se95u NXP Semiconductors, se95u Datasheet
se95u
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se95u Summary of contents
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SE95 Ultra high accuracy digital temperature sensor and thermal watchdog Rev. 05 — 13 December 2007 1. General description The SE95 is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma Delta analog-to-digital conversion technique. The device ...
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... Ordering information Type Package number Temperature range SE95D +125 C SE95DP +125 C SE95U +125 C SE95_5 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog 1 C from +100 C Name Description SO8 plastic small outline package; 8 leads; body width 3.9 mm TSSOP8 plastic thin shrink small outline package ...
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... NXP Semiconductors 5. Block diagram AVD CONTOL AND OTP CONTROL SE95 BIAS BAND GAP SIGMA DELTA MODULATOR OSCILLATOR POR Fig 1. Block diagram of SE95 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for SO8 6.2 Pin description Table 2. Symbol SDA SCL OS GND A2 SE95_5 Product data sheet ...
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... NXP Semiconductors Table 2. Symbol Functional description 7.1 General operation The SE95 uses the on-chip band gap sensor to measure the device temperature with a resolution of 0.03125 C and stores the 13-bit two’s complement digital data, resulting from 13-bit analog to digital conversion, into register Temp. Register Temp can be read at any time by a controller on the I conversion in progress during the read operation ...
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... NXP Semiconductors In OS interrupt mode, the OS output is used for thermal interruption. When the device is powered-up, the OS output is first activated only when T active indefinitely until being reset by a read of any register. Once the OS output has been activated by crossing T below T register. The OS interrupt operation would be continued in this sequence: T ...
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... NXP Semiconductors 7.2 OS output and polarity The OS output is an open-drain output and its state represents results of the device watchdog operation as described in external pull-up resistor is needed. The resistor should be as large as possible 200 minimize the T current. The OS output active state can be selected as HIGH or LOW by programming bit OS_POL of register Conf: setting bit OS_POL to logic 1 selects OS active HIGH and setting to logic 0 sets OS active LOW ...
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... NXP Semiconductors 7.5 Shutdown mode The device operation mode is selected by programming bit SHUTDOWN of register Conf. Setting bit SHUTDOWN to logic 1 will put the device into shutdown mode. Resetting bit SHUTDOWN to logic 0 will return the device to normal mode. In shutdown mode, the device draws a small current of approximately 7.5 A and the power dissipation is minimized ...
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... NXP Semiconductors false alert if the address 0Ch is sent and cannot be active on the I used. Consider using the SE98 since it supports SMBus ARA as well as time-out features and provides 1 C accuracy. Table 4. MSB 1 8.2 Register list The SE95 contains 7 data registers. The registers can be 1 byte or 2 bytes wide, and are defi ...
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... NXP Semiconductors At power-up, the pointer value is preset to logic 0 for register Temp; users can then read the temperature without specifying the pointer byte. 8.4 Configuration register The Configuration (Conf) register is a read/write register and contains an 8-bit non-complement data byte that is used to configure the device for different operating conditions ...
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... NXP Semiconductors When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) must be collected and then the two’s complement data value according to the desired resolution must be selected for the temperature calculation. two’s complement data value, data value. ...
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... NXP Semiconductors Obviously, for 9-bit Temp data application in replacing the industry standard LM75, just use only 9 MSB bits of the two bytes and disregard 7 LSB of the LSByte. The 9-bit Temp data with 0.5 C resolution of the SE95 is defined exactly in the same way as for the standard LM75 and it is here similar to the Tos and Thyst registers ...
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... NXP Semiconductors 8.7 Protocols for writing and reading the registers The communication between the host and the SE95 must follow the rules strictly as defined by the I operations are illustrated in 1. Before a communication, the I and SDA lines must both be released by all devices on the bus, and they become HIGH by the bus pull-up resistors ...
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... NXP Semiconductors SCL SDA device address START acknowledge Fig 5. Write configuration register (1-byte data SCL SDA device address START 1 2 SCL (cont.) SDA (cont device address Fig 6. Read configuration register including pointer byte (1-byte data) ...
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... NXP Semiconductors 1 SCL SDA S 1 START 1 SCL (cont.) SDA (cont.) D7 Fig 8. Write Tos or Thyst register (2-byte data SCL SDA device address START SCL (cont) SDA (cont device address Fig 9 ...
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... NXP Semiconductors 9. Limiting values Table 15. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I(SCL) V I(SDA) V I(A0) V I(A1) V I(A2) I I(PIN) I O(OS) V O(OS) V esd T stg T j 10. Recommended operating conditions Table 16. Symbol amb SE95_5 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog ...
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... NXP Semiconductors 11. Static characteristics Table 17. Static characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T temperature accuracy ACC T temperature resolution RES t temperature conversion time CON(T) I supply current CC V HIGH-level input voltage IH V LOW-level input voltage IL V input voltage hysteresis ...
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... NXP Semiconductors 12. Dynamic characteristics Table 18. Dynamic characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T SCL clock period CLK t HIGH period of the SCL clock (SCL)H t LOW period of the SCL clock (SCL)L t hold time (repeated) START condition HD;STA ...
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... NXP Semiconductors 13. Performance curves 25 I CC( 3 Fig 12. Shutdown supply current as a function of temperature 300 200 100 Fig 14. Typical normal I C-bus inactive supply current as a function of temperature 25 t conv(T) (ms ...
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... NXP Semiconductors 14. Application information BUS PULL-UP RESISTORS 2 I C-BUS DIGITAL LOGIC OR TIE Fig 18. Typical application circuit SE95_5 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog power supply 0 SCL 2 SDA 1 SE95 GND GND Rev. 05 — ...
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... NXP Semiconductors 15. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 16. Revision history Table 19. Revision history Document ID Release date SE95_5 20071213 • Modifications: Section 8.1 “Slave SE95_4 20070212 SE95_3 20051212 (9397 750 14388) SE95_2 20041005 (9397 750 14163) SE95_1 20031003 (9397 750 10265) SE95_5 Product data sheet Ultra high accuracy digital temperature sensor and thermal watchdog ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 General operation . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 OS output and polarity . . . . . . . . . . . . . . . . . . . 6 7.3 OS comparator and interrupt modes . . . . . . . . 6 7.4 OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.5 Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7 7.6 Power-up default and power-on reset . . . . . . . . 7 ...