gs8662dt11bgd-500i GSI Technology, gs8662dt11bgd-500i Datasheet

no-image

gs8662dt11bgd-500i

Manufacturer Part Number
gs8662dt11bgd-500i
Description
72mb Sigmaquad-ii+tm Burst Of 4 Sram
Manufacturer
GSI Technology
Datasheet
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• 2.5 Clock Latency
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• Dual-Range On-Die Termination (ODT) on Data (D), Byte
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid Pin (QVLD) Support
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaQuad-II™ Family Overview
The GS8662DT06/11/20/38BD are built in compliance with
the SigmaQuad-II+ SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 75,497,472-bit (72Mb)
Rev: 1.00 5/2011
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Write (BW), and Clock (K, K) intputs
tKHKH
tKHQV
tKHKH
tKHQV
1.81 ns
0.29ns
-550
0.33 ns
72Mb SigmaQuad-II+
2.0 ns
-500
Parameter Synopsis (x18/x36)
Parameter Synopsis (x8/x9)
Burst of 4 SRAM
0.33 ns
2.0 ns
-500
1/34
0.37ns
2.2 ns
-450
SRAMs. The GS8662DT06/11/20/38BD SigmaQuad SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS8662DT06/11/20/38BD SigmaQuad-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Because Separate I/O SigmaQuad-II+ B4RAMs always
transfer data in four packets, A0 and A1 are internally set to 0
for the first read or write transfer, and automatically
incremented by 1 for the next transfers. Because the LSBs are
tied off internally, the address field of a SigmaQuad-II+ B4
RAM is always two address pins less than the advertised index
depth (e.g., the 4M x 18 has a 1M addressable index).
0.37 ns
2.2 ns
-450
GS8662DT20/38BD-550/500/450/400/350
0.45 ns
2.5 ns
-400
GS8662DT06/11BD-500/450/400/350
TM
0.45 ns
2.5 ns
-400
2.86 ns
0.45 ns
-350
2.86 ns
0.45 ns
-350
© 2011, GSI Technology
550 MHz–350 MHz
1.8 V or 1.5 V I/O
1.8 V V
DD

Related parts for gs8662dt11bgd-500i

gs8662dt11bgd-500i Summary of contents

Page 1

... Parameter Synopsis (x18/x36) -550 -500 -450 2.0 ns 2.2 ns 0.33 ns 0.37 ns Parameter Synopsis (x8/x9) -500 -450 2.0 ns 2.2 ns 0.33 ns 0.37ns 1/34 GS8662DT06/11BD-500/450/400/350 550 MHz–350 MHz TM 1 1.5 V I/O -400 -350 2.5 ns 2.86 ns 0.45 ns 0.45 ns -400 -350 2.5 ns 2.86 ns 0.45 ns 0.45 ns © 2011, GSI Technology 1 ...

Page 2

... D14 Q14 DD DDQ V Q13 D13 DD DDQ DDQ DDQ REF V D12 Q4 DD DDQ V Q12 D3 DD DDQ V D11 Q11 SS DDQ V D10 Q10 TMS © 2011, GSI Technology TDI ...

Page 3

... DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ TMS © 2011, GSI Technology TDI ...

Page 4

... DDQ DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ TMS © 2011, GSI Technology TDI ...

Page 5

... DDQ DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ TMS © 2011, GSI Technology TDI ...

Page 6

... Output — Input — Input — Output — Input — Input Active Low Output — Output — Supply 1.8 V Nominal Supply 1 1.8 V Nominal Supply — Output — Low = Low Impedance Range Input High/Float = High Impedance Range — — © 2011, GSI Technology ...

Page 7

... Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble Write Enable” and “NWx” may be substituted in all the discussion above. Rev: 1.00 5/2011 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 7/34 © 2011, GSI Technology ...

Page 8

... Byte 1 D9–D17 D0–D8 Written Written Beat 2 Beat 3 /2 (i.e., to the switch point of the diff-amp receiver), which could cause DDQ 8/34 D9–D17 Don’t Care Data In Data In Data In Byte 2 Byte 1 Byte 2 D9–D17 D0–D8 D9–D17 Written Unchanged Written Beat 4 © 2011, GSI Technology ...

