oq2541u NXP Semiconductors, oq2541u Datasheet

no-image

oq2541u

Manufacturer Part Number
oq2541u
Description
Sdh/sonet Data And Clock Recovery Unit Stm1/4/16 Oc3/12/48 Ge
Manufacturer
NXP Semiconductors
Datasheet
Product specification
Supersedes data of 1999 Mar 19
File under Integrated Circuits, IC19
DATA SHEET
OQ2541HP; OQ2541U
SDH/SONET data and clock
recovery unit STM1/4/16
OC3/12/48 GE
INTEGRATED CIRCUITS
1999 May 27

Related parts for oq2541u

oq2541u Summary of contents

Page 1

... DATA SHEET OQ2541HP; OQ2541U SDH/SONET data and clock recovery unit STM1/4/16 OC3/12/48 GE Product specification Supersedes data of 1999 Mar 19 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 May 27 ...

Page 2

... Synchronous Optical Network (SONET) systems. The circuit recovers data and extracts the clock signal from an incoming bitstream up to 2.5 Gbits/s. It can be configured for use in STM1/OC3, STM4/OC12, STM16/OC48 and Gigabit Ethernet systems. PACKAGE DESCRIPTION 2360 380 m 2 Product specification OQ2541HP; OQ2541U VERSION 7 1.4 mm SOT313-2 ...

Page 3

... OQ2541 enable FREQUENCY WINDOW DETECTOR (1000 ppm) dt 130 pF FREQUENCY DIVIDER 2 64/128 LOCK DREF19 DREF39 CAPDOQ CAPUPQ Fig.1 Block diagram. 3 Product specification OQ2541HP; OQ2541U DOUT155 AREF ENL DOUT 43 DOUTQ 45 COUT DATA 46 COUTQ AND 6 CLOCK DLOOP 7 OUTPUT DLOOPQ ...

Page 4

... DINQ 34 inverting data input (differential) GND 35 ground; note 1 i.c. 36 internally connected; note control output for negative power supply GND 38 ground; note 1 LOS 39 loss of signal detection output i.c. 40 internally connected; note 2 1999 May 27 OQ2541HP; OQ2541U DESCRIPTION 4 Product specification ...

Page 5

... GND DLOOP DLOOPQ GND DREF19 GND GND LOCK 1999 May 27 DESCRIPTION OQ2541HP Fig.2 Pin configuration. 5 Product specification OQ2541HP; OQ2541U pin or pad unconnected i.c. 35 GND 34 DINQ 33 DIN 32 GND V EE2 31 DOUT155 30 29 GND 28 DOUT622 27 DOUT1250 26 GND 25 ...

Page 6

... The data and clock signals are available at the CML output buffers, which are capable of driving a 50 load. RF data and clock input circuit B The schematic of the input circuit is shown in Fig.4. MGK143 RF data and clock output circuit The schematic of the output circuit is shown in Fig.5. 6 Product specification OQ2541HP; OQ2541U ...

Page 7

... R impedance of the OQ2541 (100 ). RESISTOR R1 2.0 6.8 8.2 7 Product specification OQ2541HP; OQ2541U 100 100 DOUTQ, COUTQ DOUT, COUT V AREF MGL670 V EE Fig.5 RF data and clock output circuit. and 16 k connected between initially fixes this level ...

Page 8

... AREF R AREF where R1 = 500 , and V off chip To maintain a single-ended swing of 200 mV (p-p) across MGL667 a 50 – 100 mV This can be achieved by connecting a 7.3 k resistor between pins AREF and V 8 Product specification OQ2541HP; OQ2541U on chip GND off chip 1 F (1) L1 4.5 V MGL732 ...

Page 9

... A pull-up resistor should be connected to a positive supply voltage. Pin LOS will HIGH-level (TTL) if the data signal is absent on pins DIN and DINQ or if BER > otherwise pin LOS will LOW-level if BER < Product specification OQ2541HP; OQ2541U 2 and the de-assert level is around ...

Page 10

... V EE application, the pins can be controlled through low-ohmic switching FETs, e.g. BSH103 or equivalent (low R DIVISION FACTOR DOUT155 OQ2541HP; OQ2541U EE (the dividers are daisy chained) EE and ground carry a current of a few EE LEVEL ON PIN DOUT622 ground V EE ground ...

