HEF4068BT,653 NXP Semiconductors, HEF4068BT,653 Datasheet

IC 8INPUT NAND GATE 14SOIC

HEF4068BT,653

Manufacturer Part Number
HEF4068BT,653
Description
IC 8INPUT NAND GATE 14SOIC
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets

Specifications of HEF4068BT,653

Logic Type
NAND Gate
Number Of Inputs
8
Number Of Circuits
1
Current - Output High, Low
2.4mA, 2.4mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
933372990653
HEF4068BTD-T
HEF4068BTD-T
INTEGRATED CIRCUITS
DATA SHEET
Package outlines
Package information
January 1995
File under Integrated Circuits, IC04

Related parts for HEF4068BT,653

HEF4068BT,653 Summary of contents

Page 1

DATA SHEET Package outlines Package information File under Integrated Circuits, IC04 INTEGRATED CIRCUITS January 1995 ...

Page 2

Philips Semiconductors Package information INDEX PACKAGE VERSIONS SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm SOT109-1 plastic small outline package; 16 leads; body width 3.9 mm SOT162-1 plastic small outline package; 16 leads; body width 7.5 ...

Page 3

Philips Semiconductors Package information SO SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 4

Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 5

Philips Semiconductors Package information SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 6

Philips Semiconductors Package information SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 7

Philips Semiconductors Package information SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 8

Philips Semiconductors Package information SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 9

Philips Semiconductors Package information SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 10

Philips Semiconductors Package information SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 11

Philips Semiconductors Package information SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 12

Philips Semiconductors Package information SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 13

Philips Semiconductors Package information SSOP28: plastic shrink small outline package; 28 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 14

Philips Semiconductors Package information DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

Page 15

Philips Semiconductors Package information DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. ...

Page 16

Philips Semiconductors Package information DIP18: plastic dual in-line package; 18 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 17

Philips Semiconductors Package information DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 18

Philips Semiconductors Package information DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 19

Philips Semiconductors Package information DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 20

Philips Semiconductors Package information DIP40: plastic dual in-line package; 40 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. ...

Page 21

Philips Semiconductors Package information CDIP handbook, full pagewidth 3.4 2.9 2.54 max 14 1 Dimensions in mm. Ceramic dual in-line package; 14 leads; glass seal (CDIP14; SOT73-1). January 1995 19.94 max 5.08 max 0.51 min 0.254 M 2.54 0.51 (12x) ...

Page 22

Philips Semiconductors Package information 1/1 page = 296 mm (Datasheet) 3.4 2.9 1.27 max 16 1 Dimensions in mm. Ceramic dual in-line package; 16 leads; glass seal (CDIP16; SOT74-1). January 1995 19.94 max 0.51 min 0.254 2.54 0.51 (14x) 0.38 ...

Page 23

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 18 1 Dimensions in mm. Ceramic dual in-line package; 18 leads; glass seal (CDIP18; SOT133-1). January 1995 23.6 max 0.51 min 0.254 2.54 0.51 (16x) 0.38 1 ...

Page 24

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 1.27 max 20 1 Dimensions in mm. Ceramic dual in-line package; 20 leads; glass seal (CDIP20; SOT152-2). January 1995 25.4 max 0.51 min 0.254 2.54 0.51 (18x) 0.38 1 ...

Page 25

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 24 1 Dimensions in mm. Ceramic dual in-line package; 24 leads; glass seal (CDIP24; SOT94-1). January 1995 33 max 0.51 min 0.254 M 2.54 0.58 (22x) 0.38 1.7 max ...

Page 26

Philips Semiconductors Package information handbook, full pagewidth 3.4 2.9 2.54 max 28 1 Dimensions in mm. Ceramic dual in-line package; 28 leads; glass seal (CDIP28; SOT135-1). January 1995 38.1 max 0.58 2.54 0.38 (26x) 1.7 max Package ...

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