOS standby
– 1.65V--2.2V V
– 2.5V--3.6V V
required
CC
CC
(62WV2568BLL)
(62WV2568ALL)
I/O0-I/O7
A0-A17
VCC
GND
CS2
CS1
WE
OE
DECODER
CIRCUIT
CONTROL
CIRCUIT
DATA
I/O
1-800-379-4774
DESCRIPTION
The
speed, 2M bit static RAMs organized as 256K words by 8
bits. It is fabricated using
technology. This highly reliable process coupled with
innovative circuit design techniques, yields high-
performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselected) , the device assumes a standby mode at which
the power dissipation can be reduced down with CMOS
input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS62WV2568ALL and IS62WV2568BLL are packaged
in the JEDEC standard 32-pin TSOP (TYPE I), sTSOP
(TYPE I), and 36-pin mini BGA.
ISSI
MEMORY ARRAY
IS62WV2568ALL / IS62WV2568BLL are high-
COLUMN I/O
256K x 8
ISSI
's high-performance CMOS
MAY 2008
1

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is62wv2568bll-70ti Summary of contents

Page 1

... Easy memory expansion is provided by using Chip Enable and Output Enable inputs. The active LOW Write Enable (WE) controls both writing and reading of the memory. The IS62WV2568ALL and IS62WV2568BLL are packaged in the JEDEC standard 32-pin TSOP (TYPE I), sTSOP (TYPE I), and 36-pin mini BGA. ...

Page 2

... IS62WV2568ALL, IS62WV2568BLL PIN DESCRIPTIONS A0-A17 Address Inputs CS1 Chip Enable 1 Input CS2 Chip Enable 2 Input OE Output Enable Input WE Write Enable Input I/O0-I/O7 Input/Output NC No Connection Vcc Power GND Ground PIN CONFIGURATION 36-pin mini BGA (B) (6mm x 8mm CS2 A3 A6 ...

Page 3

... Operating Range) Test Conditions Vcc I = -0.1 mA 1.65-2. 2.5-3. 0.1 mA 1.65-2. 2.1 mA 2.5-3.6V OL 1.65-2.2V 2.5-3.6V 1.65-2.2V 2.5-3.6V GND GND Outputs Disabled OUT CC 1-800-379-4774 Unit V °C W IS62WV2568BLL 2.5V - 3.6V 2.5V - 3.6V Min. Max. Unit 1.4 — V 2.2 — V — 0.2 V — 0 –0.2 0.4 V –0.2 0.6 V –1 1 µA –1 1 µ ...

Page 4

... IS62WV2568ALL, IS62WV2568BLL CAPACITANCE (1) Symbol Parameter C Input Capacitance IN C Input/Output Capacitance OUT Note: 1. Tested initially and after any design or process changes that may affect these parameters. AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level Output Load 1 ...

Page 5

... IS62WV2568ALL, IS62WV2568BLL POWER SUPPLY CHARACTERISTICS 62WV2568ALL (1.65V - 2.2V) Symbol Parameter Test Conditions I Vcc Dynamic Operating V CC Supply Current I OUT I Operating Supply Current I OUT I TTL Standby Current (TTL Inputs) V CS1 = CMOS Standby CS1 V Current (CMOS Inputs) CS2 0.2V POWER SUPPLY CHARACTERISTICS 62WV2568BLL (2 ...

Page 6

... IS62WV2568ALL, IS62WV2568BLL READ CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Read Cycle Time RC t Address Access Time AA t Output Hold Time OHA CS1/CS2 Access Time t t ACS1/ ACS2 OE Access Time t DOE OE to High-Z Output t (2) HZOE OE to Low-Z Output t (2) LZOE CS1/CS2 to High-Z Output ...