Page 11

... CC Fig.9 DLOOP, DLOOPQ, CLOOP AND CLOOPQ (+ DESCRIPTION Product specification OQ2541HP; OQ2541U on chip off chip GND BC857 LOS, LOCK 10 k MGL671 Signal out for LOS and LOCK indication in a positive supply voltage application. OUTPUT DOUT, DOUTQ, COUT AND COUTQ ...

Page 12

... The position of a decoupling capacitor is very important. A decoupling capacitor on an unfavourable position could do more damage than completely omitting the capacitor, while on the right location it can mean the difference between mediocre results and the ultimate achievement. and good CC 12 Product specification OQ2541HP; OQ2541U ...

Page 13

... Thermal resistance from junction to ambient is determined with the IC soldered on a standard single sided 57 57 1.6 mm FR4 epoxy PCB with 35 m thick copper traces. The measurements are performed in still air. 1999 May 27 PARAMETER CONDITIONS in free air; note 1 13 Product specification OQ2541HP; OQ2541U MIN. MAX. UNIT ...

Page 14

... Fig.10 default adjustment; note 6 special adjustment; note 7 single-ended differential; 20% to 80% differential; 20% to 80% differential; 20% to 80% differential; 20% to 80% see Fig.11; note 8 floating pin note 9 note 9 14 Product specification OQ2541HP; OQ2541U MIN. TYP. MAX. UNIT 3.50 3.30 3.10 V 105 155 mA 350 550 mW ...

Page 15

... MHz STM4/OC12 mode; note kHz to 5 MHz kHz to 5 MHz f = 250 kHz to 5 MHz STM16/OC48 mode; note kHz to 20 MHz kHz to 20 MHz MHz 15 Product specification OQ2541HP; OQ2541U MIN. TYP. MAX. UNIT 0.6 V 3.3 V 0.1 s ...

Page 16

... MHz STM16/OC48 mode; note kHz to 20 MHz kHz to 20 MHz MHz note guaranteed. The typical input sensitivity for BER < connected to ground. 16 Product specification OQ2541HP; OQ2541U MIN. TYP. MAX. UNIT 0.0060 UI 0.0046 UI 0.0041 UI ...

Page 17

... Fig.11 Data-to-clock delay for CML outputs: COUT to DOUT or CLOOP to DLOOP. 1999 May 27 GND V O(max) V OQH i(p-p) V OQL O(min) Fig.10 Logic level symbol definitions for CML. t d(D-C) 17 OQ2541HP; OQ2541U CML OUTPUT GND 200 mV GND 200 mV MGL672 Product specification GND V o(p-p) MGK144 ...

Page 18

... Fig.13 Supply current as a function of the MGL653 70 handbook, halfpage t f(C) (ps 120 Measured on single-ended output. Fig.15 Clock output fall time as a function of the 18 Product specification OQ2541HP; OQ2541U temperature temperature. MGL649 120 MGL652 120 ...

Page 19

... Fig.18 Data-to-clock delay time as a function of the temperature. 1999 May 27 MGL655 110 handbook, halfpage t f(D) (ps) 100 120 Measured on single-ended output. Fig.17 Data output fall time as a function of the MGL651 80 120 Product specification OQ2541HP; OQ2541U temperature. MGL654 120 ...

Page 20

... V i(p-p) (mV) A complementary input signal of the indicated value is applied to pins DIN and DINQ. Fig.20 Bit error rate as a function of the input signal 20 Product specification OQ2541HP; OQ2541U 0 i(p-p) (mV) in STM4/OC12 mode (622.08 Mbits/s). ...

Page 21

... A complementary input signal of the indicated value is applied to pins DIN and DINQ. Fig.21 Bit error rate as a function of the input signal in STM16/OC48 mode (2488.32 Mbits/s). 1999 May 27 MGL656 1 1.5 V i(p-p) (mV) 21 Product specification OQ2541HP; OQ2541U ...

Page 22

... Device performance measured on OM5802 demoboard. (2) ITU specification template. Fig.23 Jitter tolerance as a function of the jitter frequency in the STM4/OC12 mode (622.08 Mbits/s). 1999 May 27 (1) ( (1) ( Product specification OQ2541HP; OQ2541U MGL659 (kHz) MGL660 (kHz) ...

