IC SINGLE INVERTER-GATE SOT-23-5

SN74LVC1G04DBVR

Manufacturer Part NumberSN74LVC1G04DBVR
DescriptionIC SINGLE INVERTER-GATE SOT-23-5
ManufacturerTexas Instruments
Series74LVC
SN74LVC1G04DBVR datasheets
 


Specifications of SN74LVC1G04DBVR

Logic TypeInverterNumber Of Inputs1
Number Of Circuits1Current - Output High, Low32mA, 32mA
Voltage - Supply1.65 V ~ 5.5 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / CaseSOT-23-5, SC-74A, SOT-25
Logic Family74LVCHigh Level Output Current- 32 mA
Low Level Output Current32 mASupply Voltage (max)5.5 V
Supply Voltage (min)1.65 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTOperating Supply Voltage1.65 V to 5.5 V
Logical FunctionInverterNumber Of Elements1
Propagation Delay Time7.5nsOperating Supply Voltage (typ)1.8/2.5/3.3/5V
Package TypeSOT-23Operating Temp Range-40C to 85C
Pin Count5Quiescent Current10uA
TechnologyCMOSMountingSurface Mount
Operating Temperature ClassificationIndustrialOperating Supply Voltage (max)5.5V
Operating Supply Voltage (min)1.65VLead Free Status / RoHS StatusLead free / RoHS Compliant
Other names296-11599-2  
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SN74LVC1G04
SCES214W – APRIL 1999 – REVISED MARCH 2011
DESCRIPTION/ORDERING INFORMATION
This single inverter gate is designed for 1.65-V to 5.5-V V
The SN74LVC1G04 performs the Boolean function Y = A.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
preventing damaging current backflow through the device when it is powered down.
T
PACKAGE
A
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV
(Pb-free)
SON – DSF
–40°C to 85°C
SON – DRY
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP/YZV: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
2
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operation.
CC
Table 3. ORDERING INFORMATION
(1) (2)
ORDERABLE PART NUMBER
SN74LVC1G04YZPR
SN74LVC1G04YZVR
Reel of 5000
SN74LVC1G04DSFR
SN74LVC1G04DRYR
Reel of 5000
SN74LVC1G04DRYRG4
Reel of 3000
SN74LVC1G04DBVR
Reel of 250
SN74LVC1G04DBVT
Reel of 3000
SN74LVC1G04DCKR
Reel of 250
SN74LVC1G04DCKT
Reel of 4000
SN74LVC1G04DRLR
Product Folder Link(s):
SN74LVC1G04
www.ti.com
. The I
circuitry disables the outputs,
off
off
TOP-SIDE MARKING
_ _ _ CC_
_ _ _ CC_
CC
CC
C04_
CC_
Copyright © 1999–2011, Texas Instruments Incorporated
(3)