tza3014 NXP Semiconductors, tza3014 Datasheet
tza3014
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tza3014 Summary of contents
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... DATA SHEET TZA3014 2.5 Gbits/s postamplifier with level detector Product specification Supersedes data of 2000 Aug 09 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 2001 Jun 25 ...
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... Swing converter CML 200 mV (p-p) to PECL 800 mV (p-p) 2.5 GHz clock amplification. GENERAL DESCRIPTION The TZA3014 is a low gain postamplifier with a LOS detector and a RSSI designed for use in critical signal path control applications, such as loop-through or Wavelength Division Multiplexing (WDM). The signal path is capable of operating from 50 kHz ...
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... LOS output comparator RSSI 1 offset compensation cross-over switch TZA3014 Fig.1 Block diagram. 3 Product specification (31) 25 GNDB 5 k (35) 27 LOS (34) 26 RSSI offset compensation level (30 CCB (29) 23 OUT (28) 22 OUTQ (27) 21 buffer amplifier V CCB (17) 14 BAND GAP V ref REFERENCE MGU122 TZA3014 ...
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... PECL or CML compatible differential output; complimentary to pin OUT O PECL or CML compatible differential output; complimentary to pin OUTQ S supply voltage for output circuit S ground for output circuit O not connected O-DRN not connected 4 Product specification DESCRIPTION 0.33 V and V CCA ref and V CCA ref TZA3014 ; when forced to ; when forced to ...
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... S ground for input and LOS detector S ground pad (exposed die pad exposed pad INQ 3 4 TZA3014HT n.c. 5 n.c. 6 n.c. 7 GNDp n.c. 8 Fig.2 Pin configuration HTQFP32 package. 5 Product specification TZA3014 DESCRIPTION 24 V CCB 23 OUT 22 OUTQ 21 V CCB 20 n.c. n.c. 19 n.c. 18 n.c. 17 MGU123 ...
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... Jun 25 V CCA exposed pad INQ 3 V CCA 4 TZA3014VH n. n.c. 7 n.c. GNDp n. Fig.3 Pin configuration HBCC32 package. 6 Product specification TZA3014 25 V CCB 24 OUT 23 OUTQ 22 V CCB 21 n.c. 20 n.c. 19 n.c. 18 n.c. 17 MGU124 ...
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... Philips Semiconductors 2.5 Gbits/s postamplifier with level detector FUNCTIONAL DESCRIPTION The TZA3014 is a postamplifier with a RSSI circuit to provide output signals for RSSI and LOS (see Fig.1). The input signal can be amplified to a programmable level. An active level control circuit ensures this level. The control voltage on pin INV inverts the outputs, so avoiding a required complicated Printed Circuit Board (PCB) layout ...
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... OUT (29) 23 (28) 22 OUTQ REG a. DC-coupled. V CCB (27) 21 100 100 OUT (29) 23 OUTQ (28) 22 REG b. AC-coupled. Fig.5 RF output configurations. 8 Product specification Transmission lines LEVEL V o(se)(p- MGU126 ( Transmission lines LEVEL V o(se)(p- MGU127 (V) TZA3014 ...
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... Table 1 OUT and OUTQ as a function of input MUTE Table 2 OUT and OUTQ as a function of input INV 9 Product specification MGU128 AC-coupled 80 100 V LEVEL (% of V ref ) . LEVEL MUTE OUT ‘0’ INV OUT INQ TZA3014 OUTQ INQ ‘1’ OUTQ INQ IN ...
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... EE 2.0 V (1) TTL 0 GND and negative input voltage ( Product specification MGS560 2.0 V 0 MGS559 2.0 V (1) 0 MGS558 2.0 V 0 TZA3014 ...
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... Philips Semiconductors 2.5 Gbits/s postamplifier with level detector RSSI and LOS detection The TZA3014 monitors the level of the input AC signal. This function can prevent the output circuit from reacting to noise in case there is no valid input signal, and can ensure that only data is transmitted when there is sufficient input signal for low bit error rate system operation. The RSSI uses seven limiting amplifiers in a ‘ ...
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... For the supply current I , see Fig.10. CCB Using a positive supply voltage Although the TZA3014 has been designed to use a single 3.3 V supply voltage (see Fig.11), some care should be taken with respect to RF transmission lines. The on-chip signals refer to the various V pins. The external ...