Page 9

... Read D2 D3 — 9/34 GS8662DT06/11BD-500/450/400/350  K  K  K  n+2½ n+2½) n+3 n+3½ — Hi-Z Hi-Z — — Hi-Z Hi-Z — — — D3 Hi-Z Hi-Z — — — — © 2011, GSI Technology Q K  n+4 — — — — Q3 — Q3 ...

Page 10

... Dx stored if BWn = 0 in 4th data transfer only Write Abort No Dx stored in any of the four data transfers 10/34 GS8662DT06/11BD-500/450/400/350  K  K  n+1 n+1½ n © 2011, GSI Technology D K  n+2½ ...

Page 11

... Don’t Care Don’t Care Data In Don’t Care Data In Don’t Care Data In Don’t Care Data In Data In Data In Data In Data In Data In Data In Data In Data In D9–D17 Don’t Care Don’t Care Data In Data In © 2011, GSI Technology ...

Page 12

... Don’t Care Data In Don’t Care Data In 12/34 GS8662DT06/11BD-500/450/400/350  K  K  n+1 n+1½ n D4–D7 Don’t Care Don’t Care Data In Data In © 2011, GSI Technology D K  n+2½ ...

Page 13

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 State Diagram Power-Up READ WRITE WRITE Write Address WRITE D Count = 2 D Count = D Count + 1 Always Write Address 13/34 Write NOP Load New WRITE D Count = 2 D Count = 0 Always DDR Write WRITE D Count = 1 Increment © 2011, GSI Technology ...

Page 14

... V max.) DDQ +/–100 +/–100 125 –55 to 125 Typ. Max. 1.8 1.9 V — 0.05 — DDQ , followed by signal inputs. The power DD DDQ REF Typ. Max 100 © 2011, GSI Technology Unit Unit Unit C C ...

Page 15

... Airflow = 2 m/s 17.349 9.292 Max Units 0.05 V DDQ V + 0.3 V DDQ V – 0.1 V REF V + 0.3 V DDQ 0 DDQ Max Units 0.08 V DDQ + 0 0.5 V DDQ V – 0.2 V REF – 0 0.5 V DDQ 0.2 V © 2011, GSI Technology  JC (C°/W) 2.310 Notes — 2,3 2,3 Notes — 1,2,3 1,2,3 4,5 4,5 ...

Page 16

... Test conditions OUT OUT CLK IN AC Test Load Diagram RQ = 250 (HSTL I/ REF 50 0.75 V 16/34 20% tKHKH Typ. Max. Unit Conditions 1. V/ns 0. DDQ © 2011, GSI Technology ...

Page 17

... GS8662DT06/11BD-500/450/400/350 Min. – – – –2 uA DDQ Min. Max. Units V /2 – 0. 0.12 V DDQ DDQ V /2 – 0. 0.12 V DDQ DDQ V – 0 DDQ DDQ Vss 0.2 V © 2011, GSI Technology Max Notes ...

Page 18

... GSI Technology Notes ...

Page 19

... Min KHKH 270 mA 280 mA 260 mA 270 mA 245 mA 255 mA 240 mA 250 mA – 0 19/34 GS8662DT06/11BD-500/450/400/350 -400 -350 0° 0° –40° –40° –40° 85°C 70°C 85°C 70°C 85°C © 2011, GSI Technology Notes ...

Page 20

... DD © 2011, GSI Technology cycle cycle ns ns cycle ...

Page 21

... DD © 2011, GSI Technology cycle cycle ns ns cycle ...

Page 22

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 Read NOP CQ-Based Timing Diagram READ A1 WRITE NOOP A1 tKHIX tIVKH Q0 Q0+1 tCQLQV tQVLD tCQHQV tCQLQV tCQHQV 22/34 GS8662DT06/11BD-500/450/400/350 NOOP NOOP Q0+2 Q0+3 Q1 Q1+1 Q1+2 tCQLQX tCQHQX tCQLQX tCQHQX © 2011, GSI Technology NOOP Q1+3 tQVLD ...