Page 7

... IS62WV2568ALL, IS62WV2568BLL AC WAVEFORMS (1,3) (CS1, CS2, OE Controlled) READ CYCLE NO. 2 ADDRESS OE CS1 t ACS1/ CS2 DOUT Notes HIGH for a Read Cycle. 2. The device is continuously selected. OE, CS1 Address is valid prior to or coincident with CS1 LOW and CS2 HIGH transition. Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 8

... IS62WV2568ALL, IS62WV2568BLL WRITE CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Write Cycle Time WC CS1/CS2 to Write End t t SCS1/ SCS2 t Address Setup Time to Write End AW t Address Hold from Write End HA t Address Setup Time SA WE Pulse Width t PWE t Data Setup to Write End SD t Data Hold from Write End ...

Page 9

... IS62WV2568ALL, IS62WV2568BLL AC WAVEFORMS (WE Controlled HIGH During Write Cycle) WRITE CYCLE NO. 2 ADDRESS OE CS1 CS2 DOUT DATA UNDEFINED DIN (WE Controlled LOW During Write Cycle) WRITE CYCLE NO. 3 ADDRESS OE CS1 CS2 WE t DOUT DATA UNDEFINED DIN Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 10

... IS62WV2568ALL, IS62WV2568BLL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter V Vcc for Data Retention DR I Data Retention Current DR t Data Retention Setup Time SDR t Recovery Time RDR DATA RETENTION WAVEFORM (CS1 t SDR V CC 3.0V 2. CS1 GND DATA RETENTION WAVEFORM (CS2 Controlled 3.0 CS2 2 ...

Page 11

... IS62WV2568ALL, IS62WV2568BLL PLASTIC sTSOP - 32 PINS Package Code: H (Type PLASTIC sTSOP (H-TYPE 1) MILLIMETERS Symbol Min. Max. REF. STD N0. Leads A — 1.25 A1 0.05 — A2 0.95 1.05 b 0.17 0.23 C 0.142 0.158 D 13.2 13.6 D1 11.7 11.9 E 7.9 8.1 e 0.50 BSC L 0.30 0.70 S 0.278 TYP Integrated Silicon Solution, Inc. — www.issi.com — Rev. E 05/08/08 A2 ...

Page 12

... IS62WV2568ALL, IS62WV2568BLL PLASTIC TSOP - 32 PINS Package Code: T (Type PLASTIC TSOP (T-TYPE 1) MILLIMETERS Symbol Min. Max. REF. STD N0. Leads A — 1.20 A1 0.05 0.25 B 0.17 0.23 C 0.12 0.17 D 7.90 8.10 E 18.30 18.50 H 19.80 20.20 e 0.50 BSC L 0.40 0. SEATING PLANE Notes: INCHES 1. Controlling dimension: millimeters, unless 2. BSC = Basic lead spacing between centers. ...

Page 13

... IS62WV2568ALL, IS62WV2568BLL Mini Ball Grid Array Package Code: B (36-pin) (6mm x 8mm, 8mm SEATING PLANE Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E do not include mold flash protrusion and should be measured from the bottom of the package. ...

Page 14

... Industrial Range: –40°C to +85°C Speed (ns) Order Part No. 55 IS62WV2568BLL-55TI 55 IS62WV2568BLL-55TLI 55 IS62WV2568BLL-55BI 55 IS62WV2568BLL-55BLI 55 IS62WV2568BLL-55HI 55 IS62WV2568BLL-55HLI 70 IS62WV2568BLL-70TI 70 IS62WV2568BLL-70BI 70 IS62WV2568BLL-70HI 14 Package TSOP, TYPE I, Package TSOP, TYPE I TSOP, TYPE I, Lead-free mini BGA (6mm x 8mm) sTSOP, TYPE I sTSOP, TYPE I, Lead-free Package TSOP, TYPE I mini BGA (6mm x 8mm) ...

Page 15

... D 13.20 13.60 D1 11.70 11.90 E 7.90 8.10 e 0.50 BSC L 0.30 0.70 S 0.28 Typ. 0° 5° Integrated Silicon Solution, Inc. PK13197H32 Rev. B 04/21/ Inches Min Max Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E do not include mold flash protru- — 0.049 sions and should be measured from the bottom of the package ...

Page 16

... Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — ...

Page 17

... REF Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — ...

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