tza3043b NXP Semiconductors, tza3043b Datasheet
tza3043b
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tza3043b Summary of contents
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... DATA SHEET TZA3043; TZA3043B Gigabit Ethernet/Fibre Channel transimpedance amplifier Product specification Supersedes data of 1998 Jul 08 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 2000 Mar 28 ...
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... SO8 plastic small outline package; 8 leads; body width 3.9 mm TZA3043BU bare die in waffle pack carriers; die dimensions 1.030 2000 Mar 28 TZA3043; TZA3043B APPLICATIONS Digital fibre optic receiver in medium and long haul optical telecommunications transmission systems or in high speed data networks Wideband RF gain block. ...
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... Fig.1 Block diagram of TZA3043T and TZA3043U. handbook, full pagewidth (1) DREF IPhoto 3 (4) The numbers in brackets refer to the pad numbers of the bare die version. (1) AGC analog I/O (pad 13) is only available on the TZA3043BU. Fig.2 Block diagram of TZA3043BT and TZA3043BU. 2000 Mar 28 (1) AGC (13 125 ...
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... OUT goes HIGH output when current flows into pin IPhoto data compliment of pin OUT output supply supply voltage input/ AGC analog I/O output V CC DREF 1 8 GND 2 7 OUT TZA3043BT 3 OUTQ IPhoto 6 GND GND 4 5 MGU098 Fig.4 Pin configuration of TZA3043BT. ...
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... AGC. AGC monitoring The AGC voltage can be monitored at pad 13 on the bare die (TZA3043U/TZA3043BU). Pad 13 is not bonded in the packaged device (TZA3043T/TZA3043BT). This pad can be left unconnected during normal operation. It can also be used to force an external AGC voltage. If pad 13 (AGC) is connected to GND, the internal AGC loop is disabled and the receiver gain maximum ...
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... Fig.7. Proper filtering of the bias voltage for the PIN diode is essential to achieve the highest sensitivity level low-pass filter MGU103 negative supply voltage Fig.8 6 Product specification TZA3043; TZA3043B 0.82 V) for when such a voltage source 125 125 1 ...
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... A). The AGC can not regulate any more above 500 A input current and the output voltage rises again with the input current. (1) (2) ( Fig.9 AGC characteristics. 7 Product specification TZA3043; TZA3043B MGU105 V OUT OUTQ ...
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... Additional safety can be obtained by bonding the V remaining pads may then be bonded to their external connections in any order. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th(j-a) 2000 Mar 28 PARAMETER PARAMETER 8 Product specification TZA3043; TZA3043B MIN. MAX. UNIT ...
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... MHz GHz tested note 3.3 V; note MHz; input current i <2 A (p-p) referenced to input 920 MHz; note 3 9 Product specification TZA3043; TZA3043B MIN. TYP. MAX 5 170 259 mW 112 169 mW 40 ...
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... MHz at 10 MHz will typically add an extra the photodiode current. CC where T is the clock period. The PWD is measured differentially with = 1 pF. This was comprised of 0.5 pF for the i 10 Product specification TZA3043; TZA3043B MIN. TYP. MAX 1.7 V 1.4 V ...
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... MGU114 920 handbook, halfpage V i (mV) 840 760 680 ( Fig.13 Input voltage as a function of the junction 11 Product specification TZA3043; TZA3043B MGU113 (V) voltage. MGU115 (1) ( temperature. 6 ...
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... Mar 28 MGU116 1.85 handbook, halfpage V o(cm) (V) 1.75 1. Fig.15 Common mode voltage at the output Product specification TZA3043; TZA3043B MGU117 (1) ( OUT V . OUTQ function of the junction temperature. 120 ...
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... Philips Semiconductors Gigabit Ethernet/Fibre Channel transimpedance amplifier APPLICATION AND TEST INFORMATION handbook, full pagewidth 22 nF DREF 1 IPhoto GND (1) For TZA3043BT pin 7 is OUT and pin 6 is OUTQ. 2000 Mar 680 (1) OUTQ 7 TZA3043T (1) OUT ...
