tb62730wlg TOSHIBA Semiconductor CORPORATION, tb62730wlg Datasheet

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tb62730wlg

Manufacturer Part Number
tb62730wlg
Description
Step Up Type Dc-dc Converter For White Led
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
TOSHIBA
TOSHIBA BiCD Digital INTEGRATED CIRCIUTS SILICON MONOLITHIC
Version No.
Data Sheet
0.10
0.11
Step-up type DC/DC Converter for White LED
2007-4-26
2007-6-13
Data
APPLICATION ENGINEERING GROUP 3
TOSHIBA MICROELECTRONICS CORP.
Development specification
same as Japanese version 0.4
add the Package Dimension
TB62730WLG
Note
Tentative
13-Jun-07 (Rev0.1) TB62730WLG (Page. 1/11)
TB62730WLG
Kobayashi
Kobayashi
Charge

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tb62730wlg Summary of contents

Page 1

... TOSHIBA BiCD Digital INTEGRATED CIRCIUTS SILICON MONOLITHIC Step-up type DC/DC Converter for White LED Data Sheet Data Version No. 0.10 2007-4-26 0.11 2007-6-13 TB62730WLG Development specification TOSHIBA MICROELECTRONICS CORP. APPLICATION ENGINEERING GROUP 3 same as Japanese version 0.4 add the Package Dimension TB62730WLG Tentative Note 13-Jun-07 (Rev0.1) TB62730WLG (Page. 1/11) Charge Kobayashi Kobayashi ...

Page 2

... TOSHIBA TOSHIBA BiCD Digital Integrated Circuit Silicon Monolithic Step Up Type DC-DC Converter for White LED TB62730WLG is the high efficient STEP-UP type DC/DC converter by which the optimal design was carried out at constant current driver of white LED possible to drive white LEDs whose constant output current is 800mA by the lithium ion battery ...

Page 3

... TOSHIBA ■ Block Diagram VIN Cin Css Tentative L 11 Thermal Shutdown OSC PWM Control Flash or Light Error AMP. Reference 285mV Soft Start TB62730WLG S- Over Voltage Protection VIN SW Control 13-Jun-07 (Rev0.1) TB62730WLG (Page. 3/11) Cout ...

Page 4

... PGND2 Ground terminal for the power device. Pin Assignment (top view) ■ TOP VIEW Tentative :DC-DC operation :Flash mode :Lighting mode 16 A1 12 *** TOP VIEW TB62730WLG Function 13-Jun-07 (Rev0.1) TB62730WLG (Page. 4/11) ...

Page 5

... VIN + 0.3 - 0.3 ∼ 15 1000 - 40 ∼ ∼ 150 Min. Typ. Max. 2.8 - 5.5 1.3 VIN − 0 − 0.4 - 800 - - 0.375 - 8 2200 3300 10000 - 3.9 - − 100 300 13-Jun-07 (Rev0.1) TB62730WLG (Page. 5/11) Unit °C °C Unit Ω kΩ kΩ µF µF pF µH ms ...

Page 6

... LED V - OVP TB62730WLG Tentative ) Min. Typ. Max. - 4.3 7.5 - 600 800 - 0.01 0 1.67 2.00 2.50 2 0.5 111 125 138 271 285 299 271 285 299 - 120 150 180 13-Jun-07 (Rev0.1) TB62730WLG (Page. 6/11) Unit mA µA µA 70 µA MHz - A µ ℃ ...

Page 7

... Recommended Application L S-Di OVP VIN SW1 SW2 EN2 RSENS1 EN1 RSENS2 SS IL PGND1 PGND2 GND 47kΩ TB62730WLG Tentative Min. Typ. Max. 18.5 19.5 20.5 17.55 19.50 21.45 0.865 0.910 0.955 - 0.25 - 2.00 2.50 3.00 1.3 - VIN +0.15 -0.15 - 0.4 V LED K1 800mA (Typ.) K2 8.2kΩ FB+ 0.375Ω 13-Jun-07 (Rev0.1) TB62730WLG (Page. 7/11) Unit µ Ω µA V 10µF ...

Page 8

... The operation might be unstable when the condition is in the light load (IF(mA)is 30mA or less). Pay attention in setting the current. ・Shutdown mode It stops the operation. EN2 0.285V - 0.91V(Vreference)X R1 TB62730WLG Tentative MODE Shutdown mode Torch mode Flash mode R3 R2 13-Jun-07 (Rev0.1) TB62730WLG (Page. 8/11) ...

Page 9

... Internal shutdown circuit operates to turn off the output when IC temperature reaches the rating and TSD circuit drives. Setting TSD operating temperature: 120℃ to180℃. Tentative mode method. The ability of the output current is changed by the consecutive RSENS terminal voltage ※ Output current= RSENS resistance TB62730WLG 13-Jun-07 (Rev0.1) TB62730WLG (Page. 9/11) ...

Page 10

... TOSHIBA ■ Package Dimension TB62730WLG Tentative 13-Jun-07 (Rev0.1) TB62730WLG (Page. 10/11) ...

Page 11

... IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. TB62730WLG Tentative Thorough evaluation is required, 13-Jun-07 (Rev0.1) TB62730WLG (Page. 11/11) ...

Page 12

... If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. TB62730WLG Tentative ) at any time and condition. These ICs generate heat even during J 13-Jun-07 (Rev0.1) TB62730WLG (Page. 12/11) ...

Page 13

... Use of Sn-37Pb solder bath *solder bath temperature = 230ºC *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245ºC *dipping time = 5 seconds *number of times = once *use of R-type flux TB62730WLG Tentative 13-Jun-07 (Rev0.1) TB62730WLG (Page. 13/11) ...

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