srf55v02p Infineon Technologies Corporation, srf55v02p Datasheet

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srf55v02p

Manufacturer Part Number
srf55v02p
Description
Intelligent Eeprom With Contactless Interface Compliant To
Manufacturer
Infineon Technologies Corporation
Datasheet
Sh ort Pro duct In fo rmation
M a rch 2 00 9
m y - d ™ v i c i n i t y p l a i n
S R F 5 5 V 0 2 P
S R F 5 5 V 0 2 P H C
S R F 5 5 V 1 0 P
S R F 5 5 V 1 0 P H C
Intelligent EEPROM with
Contactless Interf ace compliant to
ISO/IEC 15693 or
ISO/IEC 18000-3 Mode 1
Chip Card & S ecurity

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srf55v02p Summary of contents

Page 1

Sh ort Pro duct In fo rmation ™ ...

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Important: For further information please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security, Fax +49 (0)89 / 234-955 9372 E-Mail: security.chipcard.ics@infineon.com Edition 2009-03-31 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG © All ...

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SRF 55VxxP Short Product Information Revision History: Current Version 2009-03-31 Previous Release: 2007-07-02 Page Subjects (major changes since last revision) all editorial changes 5 update of ordering information EAS feature removed Trademarks of Infineon Technologies AG ...

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Features Intelligent EEPROM with Contactless Interface compliant to ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 Contactless Interface • Physical interface and Anticollision compliant to ISO/IEC 15693 – contactless transmission of data and supply energy – data rate ...

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Ordering and packaging information Table 1-1 Ordering Information my-d™ vicinity Type Package SRF 55V02P C wafer unsawn/sawn SRF 55V02P NB NiAu Bumped SRF 55V02P MCC2 P-MCC2-2-1 SRF 55V02P MCC8 P-MCC8-2-3 SRF 55V10P C wafer unsawn/sawn SRF 55V10P NB NiAu ...

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Pin description Figure 1-1 Pin configuration Module Contactless Card - MCC2 (top / bottom view) Figure 1-2 Pin configuration Module Contactless Card - MCC8 (top / bottom view Figure 1-3 Pad configuration die my-d™ vicinity Plain Table 1-3 ...

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Product Family The my-d™ products are designed to meet increased demands for basic security and design flexibility. The my-d™ family of contactless memories supplies the user with different memory sizes and incorporates security features to enable considerable flexibility ...

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General Memory Structure The fundamental structure of my-d™ vicinity and my-d™ proximity products consists of a • User Area for storing user data • Service Area storing the Unique serial number UID and manufacturer data • Administration Area for ...

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Application Segments my-d™ products are optimized for personal and object identification. Please find in the following table some dedicated examples. Table 2-1 my-d™ products overview Product my-d™ vicinity plain SRF 55V02P SRF 55V10P my-d™ vicinity plain HC SRF 55V02P ...

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SRF 55VxxP The my-d™ vicinity products are based on ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 standards for contactless vicinity cards. The my-d™ vicinity focuses on applications with memory demands kbit ...

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Memory Access Organization: Using ISO optional commands the memory is accessed in 4 byte blocks, whereas ISO custom commands support 8 byte page accesses and further my-d™ vicinity commands. Write protection is possible for each page respectively each block. ...

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The User Area stores User Data 125 pages. Data in the plain sector are accessible both via ISO optional and ISO custom commands. The Service Area stores the UID, manufacturer data and configuration data. This information is ...

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Product Versions ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 respectively define procedures to identify VICCs being in the reader field. The UID (Unique IDentification number) is used to perform the anti- collision procedure identifying each VICC. Then a reader ...

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Published by Infineon Technologies ...

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