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... MHz GND GND GND (1) Ferrite bead e.g. Murata BLM10A700S. (2) For TZA3043BT pin 7 is OUT and pin 6 is OUTQ. Fig.17 Gigabit Ethernet/Fibre Channel receiver using the TZA3043T and TZA3044 680 nF (1) 100 nF 180 k V CCA RSET CF 6 ...
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... .( 470 , NETWORK ANALYZER S-PARAMETER TEST SET PORT 1 PORT 100 nF OUT 10 nF 470 IPhoto OUTQ 51 100 nF TZA3043 OM5803 Fig.18 Electrical test circuit. 15 Product specification TZA3043; TZA3043B SAMPLING OSCILLOSCOPE/ TDR/TDT MGU106 ...
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... GHz 2000 Mar 28 OPTICAL INPUT OUT 90% 10% BLM DREF IPhoto PIN TZA3043 10 nF Laser OM5804 Fig.19 Optical test circuit. 16 Product specification TZA3043; TZA3043B ERROR DETECTOR Data Clock 100 nF SAMPLING OUT OSCILLOSCOPE/ TDR/TDT OUTQ 1 100 ...
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... Gigabit Ethernet/Fibre Channel transimpedance amplifier handbook, full pagewidth Fig.20 Differential output with 25 dBm optical input power [input current of 5.17 A (p-p)]. handbook, full pagewidth Fig.21 Differential output with 15 dBm optical input power [input current of 51.7 A (p-p)]. 2000 Mar 28 TZA3043; TZA3043B MGU108 MGU109 17 Product specification ...
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... Gigabit Ethernet/Fibre Channel transimpedance amplifier handbook, full pagewidth Fig.22 Differential output with 5 dBm optical input power [input current of 517 A (p-p)]. handbook, full pagewidth Fig.23 Differential output with 2 dBm optical input power [input current of 1030 A (p-p)]. 2000 Mar 28 TZA3043; TZA3043B MGU110 MGU111 18 Product specification ...
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... DREF 10 OUTQ 1300 m 9 OUT IPhoto 8 MGU099 Fig.25 Bonding pad locations of the TZA3043BU. 19 Product specification TZA3043; TZA3043B (1) COORDINATES 215 360 549 691 785 785 567 424 259 TZA3043BU ...
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... Metallization 1.22 m W/AlCu/TiW Thickness 380 m nominal Size 1.03 Backing silicon; electrically connected to GND potential through substrate contacts Attach temperature <440 C; recommended die attach is glue Attach time <15 s 2000 Mar 28 VALUE 2 1.30 mm (1. Product specification TZA3043; TZA3043B 90 m (pad size = 100 100 m) ...
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... 0.49 0.25 5.0 4.0 6.2 1.27 0.36 0.19 4.8 3.8 5.8 0.0100 0.20 0.16 0.244 0.050 0.0075 0.19 0.15 0.228 REFERENCES JEDEC EIAJ MS-012 21 Product specification TZA3043; TZA3043B detail 1.0 0.7 1.05 0.25 0.25 0.1 0.4 0.6 0.039 0.028 0.041 0.01 0.01 0.004 0.016 0.024 EUROPEAN ...
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... To overcome these problems the double-wave soldering method was specifically developed. 2000 Mar 28 TZA3043; TZA3043B If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Mar 28 TZA3043; TZA3043B SOLDERING METHOD WAVE not suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 24 Product specification TZA3043; TZA3043B (1) Philips Semiconductors ...
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... Philips Semiconductors Gigabit Ethernet/Fibre Channel transimpedance amplifier 2000 Mar 28 TZA3043; TZA3043B NOTES 25 Product specification ...
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... Philips Semiconductors Gigabit Ethernet/Fibre Channel transimpedance amplifier 2000 Mar 28 TZA3043; TZA3043B NOTES 26 Product specification ...
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... Philips Semiconductors Gigabit Ethernet/Fibre Channel transimpedance amplifier 2000 Mar 28 TZA3043; TZA3043B NOTES 27 Product specification ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...