Page 23

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 Read-Write CQ-Based Timing Diagram READ A2 WRITE tIVKH tKHIX tIVKH tKHIX tDVKH tKHDX D1 D1+1 D1+2 D1+3 Q0 Q0+1 tCQLQV tQVLD tCQHQV 23/34 GS8662DT06/11BD-500/450/400/350 NOOP NOOP tIVKH tKHIX tDVKH tKHDX D3 D3+1 D3+2 D3+3 Q0+2 Q0+3 Q2 Q2+1 Q2+2 tCQLQX tCQHQV tCQHQX tCQHQX tCQLQV tCQLQX © 2011, GSI Technology NOOP Q2+3 tQVLD ...

Page 24

... A0 R tKHIX tIVKH W BWx D D0 Rev: 1.00 5/2011 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 Write NOP Timing Diagram Read No-op Write B Read No-op A1 tKHIX tIVKH tKHIX tIVKH tIVKH tKHDX tDVKH D1 D0+1 D0+2 D0+3 24/34 GS8662DT06/11BD-500/450/400/350 NO-OP NO-OP tKHIX D1+1 D1+2 D1+3 © 2011, GSI Technology NO-OP ...

Page 25

... Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Rev: 1.00 5/2011 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 TDO should be left unconnected Description 25/34 . The JTAG output DD © 2011, GSI Technology ...

Page 26

... Control Signals Test Access Port (TAP) Controller See BSDL Model 26/34 GS8662DT06/11BD-500/450/400/350 · · TDO GSI Technology JEDEC Vendor ID Code © 2011, GSI Technology 0 1 ...

Page 27

... JTAG Tap Controller State Diagram 1 1 Select Capture DR 0 Shift Exit1 DR 0 Pause Exit2 Update 27/34 GS8662DT06/11BD-500/450/400/350 1 Select Capture IR 0 Shift Exit1 IR 0 Pause Exit2 Update © 2011, GSI Technology ...

Page 28

... If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high- Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. Rev: 1.00 5/2011 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 28/34 © 2011, GSI Technology ...

Page 29

... DDn supply. DD 29/34 GS8662DT06/11BD-500/450/400/350 Notes Min. Max. Unit 0 –0 –300 100 uA – –1 V – 0.2 V — DD 0.2 V — V – 0.1 V — DD 0.1 V — © 2011, GSI Technology Notes ...

Page 30

... JTAG Port Timing Diagram tTKH tTKH tTKL tTKL tTH tTS tTH tTS tTKQ tTH tTS Min Max Unit 50 — ns — — — — — ns 30/34 JTAG Port AC Test Load 50 * 30pF Distributed Test Jig Capacitance © 2011, GSI Technology ...

Page 31

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 BOTTOM VIEW A1 CORNER Ø0. Ø0. Ø0.40~0.60 (165x 1.0 10.0 13±0.05 B 0.20(4x) 31/ 1.0 © 2011, GSI Technology ...

Page 32

... GS8662DT11BD-350I GS8662DT11BGD-500 GS8662DT11BGD-450 GS8662DT11BGD-400 GS8662DT11BGD-350 GS8662DT11BGD-500I GS8662DT11BGD-450I GS8662DT11BGD-400I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8662DT38BD-400T Commercial Temperature Range Industrial Temperature Range. ...

Page 33

... Ordering Information GSI SigmaQuad-II+ SRAM 1 Org Part Number GS8662DT11BGD-350I GS8662DT20BD-550 GS8662DT20BD-500 GS8662DT20BD-450 GS8662DT20BD-400 GS8662DT20BD-350 GS8662DT20BD-550I GS8662DT20BD-500I GS8662DT20BD-450I GS8662DT20BD-400I GS8662DT20BD-350I GS8662DT20BGD-550 GS8662DT20BGD-500 GS8662DT20BGD-450 GS8662DT20BGD-400 GS8662DT20BGD-350 ...

Page 34

... RoHS-compliant 165-bump BGA SigmaQuad-II+ SRAM RoHS-compliant 165-bump BGA SigmaQuad-II+ SRAM RoHS-compliant 165-bump BGA SigmaQuad-II+ SRAM RoHS-compliant 165-bump BGA Format/Content • Creation of datasheet 34/34 Speed T J (MHz) 550 C 500 C 450 C 400 C 350 C 550 I 500 I 450 I 400 I 350 I Description of changes © 2011, GSI Technology 2 ...

Related keywords