Page 23

... J tol(p-p) (UI (1) Device performance measured on OM5801 demoboard. (2) ITU specification template. Fig.24 Jitter tolerance as a function of the jitter frequency in the STM16/OC48 mode (2488.32 Mbits/s). 1999 May 27 (1) ( Product specification OQ2541HP; OQ2541U MGL661 (kHz) ...

Page 24

... Measured single-ended. Fig.25 Data and clock output waveforms in the STM4/OC12 mode (622.08 Mbits/s). handbook, full pagewidth 200 mV/div Measured single-ended. Fig.26 Data and clock output waveforms in the STM16/OC48 mode (2488.32 Mbits/s). 1999 May 27 OQ2541HP; OQ2541U MGS228 MGS229 24 Product specification ...

Page 25

... OQ2541 CREF 21 CREFQ 22 DREF19 9 DREF39 24 5 13, 18, 19, i.c. 36 EE1 V EE2 (1) GND 17 100 > 100 Product specification OQ2541HP; OQ2541U 3 LOS 39 3 LOCK 12 DOUT 42 DOUTQ 43 normal COUT output 45 COUTQ 46 DLOOP 6 DLOOPQ 7 loop CLOOP output 3 CLOOPQ 4 ENL ...

Page 26

... OQ2541 CREF 21 CREFQ 22 DREF19 9 DREF39 24 5 13, 18, 19, i.c. 36 EE1 V EE2 (1) GND 17 100 > 100 Product specification OQ2541HP; OQ2541U 3 LOS 39 3 LOCK 12 DOUT 42 DOUTQ 43 normal COUT output 45 COUTQ 46 DLOOP 6 DLOOPQ 7 loop CLOOP output 3 CLOOPQ 4 ENL ...

Page 27

... GND 17 100 > 100 the PCB plane (pins 10, 11, 14, 17, 20, 23, 26, 29, 32, 35, 38, 41, 44 and 47 Product specification OQ2541HP; OQ2541U V CC LOS 39 LOS LOCK 12 LOCK 10 k DOUT 42 DOUTQ 43 normal unused ...

Page 28

... OQ2541U 2.360 mm Fig.30 Bonding pad locations of OQ2541U. 28 Product specification OQ2541HP; OQ2541U i.c. 35 GND 34 DINQ 33 DIN 32 GND 31 V EE2 30 DOUT155 29 GND 28 DOUT622 27 DOUT1250 26 GND 25 V EE1 ...

Page 29

... Product specification OQ2541HP; OQ2541U (1) COORDINATES PAD +542.5 +1017.5 40 +387.5 +1017.5 41 +232.5 +1017.5 42 +77.5 +1017.5 43 77.5 +1017.5 44 232.5 +1017.5 45 387.5 +1017 ...

Page 30

... On its turn, this copper should be able to loose its heat to the environment through radiation, natural convection (non forced airflow over the printed-circuit board) or forced cooling. 1999 May 27 DESCRIPTION 2 2.360 mm (5.5696 mm ) potential through substrate contacts EE 30 Product specification OQ2541HP; OQ2541U 90 m (pad size = 100 100 m) ...

Page 31

... 2.5 scale (1) ( 0.27 0.18 7.1 7.1 9.15 0.5 0.17 0.12 6.9 6.9 8.85 REFERENCES JEDEC EIAJ 31 OQ2541HP; OQ2541U detail 9.15 0.75 1.0 0.2 0.12 0.1 8.85 0.45 EUROPEAN PROJECTION Product specification SOT313 (1) ( 0.95 0.95 ...

Page 32

... To overcome these problems the double-wave soldering method was specifically developed. 1999 May 27 OQ2541HP; OQ2541U If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave ...

Page 33

... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 May 27 SOLDERING METHOD WAVE not suitable (2) suitable (3)(4) not recommended (5) not recommended 33 Product specification OQ2541HP; OQ2541U (1) REFLOW suitable suitable suitable suitable suitable ...

Page 34

... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 May 27 OQ2541HP; OQ2541U 34 Product specification ...

Page 35

... Philips Semiconductors SDH/SONET data and clock recovery unit STM1/4/16 OC3/12/48 GE 1999 May 27 OQ2541HP; OQ2541U NOTES 35 Product specification ...

Page 36

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + ...

Related keywords