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... PARAMETER , TEST, OUTQ, OUT, GNDp, ref CONDITIONS note 1 1s2p multi-layer test board; notes 1 and 2 1s2p multi-layer test board; notes 1 and 2 LOS detector switched 200 mV (p-p) single-ended 800 mV (p-p) single-ended o 13 Product specification TZA3014 MIN. MAX. UNIT 0.5 +5 ...
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... CCB note 2 single-ended single-ended; note 2 INQ single-ended; notes 2 and 200 mV (p-p) o single-ended; note 800 mV (p-p) o single-ended; note 4 single-ended V = 800 mV (p-p) o single-ended; note 2 note 2 14 Product specification TZA3014 MIN. TYP. MAX. 3.13 3.3 3. ...
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... AND 50 load 20% to 80%; notes 6 and 8 80% to 20%; notes 6 and 8 single-ended single-ended; note 2 referenced multiplexer and inverter multiplexer and inverter positive logic; note 10 positive logic; note 10 referenced to GNDA 15 Product specification TZA3014 MIN. TYP. MAX 2 2.0 150 200 ...
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... MB/s PRBS (2 1); note 11 31 1.2 GB/s PRBS (2 1); note 11 31 2.4 GB/s PRBS (2 1); note 11 see Fig.8; note 2 input signal waveform dependent note 2 note 2 referenced to GNDA internal output series resistance 16 Product specification TZA3014 MIN. TYP. MAX. 0.4 400 0 1 ...
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... When using a negative supply voltage, positive or negative logic can be used. The values will be different, see Fig.7. 11. Sensitivity depends on the waveform and is therefore a function cut-off frequency; see Section “RSSI and LOS detection”, Equation (1). 2001 Jun 25 CONDITIONS = 800 mV (p-p) single-ended Product specification TZA3014 MIN. TYP. MAX ...
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... Jun 25 To minimize low frequency switching noise in the vicinity of the TZA3014, the power supply line should be filtered once using a beaded capacitor circuit having a low cut-off frequency. The exposed die pad GNDp connection on the PCB must be a large area of copper to aid the transfer of heat from the IC to the PCB (see Figs 11 and 12) ...
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... Fig.11 PCB layout for HTQFP package with positive supply voltage. 2001 Jun 25 2 Boundary of 100 mm area central GND decoupling 0603 0603 0603 0603 0603 0603 0603 HTQFP inner layer, surrounded by ground layers. 19 Product specification 0603 V CCB OUT OUTQ V CCB cross-section MGU134 TZA3014 ...
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... Fig.12 PCB layout for HTQFP package with negative supply voltage. 2001 Jun 25 2 Boundary of 100 mm area central GND decoupling 0603 0603 0603 0603 0603 0603 0603 HTQFP inner layer, surrounded by ground layers. 20 Product specification 0603 V CCB OUT OUTQ V CCB cross-section MGU136 TZA3014 ...
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... Fig.13). +550 928 +707 928 +928 710 +928 553 +928 396 +928 239 21 Product specification TZA3014 (1) COORDINATES PAD +928 81 26 +928 +81 27 +928 +239 28 +928 +396 ...
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... Jun CCA INQ 3 V CCA n.c. 8 TZA3014U n. Fig.13 Bonding pad locations TZA3014U. 22 Product specification TZA3014 30 V CCB 29 OUT 28 OUTQ V CCB 27 26 n.c. 25 n.c. 24 n.c. 23 n.c. 22 n.c. 21 n.c. MGU135 ...
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... 2.5 scale (1) ( 0.20 5.1 3.1 5.1 3.1 0.5 0.09 4.9 2.7 4.9 2.7 REFERENCES JEDEC EIAJ detail 7.1 7.1 0.75 1.0 0.2 0.08 6.9 6.9 0.45 EUROPEAN PROJECTION Product specification TZA3014 SOT547 (1) ( 0.89 0.89 7 0.08 0.61 0.61 0 ISSUE DATE 99-06-15 ...
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... 0.50 0.50 5.1 3.2 5.1 0.35 0.35 4.9 3.0 4.9 REFERENCES JEDEC EIAJ MO-217 detail 3.2 0.5 4.2 4.2 4.15 4.15 3.0 EUROPEAN PROJECTION Product specification TZA3014 SOT560 0.15 0.15 0.05 0.2 ISSUE DATE 99-09-10 00-02-01 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 25 Product specification TZA3014 ...
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... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. 26 Product specification TZA3014 SOLDERING METHOD WAVE REFLOW suitable (2) suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 27 Product specification TZA3014 ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...